• Proceedings of the KIPE Conference
• /
• 2020.08a
• /
• pp.294-295
• /
• 2020

차세대 전력반도체 중 하나인 GaN HEMT(Gallium Nitride High Electron Mobility Transistor)는 낮은 온 저항, 고속 스위칭 및 낮은 출력 커패시턴스 특성을 가지므로 더 높은 전력밀도를 달성할 수 있다. 그러나 낮은 문턱 전압 및 높은 dv/dt로 인해 외부 요인에 취약하다. 본 논문에서는 GaN HEMT를 3kW급 단상 인버터에 적용 시 발생한 문제점을 분석하고 해결방안을 제시한다.

• Proceedings of the KIPE Conference
• /
• 2020.08a
• /
• pp.292-293
• /
• 2020

본 논문은 차세대 전력반도체 GaN HEMT (High Electron Mobility Transistor)를 적용한 통신전원 시스템용 LLC 컨버터의 설계에 대해 다룬다. GaN HEMT 소자의 노이즈를 저감하기 위해 3-level 게이트 드라이버를 설계하였다. 설계한 게이트 드라이버와 GaN HEMT를 적용한 3kW급 LLC 공진 네트워크를 설계하였고, 테스트 베드를 제작하여 실험을 통해 시스템의 성능을 검증하였다.

• Journal of Power Electronics
• /
• v.17 no.3
• /
• pp.601-609
• /
• 2017

Gallium nitride (GaN) power switching devices are promising candidates for high switching frequency and high efficiency power conversion due to their fast switching, low on-state resistance, and high-temperature operation capability. In order to facilitate the use of these new devices better, it is required to investigate the device characteristics and performance in detail preferably by comparing with various conventional silicon (Si) devices. This paper presents a comprehensive study of GaN high electron mobility transistor (HEMT) based non-isolated point-of-load (POL) synchronous buck converter operating at 2.7 MHz with a high step-down ratio (24 V to 3.3 V). The characteristics and performance of GaN HEMT and three different Si devices are analytically investigated and the optimal operating point for GaN HEMT is discussed. Zero-voltage switching (ZVS) is implemented to minimize switching loss in high switching frequency operation. The prototype circuit and experimental data support the validity of analytical and simulation results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.11 no.6
• /
• pp.447-452
• /
• 1998

The selective dry etching of GaAs to Al\ulcornerGa\ulcornerAs using $BCI_3/SF_6$ gas mixture in electron cyclotron resonance(ECR) plasma is investigated. A selectivity of GaAs to AlGaAs of more than 100 and maximum etch rate of GaAs are obtained at a gas ratio $SF_6/BCI_3+SF_6$ of 25%. We verified the formation of $AlF_3$ on $Al_{0.25}Ga_{0.75}As$from the Auger spectra which enhanced the etch selectivity. In order to investigate surface damage of AlGaAs caused by ECR plasma, we performed a low temperature photoluminescence(PL) measurement as a function of RF power. As the RF power. As the RF power increases, the PL intensity decreases monotonically from 50 to 100 Wand then repidly decreases until 250 W. This behavior is due to surface damage by plasma treatment. This dry etching technique using $BCI_3/SF_6$ gas mixture in ECR plasma is suitable for gate recess formation on the GaAs based pseudomorphic high electron mobility transistor(PHEMT)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2010.06a
• /
• pp.337-337
• /
• 2010

갈륨-질화물 (GaN) 기반의 고 전자 이동도 트랜지스터 (High Electron Mobility Transistor, HEMT)는 GaN의 큰 밴드갭 (3.4~6.2 eV), 높은 항복전계 (Ec~3 MV/cm) 및 높은 전자 포화 속도 (saturation velocity $-107\;cm{\cdot}s-1$) 특성과 AlGaN/GaN 등과 같은 이종접합구조(Heterostructure )로부터 발생하는 높은 면밀도(Sheet Concentration)를 갖는 이차원 전자가스(Two-Dimensional Electron Gas, 2DEG) 채널로 인해 차세대 고출력/고전압 소자로서 각광받고 있다. 하지만 드레인 쪽의 게이트 에지부분에 집중되는 전계로 인한 애벌린치 할복현상(Breakdown)이 발생하는 문제점이 있다. 따라서 AlGaN/GaN HEMT의 항복전압 향상을 위한 방법으로 필드플레이트(Field-Plate) 구조가 많이 사용되고 있다. 본 논문에서는 2D 시뮬레이션을 통한 AlGaN/GaN HEMT의 필드플레이트 구조 최적화를 수행하였다. 이를 위해 ATLASTM 전산모사 프로그램을 이용하여 필드플레이트 길이, 절연체 증류 및 두께에 따른 전류 전압 특성 및 전계 분산효과에 대한 전산모사를 수행하여 그 결과를 비교, 분석 하였다, 이를 바탕으로 기존의 구조에 비해 약 300%이상 향상된 항복전압을 갖는 AlGaN/GaN HEMT의 최적화된 필드 플레이트 구조를 제안하였다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.13 no.4
• /
• pp.342-354
• /
• 2013

The aim of this work is to investigate and study the quantum effects in the modeling of nanoscale symmetric double-gate InAlAs/InGaAs/InP HEMT (High Electron Mobility Transistor). In order to do so, the carrier concentration in InGaAs channel at gate lengths ($L_g$) 100 nm and 50 nm, are modelled by a density gradient model or quantum moments model. The simulated results obtained from the quantum moments model are compared with the available experimental results to show the accuracy and also with a semi-classical model to show the need for quantum modeling. Quantum modeling shows major variation in electron concentration profiles and affects the device characteristics. The two triangular quantum wells predicted by the semi-classical model seem to vanish in the quantum model as bulk inversion takes place. The quantum effects thus become essential to incorporate in nanoscale heterostructure device modeling.

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.34D no.7
• /
• pp.56-61
• /
• 1997

I $n_{0.53}$G $a_{0.47}$As/I $n_{0.52}$A $l_{0.48}$As pseudomorphic high electron mobility transistor (P-HEMT) structures were grown on semi-insulating InP substrates by molecular beam epitzxy method. The hall effect measuremetn was used to measure the electrical properties and the photoluminescence (PL) measurement was used to measure the electrical properties and the photoluminescence(PL) measurement for optical propety. By the cross-sectional transmission electron microscopy (XTEM) investigation of the V and X shape defects including slip with angle of 60.deg. C and 120.deg. C to surface in the sampel, the defects formation mecahnism in the I $n_{0.52}$A $l_{0.48}$As epilayers on InP substrates could be explained with the different thermal expansion coefficients between I $n_{0.52}$A $l_{0.48}$As epilayers and InP substrate.d InP substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.145-145
• /
• 2008

갈륨-질화물(GaN) 기반의 고속전자이동도 트랜지스터(high electron mobility transistor, HEMT)는 최근 마이크로파 또는 밀리미터파 등의 차세대 고주파용 전력소자로 각광받고 있다. AlGaN/GaN HEMT는 이종접합구조(heterostructure) 로부터 발생하는 이차원 전자가스(two-dimensional electron gas, 2DEG) 채널을 이용하여 높은 전자 이동도, 높은 항복전압 및 우수한 고출력 특성을 얻는 것이 가능하다. AlGaN/GaN HEMT에서 ohmic 전극 부분과 채널이 형성되는 부분과의 거리에 의한 저항의 성분을 줄이고 전자의 터널링의 확률을 증가시키기 위해서 recess된 구조가 많이 사용되고 있다. 그러나 이 구조에서는 recess된 소스와 드레인에 의해 AlGaN층의 제거로 AlGaN층의 두께에 영향을 미치며 그에 따라 채널에 생성되는 전자의 농도를 변화시키게 된다. 본 논문에서는 소스와 드레인의 Trench 구조를 제안하였다. ohmic 전극 부분과 채널간의 거리의 감소로 특성을 향상시켜서 recess 구조의 장점이 유지된다. 그리고 recess되는 소스와 드레인 영역에서 AlGaN층을 전체적으로 제거하는 것이 아니고 Trench 즉 일부분만 제거하면서 AlGaN층의 두께의 변화에 따른 문제점도 줄일 수 있다. 따라서 이러한 전극 부분을 Trench구조화 시킨 AlGaN/GaN HEMT의 DC특성을 $ATLAS^{TM}$를 이용하여 전산모사하고 최적화된 구조를 제안하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.4
• /
• pp.1-6
• /
• 2008

In this paper, millimeter-wave broadband MHEMT (Metamorphic High Electron Mobility Transistor) cascode amplifiers were designed and fabricated. The $0.1{\mu}m$ InGaAs/InAlAs/GaAs MHEMT was fabricated for cascode amplifiers. The DC characteristics of MHEMT are 670 mA/mm of drain current density, 588 mS/mm of maximum transconductance. The current gain cut-off frequency($f_T$) is 139 GHz and the maximum oscillation frequency($f_{max}$) is 266 GHz. To prevent oscillation of the designed cascode amplifiers, a parallel resistor and capacitor were connected to the drain of common gate device. By using the CPW (Coplanar Waveguide) transmission line, the cascode amplifier was designed and matched for the broadband characteristics. The designed amplifier was fabricated by the MHEMT MMIC process that was developed through this research. As the results of measurement, the amplifier was obtained 3 dB bandwidth of 50.37 GHz between 20.76 to 71.13 GHz. Also, this amplifier represents the S21 gain with the average 7.07 dB gain in bandwidth and the maximum gain of 10.3 dB at 30 GHz.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.41 no.12
• /
• pp.7-12
• /
• 2004

In this paper, CPW wideband distributed amplifier was designed and fabricated using 0.1 $\mum$ InGaAs/InAlAs/GaAs Metamorphic HEMT(High Electron Mobility Transistor). The DC characteristics of MHEMT are 442 mA/mm of drain current density, 409 mS/mm of maximum transconductance. The current gain cut-off frequency(fT) is 140 GHz and the maximum oscillation frequency(fmax) is 447 GHz. The distributed amplifier was designed using 0.1 $\mum$ MHEMT and CPW technology. We designed the structure of CPW curve, tee and cross to analyze the discontinuity characteristics of the CPW line. The MIMIC circuit patterns were optimized electromagnetic field through momentum. The designed distributed amplifier was fabricated using our MIMIC standard process. The measured results show S21 gain of above 6 dB from DC to 45 GHz. Input reflection coefficient S11 of -10 dB, and output reflection coefficient S22 of -7 dB at 45 GHz, respectively. The chip size of the fabricated CPW distributed amplifier is 2.0 mm$\times$l.2 mm.