• 제목/요약/키워드: Height of stacking layer

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FDM 3D Printing 적층조건에 따른 기계적 물성의 연구 (A study of mechanical properties with FDM 3D printing layer conditions)

  • 김범준;이태흥;손일선
    • Design & Manufacturing
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    • 제12권3호
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    • pp.19-24
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    • 2018
  • Fused deposition Modeling (FDM) is one of the most widely used for the prototype of parts at ease. The FDM 3D printing method is a lamination manufacturing method that the resin is melted at a high temperature and piled up one by one. Another term is also referred to as FFF (Fused Filament Fabrication). 3D printing technology is mainly used only in the area of prototype production, not in production of commercial products. Therefore, if FDM 3D printer is applied to the product process of commercial products when considered, the strength and dimensional accuracy of the manufactured product is expected to be important. In this study, the mechanical properties of parts made by 3D printing with FDM method were investigated. The aim of this work is to examine how the mechanical properties of the FDM parts, by changing of processing FDM printing direction and the height of stacking layer is affected. The effect of the lamination direction and the height of the stacking layer, which are set as variables in the lamination process, by using the tensile specimen and impact specimen after the FDM manufacturing process were investigated and analyzed. The PLA (Poly Lactic Acid) was used as the filament materials for the 3D printing.

LCD 유리 이송용 복합재료 로봇 핸드의 식스 시그마 강건설계 (Six Sigma Robust Design of Composite Hand for LCD Glass Transfer Robot)

  • 남현욱
    • 대한기계학회논문집A
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    • 제29권3호
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    • pp.455-461
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    • 2005
  • This research studied robust design of composite hand for LTR (LCD glass Transfer Robot). $1^{st}$ DOE (Design of Experiment) was conducted to find out vital few Xs. 108 experiments were performed and their results were statistically analyzed. Pareto chart analysis shows that the geometric parameters (height and width of composite beam) are more important than material parameters $(E_{1},\;E_{2})$ or stacking sequence angle. Also, the stacking sequence of mid-layer is more important than that of outer-layer. The main effect plots shows that the maximum deflection of LTR hand is minimized with increasing height, width of beam and layer thickness. $2^{nd}$ DOE was conducted to obtain RSM (Response Surface Method) equation. 25 experiments were conducted. The CCD (Central Composite Design) technique with four factors was used. The coefficient of determination $(R^{2})$ for the calculated RSM equation was 0.989. Optimum design was conducted using the RSM equation. Multi-island genetic algorithm was used to optimum design. Optimum values for beam height, beam width, layer thickness and beam length were 24.9mm, 186.6mnL 0.15mm and 2402.4mm respectively. An approximate value of 0.77mm in deflection was expected to be a maximum under the optimum conditions. Six sigma robust design was conducted to find out guideline for control range of design parameter. To acquire six sigma level reliability, the standard deviation of design parameter should be con trolled within $2{\%}$ of average design value

잔류 열 변형을 고려한 평판형 압전 복합재료 유니모프 작동기의 해석 (Analysis of a Plate-type Piezoelectric Composite Unimorph Actuator Considering Thermal Residual Deformation)

  • 구남서;우성충
    • 대한기계학회논문집A
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    • 제30권4호
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    • pp.409-419
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    • 2006
  • The actuating performance of plate-type unimorph piezoelectric composite actuators having various stacking sequences was evaluated by three dimensional finite element analysis on the basis of thermal analogy model. Thermal residual stress distribution at each layer in an asymmetrically laminated plate with PZT ceramic layer and thermally induced dome height were predicted using classical laminated plate theory. Thermal analogy model was applied to a bimorph cantilever beam and LIPCA-C2 actuator in order to confirm its validity. Finite element analysis considering thermal residual deformation showed that the bending behavior of piezoelectric composite actuator subjected to electric loads was significantly different according to the stacking sequence, thickness of constituent PZT ceramic and boundary conditions. In particular, the increase of thickness of PZT ceramic led to the increase of the bending stiffness of piezoelectric composite actuator but it did not always lead to the decrease of actuation distance according to the stacking sequences of piezoelectric composite actuator. Therefore, it is noted that the actuating performance of unimorph piezoelectric composite actuator is rather affected by bending stiffness than actuation distance.

임피던스 센서 제작을 위한 잉크젯 기반 패턴 IDE 적층공정 최적화 연구 (A Study on Optimization of Inkjet-based IDE Pattern Process for Impedance Sensor)

  • 정현윤;고정범
    • 한국기계가공학회지
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    • 제21권4호
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    • pp.107-113
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    • 2022
  • At present, it is possible to manufacture electrodes down to several micrometers (~ ㎛) using inkjet printing technology owing to the development of precision ejection heads. Inkjet printing technology is also used in the manufacturing of bio-sensors, electronic sensors, and flexible displays. To reduce the difference between the electrode design/simulation performance and actual printing pattern performance, it is necessary to analyze and optimize the processable area of the ink material, which is a fluid. In this study, process optimization was conducted to manufacture an IDE pattern and fabricate an impedance sensor. A total of 25 IDE patterns were produced, with five for each lamination process. Electrode line width and height changes were measured by stacking the designed IDE pattern with a nanoparticle-based conductive ink multilayer. Furthermore, the optimal process area for securing a performance close to the design result was analyzed through impedance and capacitance. It was observed that the increase in the height of stack layer 4 was the lowest at 4.106%, and the increase in capacitance was measured to be the highest at 44.08%. The proposed stacking process pattern, which is optimized in terms of uniformity, reproducibility, and performance, can be efficiently applied to bio-applications such as biomaterial sensing with an impedance sensor.

Fabrication of Three-Dimensionally Arrayed Polyaniline Nanostructures

  • 권혜민;류일환;한지영;임상규
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.220-220
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    • 2012
  • The supercapacitors with extraordinarily high capability for energy storage are attracting growing attention for their potential applications in portable electronic equipments, hybrid vehicles, cellular devices, and so on. The nanostructuring of the electrode surface can provide large surface area and consequently easy diffusion of ions in the capacitors. In addition, compared to two-dimensional nanostructures, the three-dimensional (3D) nano-architecture is expected to lead to significant enhancement of mechanical and electrical properties such as capacitance per unit area of the electrode. Polyaniline (PANi) is known as promising electrode material for supercapacitors due to its desirable properties such as high electro activity, high doping level and environmental stability. In this context, we fabricated well-ordered 3D PANi nanostructures on 3D polystyrene (PS) nanospheres which was arrayed by layer-by-layer stacking method. The height of the PANi nanostructures could be controlled by the number of PS layers stacked. 3D PANi hollow nanospheres were also fabricated by dissolving inner PS nanospheres, which resulted in further enhancement of the surface area and capacitance of the electrode.

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MBE로 성장시킨 3원계 ZnSSe/GaAs 에피층의 미세구조 특성 (Microstructure Characterization of Ternary ZnSSe/GaAs Epilayer Grown by MBE)

  • 이확주;류현;박해성;김태일
    • Applied Microscopy
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    • 제25권3호
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    • pp.75-81
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    • 1995
  • 이상과 같은 실험에서 다음과 같은 사실을 요약할 수 있다. 1) ZnSSe/GaAs 에피층에는 많은 양의 적층결함과 전위 등의 결정결함이 존재하고 이들은 표면부 보다는 계면부에 더 많이 존재한다. 그러나 에피층은 기판과 pseudomorphic 성장을 이루고 있다. 2) ZnSSe/GaAs 계면에는 5nm 크기의 높이차가 나는 굴곡이 존재하며 ZnSe 버퍼 층에 관계없이 적층결함이 존재하고, 에피층 결정이 약간 기울어져서 므와레 줄무늬 패턴도 존재한다. 3) ZnSSe/GaAs 계면에는 성장 중에 S의 침투로 인한 <111>방향으로 피트가 형성되었음이 관찰되었고 이는 결함 생성 소스로 작용한다 4) 15nm 높이차가 나는 계면이 발견되었으나 기판과 정합을 이루고 있고 주변에는 적층결함도 존재하지 않는다. 그러나 미세한 므와레 줄무의형태가 존재하였다.

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A Study on the Fire Safety of High-rise Apartments Based on Fire Door Switch and Automatic Fire Extinguishing System

  • Zhang, ZeChen;Kong, Ha-Sung
    • International Journal of Advanced Culture Technology
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    • 제9권4호
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    • pp.424-430
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    • 2021
  • The purpose of this study is to analyse the characteristics and spreading laws of parameters such as fire smoke, concentration of CO, visibility, and temperature at fire scene in high-rise residential buildings under the different conditions of fire doors and automatic fire extinguishing systems. Using Pyrosim to simulate diverse fire scenes in a high-rise apartment with corridors, to analyze the changes in those parameters. The results show that when a fire occurs, closing the fire-fighting corridor will increase the smoke temperature and concentration of CO in the stairwell, and reduce the height and visibility of the smoke layer; the automatic fire extinguishing system effectively suppresses the increase in the temperature of the fire smoke and the sedimentation of the smoke layer. Reasonable setting and operation of the automatic fire extinguishing system could effectively inhibit the spread of fire. Although closing fire corridor can slow down the direct upward spread of smoke through the corridor, it will force the fire smoke into the stairwell, which will seriously affect evacuation through the stairs. Therefore, in order to reduce risks, it is forbidden to close the fire doors of the firefighting corridor and stacking combustible materials in the corridor, Also, intensifying inspections and ensuring the normal operation of the automatic fire extinguishing system are indispensable. Based on the research results, the significance of installing fire-fighting facilities in the construction of high-rise apartments was discussed and proved.

Vibration of multilayered functionally graded deep beams under thermal load

  • Bashiri, Abdullateef H.;Akbas, Seref D.;Abdelrahman, Alaa A.;Assie, Amr;Eltaher, Mohamed A.;Mohamed, Elshahat F.
    • Geomechanics and Engineering
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    • 제24권6호
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    • pp.545-557
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    • 2021
  • Since the functionally graded materials (FGMs) are used extensively as thermal barriers in many of applications. Therefore, the current article focuses on studying and presenting dynamic responses of multilayer functionally graded (FG) deep beams placed in a thermal environment that is not addressed elsewhere. The material properties of each layer are proposed to be temperature-dependent and vary continuously through the height direction based on the Power-Law function. The deep layered beam is exposed to harmonic sinusoidal load and temperature rising. In the modelling of the multilayered FG deep beam, the two-dimensional (2D) plane stress continuum model is used. Equations of motion of deep composite beam with the associated boundary conditions are presented. In the frame of finite element method (FEM), the 2D twelve-node plane element is exploited to discretize the space domain through the length-thickness plane of the beam. In the solution of the dynamic problem, Newmark average acceleration method is used to solve the time domain incrementally. The developed procedure is verified and compared, and an excellent agreement is observed. In numerical examples, effects of graduation parameter, geometrical dimension and stacking sequence of layers on the time response of deep multilayer FG beams are investigated with temperature effects.

전류인가 방법이 3D-SiP용 Through Via Hole의 Filling에 미치는 영향 (The Effects of Current Types on Through Via Hole Filling for 3D-SiP Application)

  • 장근호;이재호
    • 마이크로전자및패키징학회지
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    • 제13권4호
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    • pp.45-50
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    • 2006
  • 3D package의 SiP에서 구리의 via filling은 매우 중요한 사항으로 package밀도가 높아짐에 따라 via의 크기가 줄어들며 전기도금법을 이용한 via filling이 연구되어왔다. Via filling시 via 내부에 결함이 발생하기 쉬운데 전해액 내에 억제제, 가속제등 첨가제를 첨가하고 펄스-역펄스(PRC)의 전류파형을 인가하여 결함이 없는 via의 filling이 가능하다. 본 연구에서는 건식 식각 방법 중 하나인 DRIE법을 이용하여 깊이 $100{\sim}190\;{\mu}m$, 직경이 각각 $50{\mu}m,\;20{\mu}m$인 2가지 형태의 via을 형성하였다. DRIE로 via가 형성된 Si wafer위에 IMP System으로 Cu의 Si으로 확산을 막기 위한 Ta층과 전해도금의 씨앗층인 Cu층을 형성하였다. Via시편은 직류, 펄스-역펄스의 전류 파형과 억제제, 가속제, 억제제의 첨가제를 모두 사용하여 filling을 시도하였고, 공정 후 via의 단면을 경면 가공하여 SEM으로 관찰하였다.

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펄스-역펄스 전착법을 이용한 SiP용 via의 구리 충진에 관한 연구 (Electroplating of Copper Using Pulse-Reverse Electroplating Method for SiP Via Filling)

  • 배진수;장근호;이재호
    • 마이크로전자및패키징학회지
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    • 제12권2호
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    • pp.129-134
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    • 2005
  • SiP의 3D패키지에 있어서 구리도금은 매우 중요한 역할을 한다 이러한 구리 도금의 조건을 알아보기 위하여 조건이 다른 전해질에서 전기화학적 I-V특성을 분석하였다. 첨가제로 억제제와 촉진제의 특성을 분석하였다. 3D 패키지에 있어서 직경 50, 75, $100{\mu}m$의 via를 사용하였다. Via의 높이는 $100{\mu}m$로 동일하였다. Via의 내부는 확산방지층으로 Ta을 전도성 씨앗층으로 Cu를 magnetron 스퍼터링 방법으로 도포하였다. 직류, 펄스, 펄스-역펄스 등 전류의 파형을 변화시키면서 구리 도금을 하였다. 직류만 사용하였을 경우에는 결함 없이 via가 채워지지 않았으며 펄스도금을 한 경우 구리 충진이 개선을 되었으나 결함이 발생하였다. 펄스-역펄스를 사용한 경우 결함 없는 구리 충진층을 얻을 수 있었다.

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