• Journal of Electrical Engineering and Technology
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• v.8 no.5
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• pp.1086-1095
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• 2013

The main issue of parallel three-phase boost converters is reduction of the low- and high frequency circulating currents. Most present technologies concentrate on low frequency circulating current because the circulating current controller cannot mitigate the high frequency circulating current. In this paper, analytical approach of three-phase coupled inductor applied to parallel system becomes an important objective to effectively reduce the low- and high frequency circulating currents. The characteristics of three-phase coupled inductor based on a structure and voltage equations are mathematically derived. The modified voltage equations are then applied to parallel three-phase boost converters to develop averaged models in stationary coordinates and rotating coordinates. Based on the averaged modeling approach, design of the circulating current controller is presented. Simulation and experimental results demonstrate the effectiveness of the analysis and modeling for the parallel three-phase boost converters using three-phase coupled inductor.

• Journal of international Conference on Electrical Machines and Systems
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• v.3 no.3
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• pp.339-353
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• 2014

A straightforward method for optimal determining of a high frequency inductor's parasitic capacitance is presented. The proposed estimation method is based on measuring the inductor's impedance samples over a limited frequency range bordering on the resonance point considering k-dB deviation from the maximum impedance. An optimized solution to k could be obtained by minimizing the root mean squared error between the measured and the estimated impedance values. The model used to provide the estimations is a parallel RLC circuit valid at resonance frequency which will be transferred to the real model considering the mentioned interval of frequencies. A straightforward algorithm is suggested and programmed using MATLAB which does not require a wide knowledge of design parameters and could be implemented using a spectrum analyzer. The inputs are the measured impedance samples as a function of frequency along with the diameter of the conductors. The suggested algorithm practically provides the estimated parameters of a real inductance model at different frequencies, with or without design information. The suggested work is different from designing a high frequency inductor; it is rather concentration of determining the parameters of an available real inductor that could be easily done by a recipe provided to a technician.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.54 no.7
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• pp.343-350
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• 2005

Conventionally, for transferring the primary power to the secondary one, the high frequency series resonant converter has been widely used for the contactless power supply system. However, the high frequency series resonant converter has the disadvantages such as the low efficiency, the high voltage gain characteristics and deviation of the phase angle in the overall load range. To improve this disadvantages, In this paper, the characteristics of the high efficiency and unit voltage gain as well as in-phase are revealed in the proposed three-level LCLC (Inductor-Capacitor- Inductor-Capacitor) resonant converter. The results are verified on the simulation based on the theoretical analysis and the 4kW experimental Prototype.

• Proceedings of the KIPE Conference
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• 2010.07a
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• pp.470-471
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• 2010

In this paper, the coupled inductor with three branches in two interleaved converter are analyzed to effectively suppress the high frequency circulating current since the circulating current controller cannot mitigate the high frequency circulating current. As a result, the novel averaged model including the coupled inductor with zero sequence components is developed for reducing the low and high frequency circulating current simultaneously.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.1
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• pp.57-64
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• 2013

The functional characteristic of LISN circuit, which is used for measurements of conductive noise in mains power line, is basically related to frequency characteristics of passive elements like inductors used in the circuit as well as the frequency response of inductors is highly related to the resins used in the varnishing process. The significant problem in determination of an inductor's frequency characteristic is the intrinsic resistance, inductance and parasitic capacitance. In this triplet, the parasitic capacitance is the major limiting factor of inductor's frequency range. This capacitance depends on inductor design parameters and materials filling the spaces of coil like resin and its coherency after curing process. In this paper, two similar inductors were designed and built. The first inductor was not varnished while the second one was varnished with VPI technology. VPI, or Vacuum, Pressure, Impregnation technology is one of the most reliable methods performing good insulating conditions for electrical circuits and windings based on resins. The measured results show that implying varnishing technology does not significantly affect the frequency response. However, due to mechanical solidity aspects and improved environmental protection, it is better to varnish the inductors.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.19 no.3
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• pp.311-320
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• 2008

In this paper, a new variable active inductor using a conventional grounded active inductor with feedback variable LC-resonator is proposed. The grounded active inductor is realized by the gyrator-C topology and the variable LC-resonator is realized by the low-Q spiral inductor and varactor. This variable LC-resonator can compensate the degradation of Q-factor due to parasitic capacitance of a transistor, and the frequency range with high Q-factor is adjustable by resonance frequency adjustment of LC-resonator. The fabricated variable active inductor with Magnachip $0.18{\mu}m$ CMOS process shows that high-Q frequency range can be adjusted according to varactor control voltage from 4.66 GHz to 5.45 GHz and Q-factor is higher than 50 in the operating frequency ranges. The measured inductance at 4.9GHz can be controlled from 4.12 nH to 5.97 nH by control voltage.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.7
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• pp.17-24
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• 1998

We proposed a novel bondwire inductor buried in plastic package for low cost MMIC and characaterized the electrical perofmrance in a wide frequency range using the full-wave analysis of finite element method(FEM), and then we fabricated and measured the scale-up model in order to prove the characteristics. Th ebondwire inductor has higher quality factor and higher cutoff frequency than the conventional spiral inductor designed n the same area as the bondwire inductor. Since the air-bridge process is not requried for the bondwire inductor, it is very suitable for low cost plastic-packaged MMIC production. The bondwire inductor has the field distribution localized around the bondwire inductor and hence is more compatible to the crosstalk problems.

• IEIE Transactions on Smart Processing and Computing
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• v.4 no.1
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• pp.44-50
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• 2015

This paper presents a high speed synchronous single inductor dual output boost converter using Type-III compensation for power management in smart devices. Maintaining multiple outputs from a single inductor is becoming very important because of inductor the sizes. The uses of high switching frequency, inductor and capacitor sizes are reduced. Owing to synchronous rectification this kind of converter is suitable for SoC. The phase is controlled in time sharing manner for each output. The controller used here is Type-III, which ensures quick settling time and high stability. The outputs are stable within $58{\mu}s$. The simulation results show that the proposed scheme achieves a better overall performance. The input voltage is 1.8V, switching frequency is 5MHz, and the inductor used is 600nH. The output voltages and powers are 2.6V& 3.3V and 147mW &, 230mW respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1049-1055
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• 2007

Lots of integration work has been done in order to miniaturize the devices for communication. To do this work, one of key work is to get miniaturized inductor with high Q factor for RF circuitry. However, it is not easy to get high Q inductor with silicon based substrate in the range of GHz. Although silicon is well known for its good electrical and mechanical characteristics, silicon has many losses due to small resistivity and high permittivity in the range of high frequency. MEMS technology is a key technology to fabricate miniaturized devices and LTCC is one of good substrate materials in the range of high frequency due to its characteristics of high resistivity and low permittivity. Therefore, we proposed and studied to fabricate and analyze the inductor on the LTCC substrate with MEMS fabrication technology as the one of solutions to overcome this problem. We succeeded in fabricating and characterizing the high Q inductor on the LTCC substrate and then compared and analyzed the results of this inductor with that on a silicon and a glass substrate. The inductor on the LTCC substrate has larger Q factor value and inductance value than that on a silicon and a glass substrate. The values of Q factor with the LTCC substrate are 12 at 3 GHz, 33 at 6 GHz, 51 at 7 GHz and the values of inductance is 1.8, 1.5, 0.6 nH in the range of 5 GHz on the silicon, glass, and LTCC substrate, respectively.

• Journal of Welding and Joining
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• v.26 no.4
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• pp.66-72
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• 2008

Because of high intensity and easy controllability of the heat source, high frequency induction heating has been concerned and studied for the steel forming process in the ship building industry. However, the heating and forming characteristics have to be further properly modelled and analyzed for the process to be utilized with its optimal working parameters. In this study, a modelling with thermo-elasto-plastic analysis is performed using the FEM to study heat flow and deformation of the steel plate during the forming process with the electro-magnetic induction heating. The numerical model is then used to study the effect of the inductor shape on the magnitude of angular deformation of the plate during the forming process. It is revealed that the square shape of inductor induces the largest deformation among the rectangular inductors.