1 |
S. W. Russell, S. A. Rafalski, R. L. Spreitzer, J. Li, M. Moinpour, F. Moghadam, and T. L. Alford, 'Enhanced adhesion of copper to dielectrics via titanium and chromium additions and sacrificial reactions', Thin solid film, Vol. 262, p. 154, 1995
|
2 |
D. Adams, T. L. Alford, N. D. Theodore, S. W. Russell, R. L. Spreitzer, and J. W. Mayer, 'Passivatianiurn of Cu via refractory metal nitridation in an amonia ambient', Thin Solid Film, Vol. 262, p, 199, 1995
|
3 |
T. Shacham-Diamand, V. Dubin, and M. Angyal, 'Electroless copper deposition for ulsi', Thin Solid Films Vol. 262, p. 92, 1995
|
4 |
R. P. Vinci, E. M. Zielinski, and J. C. Bravman, 'Thermal Strain and Stress in Copper Thin Films', Thin Solid Films, Vol 262, p. 142, 1995
|
5 |
P. J. Ding and W. A. Lanford, 'Effects of the addtion of small amount of al to copper: Corrosion, resistivity, adhesion, morphology, and diffusion', J. Appl, Phys., Vol. 75, No.7, p. 3627, 1994
|
6 |
W. J. Lee, J. S. Min, S.K. Rha, N. S. Chun, D. W. Kim, and C. O. Park, 'Copper chemical vapor deposition using copper hexafluoroace-tylacetonate trimethylvinylsilane', J. Mater. Sci.,: Mater. Electron., Vol. 7, p, 111, 1996
|
7 |
조남인, 김용석, 김창교, '화학적기상증착법에 의한 구리박막의 전기전도도 개선에 관한 연구', 전기전자재료학회논문지, 13권, 6호p. 459, 2000
|
8 |
T. Maruyama and T. Morishita, 'Copper nitride thin films prepared by radio-frequency reactive sputter', J. Appl. Phys., Vol. 78, No. 6, p, 4104, 1995
|
9 |
H. K. Pulker, 'Coatings on Glass', Elsevier Science Ltd, 1984
|
10 |
小宮宗治, '超高眞空がひろく世界', Chap. 3, Blue Backs, 1978
|
11 |
小林, 'スバッタ 薄膜' Chap. 5,日刊工業新聞社, 1993
|
12 |
이우선, 정용호, 이상일 'RF 스퍼터링 증착에 의한 질화 텅스텐 박막의 비저항 특성', 전기전자재료학회지, 8권, 2호, p. 196, 1995
|
13 |
S. O. Kasap, 'Principles of Electrical Engineering Materials and Devices', Chap 1-2, IRWIN, 1997
|
14 |
송재성, 오영우. 'RF 마그네트론 스퍼터링법에 의해 증착된 구리막의 특성', 전기전자재료학회지, 9권, 7호, p. 727, 1996
|
15 |
B. A. Movchan and A. V. Demchishin, 'Metaloved', Fiz. Matal. Metalloved, Vol. 28, p. 83, 1969
|