• Transactions of the Korean Society of Mechanical Engineers B
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• v.38 no.12
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• pp.1051-1056
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• 2014

After hot rolling, a high-temperature steel plate with a temperature higher than $800^{\circ}C$ is rapidly cooled by multiple circular water jets. In this cooling process, because the temperature of the steel plate is much higher than the boiling point of the cooling water, film-boiling heat transfer occurs and a very thin steam layer forms between the plate surface and the cooling water. The steam layer acts as a thermal resistance that prevents heat transfer between the cooling water and the steel plate. In addition to the film-boiling heat transfer, complex physical phenomena such as the free-surface flow of residual water that accumulated on the material and the material's high-speed motion also occur in the cooling process. In this study, the simultaneous cooling process of the upper and lower sides of a running hot steel strip is investigated using a three-dimensional numerical model and the cooling performances and characteristics of the upper-side cooling and lower-side cooling are compared.

• Solar Energy
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• v.7 no.2
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• pp.22-29
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• 1987

This paper dealed with thickness variation of bottom heat sotrage zone due to salinity and flow rate of extration hot brine in small test solar pond (0.5m wide, 0.5m high, 1.0m long). Testing apparatus and situation were follows: 7.1 cm of height of suction diffuser and 1.8cm of height of discharge diffuser above the test pond respectively, 0.3cm of slot size of suction diffuser, 1.0cm of slot size of discharge diffuser, 47cm of length of the slot; heating of hot water ($75^{\circ}C$) through separated hot water tank, discharge of the brine into storage zone through discharge diffuser, the extration of the brine through suction diffuser, circulation of the extracted brine through a heat exchanger (cooler). Following results were obtained through the experiments. 1. In small test solar pond, the typical three zone which showed up in real solar pond were established. 2. Richardson Number was used more effectively to confirm hydrodynamic stability of the stratified flow. 3. The thickness of non convective layer had a great effect on the heat storage of the bottom convective layer, then the temperature of bottom convective layer had a relation to that of upper convective layer. 4. Optimum operating condition in the test pond was on 10%-15% of salt concentration and $0.05m^3/hr$ of flow rate of extraction hot brine. 5. Following thickness of 3 zones were available to obtain under optimum operation condition: o bottom storage zone: $30%{\pm}10%$ of total pond depth o non-convective zone: $40%{\pm}10%$ of total pond depth o Upper surface zone: $20%{\pm}10%$ of total pond depth.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP Process, deionized water (DIW) pressure, purified $N_2$ (P$N_2$) gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.2
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• pp.162-168
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• 1997

Digital variable structure controller(DVSC) is implemented to control the temperature for the hot water heating circulating pump control system. For the DVSC, a control algorithm is suggested, which using a nonlinear sliding surface and a PID sliding surface outside and inside of steady state error boundary layer, respectively. Smith predictor algorithm is used for the compensation of long dead time. The DVSC of the suggested algorithm yields improved control performance compared with the one of existing algorithm. The system responses with the suggested DVSC shows good responses without overshoot and steady state error inspite of heating load change. By decreasing sampling time, dead time and rise time are increasing, and system output noise by flow dynamics is amplified.

• Proceedings of the Korean Nuclear Society Conference
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• 1998.10a
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• pp.360-360
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• 1998

• Proceedings of the Korean Nuclear Society Conference
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• 1999.10a
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• pp.319.2-319
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• 1999

• Economic and Environmental Geology
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• v.50 no.2
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• pp.159-170
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• 2017

The temporal and spatial temperature distribution of the heat storage mortar made of porous feldspar was measured and the thermal properties and electricity consumption were analyzed. For the experiment, two real size chambers (control model and test model) with hot water pipes were constructed. Two large scale models with hot water pipes were constructed. The surface temperature change of the heat storage layer was remotely monitored during the heating and cooling process using infrared thermal imaging camera and temperature sensor. The temperature increased from $20^{\circ}C$ to $30^{\circ}C$ under the heating condition. The temperature of the heat storage layer of the test model was $2.0-3.5^{\circ}C$ higher than the control model and the time to reach the target temperature was shortened. As the distance from the hot water pipe increased, the temperature gap increased from $4.0^{\circ}C$ to $4.8^{\circ}C$. The power consumed until the surface temperature of the heat storage layer reached $30^{\circ}C$ was 2.2 times that of the control model. From the heating experiment, the stepwise temperature and electricity consumption were calculated, and the electricity consumption of the heat storage layer of the test model was reduced by 66%. In the cooling experiment, the surface temperature of the heat storage layer of the test model was maintained $2^{\circ}C$ higher than that of the control model. The heat storage effect of the porous feldspar mortar was confirmed by the temperature experiment. With considering that the time to reheat the heat storage layer is extended, the energy efficiency will be increased.

• Korean Journal of Medicinal Crop Science
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• v.13 no.2
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• pp.110-114
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• 2005

Extracts from sawdust of Pinus densiflora were showed antifungal activity against Lentinula edodes. It was extracted by hot water and then successively extracted by n-hexane, ethyl acetate, and methanol. The yields of the n-hexane-soluble, ethyl acetatesoluble, methanol-soluble and methanol-insoluble fractions of water extracts were 8.2%, 10.6%, 32.0%, and 49.2%, respectively. The ethyl acetate-soluble fraction showed the greatest antifungal activity against L. edodes: 41.5% inhibition at 1,000 ppm. However, there were not significant differences of antifungal activities between n-hexane-soluble fraction and methanol-soluble fraction at a concentration of 1,000 ppm. The hot water extracts showed 23.5% of antifungal activity against L. edodes at a concentration of 1000 ppm. The four antifungal compounds were separated from ethyl acetate fraction by thin layer chromatography.

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.89-89
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• 2009

높은 소수반송자 수명(life-time)을 가지는 고품위 실리콘 기판은 고효율 실리콘 이종접합 태양전지 제작을 위한 중요 요소 기술 중 하나이다. 본 연구에서는 n-type c-Si 기판을 이용한 고효율 실리콘 이종접합 태양전지제작을 위해 hot water oxidation(HWO) 공정을 이용하여 고품위 실리콘 기판을 제작하였다. 실리콘 기판의 특성 분석은 Qusi-steady state photoconductance (QSSPC)를 이용하여 소수반송자 수명을 측정하였으며, 기판의 면저항 및 wetting angle을 측정하여 공정에 따른 특성변화를 분석하였다. Saw damage etching 된 기판을 웨이퍼 표면으로부터 particle, 금속 불순물, 유기물 등의 오염을 제거하기 위해 $60{\sim}85^{\circ}C$로 가열된 Ammonia수, 과산화수소수($NH_4OH/H_2O_2/H_2O$), 염산 과산화수소수($HCL/H_2O_2/H_2O$) 및 실온 희석불산(DHF) 중에 기판을 각각 10분 정도씩 침적하여, 각각의 약액 처리 후에 매회 10분 정도씩 순수(DI water)에서 rinse하여 RCA 세정을 진행한 후 HWO 공정을 통해 기판 표면에 얇은 산화막 을 형성시켜 패시베이션 해주었다. HF를 이용하여 자연산화막을 제거시 HWO 공정을 거친 기판은 매끄러운 표면과 패시베이션 영향으로 기판의 소수 반송자 수명이 증가하며, 태양전지 제작시 접촉저항을 감소시켜 효율을 증가 시킬수 있다. HWO 공정은 반응조 안의 DI water 온도와 반응 시간에 따라 life-time을 측정하여 진행하였으며, 이후 PE-CVD법으로 증착된 a-Si:H layer 및 투명전도 산화막, 금속전극을 증착하여 실리콘 이종접합 태양전지를 제작하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.812-816
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• 2000

It is very important to understand the correlation of between inter dielectric(ILD) CMP process and various facility factors supplied to equipment to equipment system. In this paper, the correlation between the various facility factors supplied to CMP equipment system and ILD-CMP process was studied. To prevent the partial over-polishing(edge hot-spot) generated in the wafer edge area during polishing, we analyze various facilities supplied at supply system. With facility shortage of D.I water(DIW) pressure, we introduced an adding purified $N_2$(P$N_2$)gas in polishing head cleaning station for increasing a cleaning effect. DIW pressure and P$N_2$gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. We estimated two factors (DIW pressure and P$N_2$gas) for the improvement of CMP process. Especially, we obtained a uniform planarity in patterned wafer and prohibited more than 90% wafer edge over-polishing. In this study, we acknowledged that facility factors supplied to equipment system played an important role in ILD-CMP process.