• 제목/요약/키워드: High alumina glass

검색결과 68건 처리시간 0.028초

PVP 결합제를 이용한 수계용 세라믹테이프의 제조 (Fabrication of Water-based Ceramic Tapes Using PVP As Binder)

  • 박일석;조유정;이명현;최세영;이득용;김대준
    • 한국세라믹학회지
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    • 제38권11호
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    • pp.1060-1066
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    • 2001
  • 세라믹 인공치관으로 응용을 위해 생체친화적이며 용매에 용해가 잘되고 연소 후 잔류물이 남지 않는 결합제인 PVP로 수계용 알루미나 테이프를 제조하였다. 알루미나 테이프의 인장강도는 결합제(b)와 가소제(p)의 비(b/b+p))에 의해, 그리고 소결체 수축과 밀도는 알루미나(a)와 유기물(o)의 비 (a/(a+o))에 의해 영향을 받았다. 소결된 가공성 알루미나 테이프에 유리를 침투시켜 강화된 세라믹 인공치관용 복합체의 강도는 소결밀도가 증가할수록 높은 값을 보였다.

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저농도 알칼리 생체유리의 물성 및 Hydroxyapatite 형성 (Physical Properties and Hydroxyapatite Formation of Low Alkali Containing Bioglass)

  • 김용수;김철영
    • 한국세라믹학회지
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    • 제31권12호
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    • pp.1521-1528
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    • 1994
  • To improve mechanical strength of bioglass, it is considered to use the glass as a coating material to alumina, but the difference in thermal expansion coefficient between two materials is too high to make a good coating. The aim of the present study, therefore, is to find out proper glass composition matching its thermal expansion coefficient to that of alumina without losing biocompatibility. In the present work, various glasses were prepared by substituting B2O3 and CaO for Na2O in the glass system of 55.1%SiO2-2.6%P2O5-20.1%Na2O-13.3%CaO-8.9%CaF2 (in mole%), and the thermal expansion property and reaction property in tris-buffer solution for the resulting glasses were measured. The thermal expansion coefficient of the glass was decreased with the substitution of B2O3 for Na2O, and it became close to that of alumina in the glass in which 8 mole% of CaO was substituted for Na2O. Hydroxyapatite formation was enhanced and silica rich layer thickness was decreased with B2O3 substitution for Na2O. CaO substitution for Na2O didn't deteriorated the hydroxyapatite development.

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유리/다공성 알루미나의 접촉하중에 의한 기계적 거동 (Mechanical Behavior of Glass/Porous Alumina by Contact Loading)

  • 김철;김상겸;김태우;이기성
    • 한국세라믹학회지
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    • 제51권5호
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    • pp.399-405
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    • 2014
  • Porous alumina with different porosities, 5.2 - 47.5%, were coated with cover-glass having a thickness of $160{\mu}m$, using epoxy adhesive. We investigated the effect of the porosity of the substrate layer on the crack initiation load, and the size of cracks propagated in the coating layer. Hertzian indentations were used to evaluate the damage behavior under a constrained loading condition. Typically, two types of cracks, ring cracks and radial cracks, were observed on the surface of the glass/porous alumina structure. Indentation stress-strain curves, crack initiation loads, crack propagation sizes, and flexural strengths were investigated as a function of porosities. The results indicated that a porosity of less than 30% and a higher substrate elastic modulus were beneficial at suppressing cracks occurrence and propagation. We expect lightweight mechanical components with high strength can be successfully fabricated by coating and controlling porosities in the substrate layer.

전자빔 증착법으로 제작한 Cu 박막의 부착력과 저항율 특성 (The Resistivity Properties and Adhesive Strength of Cu Thin Firms Fabricated by EBE Method)

  • 신중홍;유충희;백상봉
    • 한국전기전자재료학회논문지
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    • 제18권1호
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    • pp.75-80
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    • 2005
  • In this thesis, We Fabricated Cu thin films of 1000 $\AA$, 3000 $\AA$, and 6000 $\AA$ thickness on the single crystal sapphire, polycrystal alumina, and amorphous slide glass substrates deposited by electron beam evaporation(EBE) method. We investigated properties of resistivity and adhesion of these Cu thin films under various conditions, substrate temperature(room temperature, 10$0^{\circ}C$, 20$0^{\circ}C$ under vacuum) and annealing temperatures(400 $^{\circ}C$, 600 $^{\circ}C$ for 30 min after the deposition). We found that these adhesion was increased in order of slide glass, sapphire, and alumina. The adhesion of the Cu thin films on alumina was high value about 4 times, compared with that of the Cu thin films on slide glass. We found that these resistivities were decreased with increasing substrate temperature and thin film thickness. The resistivity(2.05 $\mu$Ω\ulcornercm) of the Cu thin films with 6000 $\AA$ thickness at 200 $^{\circ}C$ on the slide glass was low value, compared with that of aluminum(2.66 $\mu$Ω\ulcornercm).

유한요소해석을 이용한 알루미나 정전척의 글라스 기판 흡착 특성 연구 (A Study on Attractive Force Characteristics of Glass Substrate Using Alumina Electrostatic Chuck by Finite Element Analysis)

  • 이재영;장경민;민동균;강재규;성기현;김혜동
    • 반도체디스플레이기술학회지
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    • 제19권4호
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    • pp.46-50
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    • 2020
  • In this research, the attractive force of Coulomb type electrostatic chuck(ESC), which consisted of alumina dielectric, on glass substrate was studied by using the finite element analysis. The attractive force is caused by the high electrical resistance which occurs in contact region between glass substrate and dielectric layer. This research tries the simple geometrical modeling of ESC and glass substrate with air gap. The influences of the applied voltage, and air gap are investigated. When alumina dielectric with 1014 Ω·cm, 1.5 kV voltage, and 0.01 mm air gap were applied, electrostatic force in this work reached to 4 gf/㎠. This results show that the modeling of air gap is essential to derive the attractive force of the ESC.

Fabrication of a Hydrogenated a-Si Photodiode

  • Hur, Chang-Wu
    • Journal of information and communication convergence engineering
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    • 제1권1호
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    • pp.23-26
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    • 2003
  • A photodiode capable of obtaining a sufficient photo/dark current ratio at both a forward bias state and a reverse bias state is proposed. The photodiode includes a glass substrate, an aluminum film formed as a lower electrode over the glass substrate, an alumina film formed as a schottky barrier over the aluminum film, a hydrogenated amorphous silicon film formed as a photo conduction layer over a portion of the alumina film, and a transparent conduction film formed as an upper electrode over the hydro-generated amorphous silicon film. Growth of high quality alumina($Al_{2}O_{3}$) film using anodizing technology is proposed and analyzed by experiment. We have obtained the film with a superior characteristics

무연계 Ag 외부전극재의 열충격에 따른 열화특성과 고장해석 (Degradation and Failure Analysis of Lead-free Silver Electrodes with Thermal Cycling)

  • 김정우;윤동철;이희수;전민석;송준광
    • 한국전기전자재료학회논문지
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    • 제21권5호
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    • pp.434-439
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    • 2008
  • Silver pastes as the outer electrodes have been prepared using Pb-free glass frits with different content of $Bi_2O_3$ and the effects of glass composition on the degradation behaviors of the Ag electrodes were investigated using the change of adhesion between Ag electrode and alumina substrate with thermal cycle stress. Low adhesion and high surface resistance were observed in Ag electrode using glass frit with a $Bi_2O_3$ content of 60 wt%, owing to the open microstructure formed at the firing temperature of $600^{\circ}C$. When the $Bi_2O_3$ was increased to 80 wt% in the glass frit, the Ag electrodes had a dense microstructure with high adhesion and a low surface resistance. Delamination of the Ag electrodes was a major failure mode under thermal cycle stress and this was attributed to residual stress due to the thermal expansion mismatch between the Ag electrode and the alumina substrate.

Celay System을 이용한 In-Ceram Alumina 3 Unit Bridge제작법 (THE CONSTRUCTION METHOD OF IN-CERAM ALUMINA 3 UNIT BRIDGE USING CELAY SYSTEM)

  • 조병완
    • 대한심미치과학회지
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    • 제5권1호
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    • pp.34-43
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    • 1996
  • In nowdays many dental CAD/CAM system were developed. Among those only Cerec and Celay were used globally as clinical application. Celay is a machinable ceramic system that is capable of milling inlays, onlays, and veneers from prefabricated industrial ceramic blocks(Vita Celay Blanks). The advatages of Celay are to simplify the manufactures and to save the processing time. For esthetics In-Ceram Alumina bridges were introduced into maxillary anterior restoration. They have a high strength, a high translucency and an excellent marginal adapation. But the laboratory processes are very difficult and complicated. So the construction of In-Ceram Alumina bridge combined with celay system was desgined. The patient is a 28 year old age male. The chief complain is missing of maxillary left central incisor. He wants to restore anterior bridge for esthetically. The Alumina bridge framework was constructed easily by celay system. Glass ilfiltration was occurred. After that, vitadura-${\alpha}$porcelain build up was occurred by conventional method. The translucency of In-Ceram Alumina 3 unit bridge revealed to be superior to that of porcelain fused to metal bridge. So we report it with clincal case and literature reviews.

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고주파대역에서 기판으로 쓰이는 Glass/Ceramics Composite의 소결거동 (A sintering Behavior of Glass/Ceramic Composite used as substrate in High Frequency Range)

  • 이찬주;김형준;최성철
    • 한국세라믹학회지
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    • 제37권4호
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    • pp.302-307
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    • 2000
  • The objective of this study was to investigate the sintering behavior, crystallization characteristic of glass-ceramic and optimal sintering condition on the glass/ceramic composite for fabricating substrate of LTCC. Glass/ceramic composite was made from alumina powder and glass frit, which was composed of SiO2-TiO2-RO-PbO/(R: Ba, Sr, Ca), and was sintered for 0, 30, 60minutes in the temperature range from 700$^{\circ}C$ to 1000$^{\circ}C$. Properties of frit and glass/ceramic compsoite were analyzed by DTA, XRD, SEM and Network Analyzer and so on. Main sintering mechanism was densification occurred above 730$^{\circ}C$ by viscous flow and crystallization starting about 780$^{\circ}C$ affected sintering also. So viscous flow was affected by sintering temperature, duration time, and creation of crystallization phase etc. From this study, it was possible to fabricate glass/ceramic composite by changing sintering temperature and duration time.

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Thermal Expansion and Dielectric Properties of CaO-ZnO-B2O3-SiO2 Glass-Added Al2O3 Composites for LTCC Applications

  • Byeon, Tae-Hun;Park, Hyo-Sung;Shin, Hyun-Ho;Yoon, Sang-Ok;Oh, Chang-Yong
    • 한국세라믹학회지
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    • 제47권4호
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    • pp.325-328
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    • 2010
  • Varying quantities of a high-thermal-expansion glass, 50CaO-20ZnO-$20B_2O_3-10SiO_2$ (CZBS), were added to alumina and sintered at $875^{\circ}C$ for 2 h for low temperature co-firing ceramic (LTCC) applications. As the amount of glass addition increased from 40 wt% to 70 wt%, the apparent density of the sintered product increased from 88.8% to 91.5%, which was also qualitatively confirmed by microstructural observation. When the glass addition was very high, e.g., 70 wt%, an apparent formation of secondary phases such as $CaZn_2AlZnSiAlO_7$, $Ca_2Al(AlSi)O_7$, $Ca_2Al_2SiO_7$, $Ca_2ZnSi_2O_7$ and ZnO, was observed. Both the dielectric constant and the coefficient of thermal expansion increased with the glass addition, which was qualitatively consistent with the analytical models, while the experimental values were lower than the predicted ones due to the presence of pores and secondary phases.