• The Transactions of the Korean Institute of Power Electronics
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• v.18 no.3
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• pp.247-255
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• 2013

In this paper, a soft switching DC-DC converter for AC module type photovoltaic (PV) module integrated converter is proposed. A push-pull converter is suitable for a low voltage PV AC module system because the step-up ratio of a high frequency transformer is high and the number of primary side switches is relatively small. However, the conventional push-pull converters do not have high efficiency because of high switching losses by hard switching and transformer losses (copper and iron losses) by high turns-ratio of the transformer. In the proposed converter, primary side switches are turned on at zero voltage switching (ZCS) condition and turned off at zero current switching (ZVS) condition through parallel resonance between secondary leakage inductance of the transformer and a resonant capacitor. Therefore the proposed push-pull converter decreases the switching loss using soft switching of the primary switches. Also, the turns-ratio of the transformer can be reduced by half using a voltage-doubler of secondary side. The theoretical analysis of the proposed converter is verified by simulation and experimental results.

• 한국태양에너지학회:학술대회논문집
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• 2008.11a
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• pp.42-47
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• 2008

In this paper, we analyze the electrical characteristics of PV depending on distance among solar cells before and after lamination process. From the result, the PV module's maximum power increases about 3.37% when solar cells's distance is 10mm. And the maximum power increases up to 8.42% when solar cells's maximum distance is 50mm. It is assumed that PV module's surface temperature decreases because of increasing distance between solar cells that would give high power generation. Also, short distance between solar cell and frame result in contamination on glass. When considering reduced maximum power caused by contaminant, from that. we can fabricated PV module of lower cost with high performance.

• Design & Manufacturing
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• v.16 no.2
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• pp.20-25
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• 2022

In line with the rapid economic growth of many countries, fossil fuel energy sources are also rapidly depleting. Therefore, the price is also rising rapidly, so it is necessary to develop new and renewable energy sources such as hydropower, geothermal power, nuclear power, wind power and solar energy to replace fossil fuel energy in the future. In this study, development of rotating concentrator module system, development of rotating module control control system, development of lamp and charge control controller, configuration and prototype production of rotating concentrating solar LED street light system, efficiency of rotating concentrating solar LED street light, and power production. The research was conducted in the order of evaluation of comprehensive performance tests such as consumption and consumption. As a result, the developed high-efficiency rotation-concentrating hybrid solar LED street light module system has a 50% higher light-gathering efficiency than existing products by tracing sunlight by self-developing a rotation-collecting module on existing solar LED street lamps according to the characteristics of Korea's topography. and the power generation was improved by more than 40%.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.3
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• pp.264-272
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• 2009

In this paper, a Ka-band 10 W power amplifier module is designed and fabricated using MIC(Microwave Integrated Circuit) module technology which combines multiple power MMIC(Monolithic Microwave Integrated Circuit) chips on a thin film substrate. Modified Wilkinson power dividers/combiners are used for millimeter wave modules and CBFGC-PW-Microstrip transitions are utilized for reducing connection loss and suppressing resonance in the high-gain and high-power modules. The power amplifier module consists of seven MMIC chips and operates in a pulsed mode. for the pulsed mode operation, a gate pulse control circuit supplying the control voltage pulses to MMIC chips is designed and applied. The fabricated power amplifier module shows a power gain of about 58 dB and a saturated output power of 39.6 dBm at a center frequency of the interested frequency band.

• ETRI Journal
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• v.41 no.5
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• pp.670-683
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• 2019

In this paper, we analyzed the signal integrity of a system interconnection module for a proposed high-density server. The proposed server integrates several components into a chassis. Therefore, the proposed server can access multiple computing resources. To support the system interconnection, among the highly integrated computing resources, the interconnection module, which is based on Serial RapidIO, has been newly adopted and supports a bandwidth of 800 Gbps while routing 160 differential signal traces. The module was designed for two different stack-up types on a printed circuit board. Each module was designed into 12- (version 1) and 14-layer (version 2) versions with thicknesses of 1.5T and 1.8T, respectively. Version 1 has a structure with two consecutive high-speed signal-layers in the middle of two power planes, whereas Version 2 has a single high-speed signal placed only in the space between two power planes. To analyze the signal integrity of the module, we probed the S-parameters, eye-diagrams, and crosstalk voltages. The results show that the high-speed signal integrity of Version 2 has a better quality than Version 1, even if the signal trace length is increased.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.24-27
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• 2008

For high voltage DC-DC converters, the parallel operation of several high voltage source modules is necessary to reduce the material cost. In the conventional parallel operation with HDC module control unit, it is difficult to repair the HDC system for the failure of control unit. To overcome these problems, new parallel operating algorithm for high voltage DC-DC converter is presented. The proposed algorithm has no main control unit and each module can be selected as the master according to the operating conditions. Therefore, one of modules can be replaced as the master immediately when the previous master module is failed. In addition, the extension of extra modules can be simple.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.13-14
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• 2008

In this paper, we analyze the electrical characteristics of PV depending on distance among solar cells before and after lamination process. From the result, the PV module's maximum power increases about 3.37% when solar cells's distance is 10mm. And the maximum power increases up to 8.42% when solar cells's maximum distance is 50mm. It is assumed that PV module's surface temperature decreases because of increasing distance between solar cells that would give high power generation. Also, short distance between solar cell and frame result in contamination on glass. When considering reduced maximum power caused by contaminant, from that, we can fabricated PV module of lower cost with high performance.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.43 no.2 s.308
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• pp.33-39
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• 2006

This paper designed the electronic circuit part of Potable Infrared Night Vision Scope for a small size, light weight, and low power. Designed electronic circuit part is composed of an Auto Voltage Selecting Module, and a Power Supply Module. An Auto Voltage Selecting Modulo is composed of a switch, a battery, a step up voltage part, and a selecting voltage part. A Power Supply Module is composed of a high luminous sensing part, a battery voltage sensing part, a infrared illumination part, a connection sensing part, and a power control part. And this module controls the power of Image Intensifier Tube. To verify the performance of the designed electronic circuit part, we experimented the consumption power and continuous using time. Experimental results show that the designed electronic circuit part improves considerably on the performance of the AN/PVS-14. performance.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.