Journal of the Korean Institute of Telematics and Electronics A (전자공학회논문지A)
- Volume 30A Issue 1
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- Pages.16-22
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- 1993
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- 1016-135X(pISSN)
A Via-Hole Process for GaAs MMIC's using Two-Step Dry Etching
2단계 건식식각에 의한 GaAs Via-Hole 형성 공정
Abstract
A via-hole process for reproducible and reliable GaAs MMIC fabrication is described. The via-hole etching process consists of two step dry etching. During the first etching step a BC
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