• 제목/요약/키워드: High-k dielectrics

검색결과 154건 처리시간 0.034초

Ca 첨가에 의한 $BaTiO_3$의 환원억제기구 (The Role of Calcium as a Reduction Inhibitor in $BaTiO_3$)

  • 황연;김윤호;박순자
    • 한국세라믹학회지
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    • 제27권6호
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    • pp.741-746
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    • 1990
  • Dielectrics which do not lose their high insulation resistance in reducing atmosphere are necessary for multilayer ceramic capacitors with Ni internal electrode. In this study we investigated the Ca ion site occupancy in A-site excess Ca-doped BaTiO3 by measuring the insulation resistance, lattice constant and Curie temperature. Its Curie temperature, which was lower than that of the pure BaTiO3, was more lowered by sintering in reducing atmosphere. Lattice constnat of c-axis decreased and that of a-axis increased, suggesting substitution of Ca ions for Ti ions. Hence CaTi" acts as an acceptor to maintain high insulation resistance.ance.

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발전소에서 운전 중인 고전력 케이블의 절연저항의 변화를 감시하는 장치의 개발 (Development of Equipment Measuring Insulation Resistance of High-Power Cables in Operation at Power Station)

  • 엄기홍;김보경
    • 한국인터넷방송통신학회논문지
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    • 제16권4호
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    • pp.159-164
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    • 2016
  • 급증하고 있는 수요에 따른 고전력을 생산하기 위하여 발전소에서는 이에 대응하는 시설장비를 운영해야 한다. 규모는 점차 커지고, 기능이 다양해지고 있다. 발전소에서 불의가 사고가 발생하면 장비가 지장을 받게 되고, 막대한 경제적 손실 및 장애를 초래하게 된다. 사고 발생의 원인 중의 하나로서 케이블의 두 도체를 전기적으로 분리시키는 유전체의 기능이 약화되는 것이다. 케이블에 의한 사고를 미연에 방지하기 위하여 동작 상태를 감시 확인하여야 한다. 우리는 절연저항을 측정하기 위한 장비를 개발하여 서부발전(주)의 현장에 설치하여 운용 중이다. 변압기의 2차 측 와이(Y) 결선으로 연결된 모선은 생산된 전기를 외부 장치에 전송한다. 우리가 개발한 장비는 모선과 on/off 되는 케이블의 절연 저항을 측정하는 장비이다. 우리는 이 논문에서 하드웨어 구성을 위주로 우리가 개발한 장비를 소개한다.

차세대 비휘발성 메모리에 사용되는 High-k 절연막의 터널링 특성 (Tunneling Properties in High-k Insulators with Engineered Tunnel Barrier for Nonvolatile Memory)

  • 오세만;정명호;박군호;김관수;정홍배;이영희;조원주
    • 한국전기전자재료학회논문지
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    • 제22권6호
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    • pp.466-468
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    • 2009
  • The metal-insulator-silicon (MIS) capacitors with $SiO_2$ and high-k dielectrics ($HfO_2$, $Al_2O_3$) were fabricated, and the current-voltage characteristics were investigated. Especially, an effective barrier height between metal gate and dielectric was extracted by using Fowler-Nordheim (FN) plot and Direct Tunneling (DT) plot of quantum mechanical(QM) modeling. The calculated barrier heights of thermal $SiO_2$, ALD $SiO_2$, $HfO_2$ and $Al_2O_3$ are 3.35 eV, 0.6 eV, 1.75 eV, and 2.65 eV, respectively. Therefore, the performance of non-volatile memory devices can be improved by using engineered tunnel barrier which is considered effective barrier height of high-k materials.

A Compact Quantum Model for Cylindrical Surrounding Gate MOSFETs using High-k Dielectrics

  • Vimala, P.;Balamurugan, N.B.
    • Journal of Electrical Engineering and Technology
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    • 제9권2호
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    • pp.649-654
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    • 2014
  • In this paper, an analytical model for Surrounding Gate (SG) metal-oxide- semiconductor field effect transistors (MOSFETs) considering quantum effects is presented. To achieve this goal, we have used variational approach for solving the Poission and Schrodinger equations. This model is developed to provide an analytical expression for inversion charge distribution function for all regions of device operation. This expression is used to calculate the other important parameters like inversion charge density, threshold voltage, drain current and gate capacitance. The calculated expressions for the above parameters are simple and accurate. This paper also focuses on the gate tunneling issue associated with high dielectric constant. The validity of this model was checked for the devices with different dimensions and bias voltages. The calculated results are compared with the simulation results and they show good agreement.

$Ta/TaN_x$ Metal Gate Electrodes for Advanced CMOS Devices

  • Lee, S. J.;D. L. Kwong
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제2권3호
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    • pp.180-184
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    • 2002
  • In this paper, the electrical properties of PVD Ta and $TaN_x$ gate electrodes on $SiO_2$ and their thermal stabilities are investigated. The results show that the work functions of $TaN_x$ gate electrode are modified by the amount of N, which is controlled by the flow rate of $N_2$during reactive sputtering process. The thermal stability of Ta and $TaN_x$ with RTO-grown $SiO_2$ gate dielectrics is examined by changes in equivalent oxide thickness (EOT), flat-band voltage ($V_{FB}$), and leakage current after post-metallization anneal at high temperature in $N_2$ambient. For a Ta gate electrode, the observed decrease in EOT and leakage current is due to the formation of a Ta-incorporated high-K layer during the high temperature annealing. Less change in EOT and leakage current is observed for $TaN_x$ gate electrode. It is also shown that the frequency dispersion and hysteresis of high frequency CV curves are improved significantly by a post-metallization anneal.

평면형 대기압 유전장벽방전장치의 제작 및 동작특성분석 (Fabrication of Atmospheric Coplanar Dielectric Barrier Discharge and Analysis of its Driving Characteristics)

  • 이기융;김동현;이호준
    • 전기학회논문지
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    • 제63권1호
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    • pp.80-84
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    • 2014
  • The discharge characteristics of Surface Dielectric Barrier Discharge (SDBD) reactor are investigated to find optimal driving condition with adjusting various parameter. When the high voltage with sine wave form is applied to SDBD source, successive pulsed current waveforms are observed owing to multiple ignitions through the long discharge channel and wall charge accumulation on the dielectric surface. The discharge voltage, total charge between dielectrics, mean energy and power are calculated from measured current and voltage according to electrode gap and dielectric thickness. Discharge mode transition from filamentary to diffusive glow is observed for narrow gap and high applied voltage case. However, when the diffusive discharge is occurred with high applied voltage, the actual firing voltage is always lower than that with low driving voltage. The $Si_3N_4$, $MgF_2$, $Al_2O_3$ and $TiO_2$ are considered for dielectric protection and high secondary electron emission coefficient. SDBD with $MgF_2$ shows the lowest breakdown voltage. $MgF_2$ thin film is proposed as a protection layer for low voltage atmospheric dielectric barrier discharge devices.

Engineered tunnel barrier를 갖는 SONOS 소자에서의 소거 속도 향상 (Erasing characteristic improvement in SONOS type with engineered tunnel barrier)

  • 박군호;유희욱;오세만;김민수;정종완;이영희;정홍배;조원주
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2009년도 하계학술대회 논문집
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    • pp.97-98
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    • 2009
  • Tunneling barrier engineered charge trap flash (TBE-CTF) memory capacitor were fabricated using the tunneling barrier engineering technique. Variable oxide thickness (VARIOT) barrier and CRESTED barrier consisting of thin $SiO_2$ and $Si_3N_4$ dielectrics layers were used as engineered tunneling barrier. The charge trapping characteristic with different metal gates are also investigated. A larger memory window was achieved from the TBE-CTF memory with high workfunction metal gate.

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ZnO-based thin-film transistor inverters using top and bottom gate structures

  • Oh, Min-Suk;Kim, Yong-Hoon;Park, Sung-Kyu;Han, Jeong-In;Lee, Ki-Moon;Im, Seong-Il;Lee, Byoung-H.;Sung, Myung-M.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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    • pp.461-463
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    • 2009
  • We report on the fabrication of ZnO-based thin-film transistor (TFT) inverters with top and bottom gate structures with $Al_2O_3$ dielectrics grown by atomic layer deposition (ALD). Since the top gate ZnO-based TFT showed somewhat lower field effect mobility than that of the bottom gate device, our ZnO-based TFT inverters were designed with identical dimensions for both channels. This TFT inverter device demonstrated an high voltage gain at a low supply voltage of 5 V and clear dynamic behavior.

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ICBE 기법에 의한 저온 탄탈륨 산화막의 형성에 관한 연구 (A Study on the Growth of Tantalum Oxide Films with Low Temperature by ICBE Technique)

  • 강호철;황상준;배원일;성만영;이동회;박성희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1994년도 하계학술대회 논문집 C
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    • pp.1463-1465
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    • 1994
  • The electrical characteristics of $Al/Ta_2O_5/Si$ metal-oxide-semiconductor (MOS) capacitors were studied. $Ta_2O_5$ films on p-type silicon had been prepared by ionized cluster beam epitaxy technique (ICBE). This $Ta_2O_5$ films have low leakage current, high breakdown strength and low flat band shift. In this research, a single crystalline cpitaxial film of $Ta_2O_5$ has been grown on p-Si wafer using an ICBE technique. The native oxide layer ($SiO_2$) on the silicon substrate was removed below $500^{\circ}C$ by use of an accelerated arsenic ion beam, instead of a high temperature deposition. $Ta_2O_5$ films formed by ICBE technique can be received considerable attention for applications to coupling capacitors, gate dielectrics in MOS devices, and memory storage capacitor insulator because of their high dielectric constants above 20 and low temperature process.

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Organic Thin-Film Transistors with Screen Printed Silver Source/Drain Electrodes

  • Kim, Sam-Soo;Kim, Min-Soo;Choi, Gyu-Seok;Kim, Heon-Gon;Kim, Yong-Bae;Lee, Dong-Gu;Roh, Jae-Seong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1305-1307
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    • 2007
  • We show that the electrical properties of organic thinfilm transistors(OTFTs) can be enhanced by controlling the morphology of interface between screen printed electrodes and gate dielectrics. Modified surface of the insulator layer($SiO_2$) affect on the interface energy of electrode on $SiO_2$ layer. Contact angle measurement and FT-IR spectrum shows that the interface is properly modified. OTFTs device with high efficiency has been realized through modification of interface layer.

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