• Journal of the Korean Society for Heat Treatment
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• v.12 no.3
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• pp.215-220
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• 1999

Rotary bending fatigue tests were carried out to investigate the artificial defect sensitivity of fatigue limit in annealed and austempered ductile irons. Artificial defect(hole, diameter${\leq}0.4mm$) machined on specimen surface did not bring about an obvious reduction of fatigue limit in austempered ductile iron as compared with annealed. As a result of investigation on $\sqrt{area}$ c which is the critical artificial defect size. $\sqrt{area}$ c of austempered ductile iron is larger than that of annealed. This means that the crack initiation at artificial defect in austempered ductile iron is more difficult in comparison with annealed. In case that the $\sqrt{area}$ c of artificial defect and graphite nodule are same, the rate of crack initiation for graphite nodule is higher than that of artificial defect.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

• Transactions on Electrical and Electronic Materials
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• v.5 no.4
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• pp.143-147
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• 2004

Surface defects and bulk defects on SOI wafers are studied. Two new metrologies have been proposed to characterize surface and bulk defects in epitaxial layer transfer (ELTRAN) wafers. They included the following: i) laser scattering particle counter and coordinated atomic force microscopy (AFM) and Cu-decoration for defect isolation and ii) cross-sectional transmission electron microscope (TEM) foil preparation using focused ion beam (FIB) and TEM investigation for defect morphology observation. The size of defect is 7.29 urn by AFM analysis, the density of defect is 0.36 /cm$^2$ at as-direct surface oxide defect (DSOD), 2.52 /cm$^2$ at ox-DSOD. A hole was formed locally without either the silicon or the buried oxide layer (Square Defect) in surface defect. Most of surface defects in ELTRAN wafers originate from particle on the porous silicon.

• 유체기계공업학회:학술대회논문집
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• 2006.08a
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• pp.345-348
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• 2006

In sheet metal forming process using press and draw die some defect can be made because of the high pressure of air pocket between draw die and the product. The purpose of this study is to develop a program to decide an optimal combination of air vent hole size and number to prevent those defect on product. The air inside air pocket is considered as ideal gas and the compression and expansion is assumed as isentropic process. The mass flow is computed in two flow condition: unchocked and chocked condition. The present computation obtains required cross-sectional area of air vent hole for not exceeding the user specified pressure such as the pressure for yielding strength of the product or the pressure for unchocked flow. To validate the program the present results are compared with the results of other researchers and commercial CFD code.

• Journal of the Korean Wood Science and Technology
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• v.44 no.1
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• pp.1-8
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• 2016

Non-destructive ultrasonic testing was applied to evaluate the performance of wood deck material with hole as artificial defect. Ultrasonic velocities and modulus of elasticity were measured according to different diameters and numbers of holes, and comparative analysis to each data were done. From the results, ultrasonic velocities and modulus of elasticity decreased with an increase in the hole size and showed a negative linear correlation with the size of hole, respectively. As the hole size increased, ultrasonic velocities decreased, but their difference was small in the case of the hole size under 15 mm. Also, ultrasonic velocities and modulus of elasticity decreased with increasing the number of holes and showed a strong negative linear correlation to the number of holes. As the number of holes increased, ultrasonic velocities decreased to 3.5%, but modulus of elasticity decreased to 27%. Therefore, the number of holes showed greater influence to modulus of elasticity than ultrasonic velocity. Overall, the size and number of holes influenced to ultrasonic velocity and modulus of elasticity, and their influence will be greater as the size and number of holes increases. These results suggested that several ultrasonic parameters rather than a single ultrasonic velocity should be applied to detect small defects in wood decking materials.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Korean Society for Nondestructive Testing
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• v.25 no.6
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• pp.483-486
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• 2005

The relationship between the EFBH (Equivalent Flat-Bottom Hole) size measured by non-destructive method and the actual size by destructive method in many rotors manufactured at Doosan Heavy Industries & Construction Co. Ltd. was investigated. In this investigation. "the Master Curve" compensating the differences between UT reported sizes and actual sizes of defects in our rotor forgings were obtainable. The applicability of this "Master Curve" as a way of calculating the actual defect size was also investigated. For the evaluation of rotor forgings, it is expected that this "Master Curve" may be used to determine the accurate actual sizes of defects.

• Journal of Mechanical Science and Technology
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• v.14 no.10
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• pp.1021-1027
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• 2000

In this study, fatigue tests were performed to examine the effects of micro drill hole on fatigue limit of as cast and austempered ductile cast iron (ADI) using the rotary bending fatigue tester. As results, micro drill holes ($diameter{\leq}0.4mm$) did not influence the fatigue limit of ADI, compared to annealed ductile cast iron; the critical defect size of crack initiation, in ADI was larger than as cast. If the ${\sqrt{area}}$ of micro drill hole and graphite nodule in ADI are comparable, crack initiates at the graphite nodule. When the ruggedness developes through austempering treatment process, microstructure on crack initiation at micro drill hole is tougher than that of as cast ductile cast iron.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.23 no.11 s.170
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• pp.1922-1928
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• 1999

Rotary bending fatigue tests were carried out to investigate the influence of artificial defects on fatigue limit in annealed and austempered ductile iron. Obtained main results are as follows : (1) Artificial defect(micro hole type, dia.<0.4 mm) on specimen surface did not bring about a obvious reduction of fatigue limit in austempered ductile iron(ADI) as compared with annealed ductile iron. (2) According to the investigation of $\sqrt{area}_c$ which is the critical defect size to crack initiation at artificial defect, $\sqrt{area}_c$ of ADI is larger than that of annealed ductile iron. This shows that the situation of crack initiation at artificial defect in ADI is more difficult in comparison with annealed ductile iron. (3) One of the reasons for the low rate of crack initiation from artificial defect in ADI is that the resistance of matrix to crack initiation is higher than that of annealed ductile iron. (4) In case that the $\sqrt{area}$ of artificial defect and graphite nodule is the same, the rate of crack initiation from graphite nodule is higher than that from artificial defect. This reason is that the serious ruggedness around graphite nodule is formed by austempering treatment.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.3
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• pp.555-564
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• 1994

This study has been made to investigate the stress distribution around defects and inclusions that behave as stress concentrators. The stress distribution and interation effects around defects and inclusions was analyzed using Finite Element Method. The results are as follows;(1) Maximum stress point in case of $E_I/E_M>1$($E_I$:elasticity modulus forthe inclusion, $E_M$/:elasticity modulus for the base material)is the vertical point with respect to force direction and in case of $E_I/E_M<1$ it is the parallel point along the hole edge. (2) Interaction effects of ${\sigma}_y$ for the inclusion side is larger than the defect side when the interval between inclusion and defect is near. (3) stress interation effects is large if the difference of ${\sigma}_y$ is small and it is small if the difference of ${\sigma}_y$ is large for the case that the interval between inclusion and defect whose size and property are different is near.