• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.179-188
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• 2003

The objective of our study is to investigate the micro fabric ability by conventional metal forming processes. In the present investigation, micro hole punching was studied. We tried to control punching process at the micro level and scaled down the standard blanking condition for $25{\mu}m$ hole fabrication. To accommodate this, tungsten carbide tooling sets and micro punching press were carefully designed and assembled meeting accuracy requirements for $25{\mu}m$ hole punching. With our developments, 100, 50, and $25{\mu}m$ holes were successfully made on metal foils such as brass and stainless steel of 100, 50, and $25{\mu}m$ in thickness, respectively, and hole sizes and shapes were measured and analyzed to investigate fabrication accuracy. Shear behavior during micro punching was also discussed. Our study showed that the conventional punching process could produce high quality holes down to $25{\mu}m$.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.160-163
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• 2002

Micro via hole Fabrication is studied by means of minimizing method to circuit size as many electric products developed to portable and minimize. Most of currently micro via hole fabrication using laser is that fabricate insulator layer using CO2 Laser after Cu layer by etching, or fabricate insulator layer using IR after trepanning Cu by UV. In this paper, it was performed that a metal layer and insulator layer were worked upon only one UV laser, and increase to processing speed by experiment.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.4
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• pp.18-22
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• 2006

Although many efforts have been made in making nanometer-sized holes, there is still a major challenge in fabricating individual single-digit nanometer holes in a more controllable way for different materials, size distribution and hole shapes. In this paper we describe our efforts to use a top down approach in nanofabrication method to make single-digit nanoholes. There are three major steps towards the fabrication of a single-digit nanohole. 1) Preparing the freestanding thin film by epitaxial deposition and electrochemical etching. 2) Making sub-micro holes ($0.2{\mu}\;to\;0.02{\mu}$) by focused ion beam (FIB), electron beam (EB), atomic force microscope (AFM), and others methods. 3) Reducing the hole size to less than 10 nm by epitaxial deposition, FIB or EB induced deposition and micro coating. Preliminary work has been done on thin films (30 nm in thickness) preparation, sub-micron hole fabrication, and E-beam induced deposition. The results are very promising.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.1
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• pp.16-22
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• 1993

A via-hole process for reproducible and reliable GaAs MMIC fabrication is described. The via-hole etching process consists of two step dry etching. During the first etching step a BC $I_{3}$/C $I_{2}$/Ar gas mixure is used to achieve high etch rate and small lateral etching. In the second etching step. CC $L_{2}$ $F_{2}$ gas is used to achieve selective etching of the GaAs substrate with respect to the front side metal layer. Via holes are formed from the backside of a 100$\mu$m thick GaAs substrate that has been evaporated initially with 500.angs. thick chromium and subsequently a 2000.angs. thick gold layer. The fabricated via holes are electroplated with gold (~20$\mu$m thick) to form via connections. The results show that established via-hole process is satisfactory for GaAs MMIC fabrication.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.89-92
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• 2001

In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.89-92
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• 2001

In this paper, we studied on drilling a microscopic hole of glass using electro-chemical discharge methode. In this research, we fabricated a electro-chemical discharge machine for drilling glass hole. The used parameters to get a fine microscopic hole are the concentration of NaOH solution from 5wt% to 50wt%, the supply voltage from 10V to 40V and the fabricating time from 5 second to 50 second. Also, we used a 0.16mm glass plate. We learned from our experiment that, the fabrication most efficient when supply voltage is 25V-30V and concentration of NaOH solution 35wt% or less.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.3
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• pp.227-231
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• 2013

Electrodeionization is a hybrid separation process of electrodialysis and ion exchange to produce high purity water under electric field. This article provides a fabrication result of hole patterned metal electrode for elecrodeionization system. The hole patterns have been fabricated by nanosphere lithography (NSL). The technique utilizes the self-assembled nanospheres as lens-mask patterns and collimated laser beam source. The hole patterns have a periodic array structure. The images of hole pattern on metal electrode prepared were observed by SEM. We believe that the periodic hole patterned metal electrode structure is a useful device applicable for metal mat electrode in electrodeionization system.

• International conference on construction engineering and project management
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• 2009.05a
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• pp.1053-1059
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• 2009

Construction system modeling can enhance work performance by following the behaviors of a system. System behaviors may originate from physical aspects of a system, namely operation level variables, or from non-physical aspects of a system known as context level variables. However, construction system modelers usually focus on only one type of system variable (i.e., operation level or context level) which can lead to less accurate results. Hybrid modeling with System Dynamics (SD) and Discrete Event Simulation (DES) is one of the approaches that has been utilized to address this issue. In this research, an SD-DES hybrid model of a steel fabrication shop is developed, and the benefits of capturing context level variables together with operation level variables in the model are discussed.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.9-14
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• 2006

In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.55-58
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• 2018

Low-cost and large-scale fabrication method of nanohole array, which comprises nanoscale voids separated by a few tens to a few hundreds of nanometers, has opened up new possibilities in biomolecular sensing as well as novel frontier optical devices. One of the key aspects of the nanohole array research is how to control the hole size following each specific needs of the hole structure. Here, we report the extensive study on the fine control of the hole size within the range of 500-2500 nm via surface-catalyzed chemical deposition. The initial hole structures were prepared via conventional photo-lithography, and the hole size was decreased to a designed value through the surface-catalyzed chemical reduction of the gold ion on the predefined hole surfaces, by simple dipping of the hole array device into the aqueous solution of gold chloride and hydroxylamine. The final hole size was controlled by adjusting reaction time, and the optimal experimental condition was obtained by doing a series of characterization experiments. The characterization of size-controlled hole array was systematically examined on the image results of optical microscopy, field emission scanning electron microscopy(FESEM), atomic-force microscopy(AFM), and total internal reflection microscopy.