• 한국전기전자재료학회논문지
• /
• 제25권10호
• /
• pp.830-836
• /
• 2012

An efficient cooling system is essential for the electronic packaging such as a high-luminance LED lighting. A special heat transport technology, Pulsating Heat Pipe (PHP), can be applied to the cooling of LED lighting. In this paper, the operational characteristics of the PHP in the imposed thermal boundary conditions of LED lighting were experimentally investigated. The experimental PHP was made of copper tubes of internal diameter of 2.1 mm. The working fluids of ethanol, FC-72, water, acetone and R-123 were chosen for comparison. The results showed that an optimum range of charging ratio exists for high cooling performance; 50% for most of the fluids. Among the five working fluids, water showed the highest heat transfer rate of 260 W. Two distinguished characteristics of pulsating direction were identified. It is also identified that high vapor pressure gradient is one of key parameters for better heat transfer performance.

• 한국표면공학회지
• /
• 제52권2호
• /
• pp.58-61
• /
• 2019

The aim of this study is to quantitatively demonstrate the possibility of heat transfer by thermal radiation by comparing heat transfer by conventional heat transfer and radiation by radiation. 1) The heat transfer was measured by using filler of TIM material with low thermal conductivity (CuS). As a result, heat transfer was easier than ceramic with high thermal conductivity ($Al_2O_3$ and $Si_3N_4$). 2) The reason for this is thought to be that the infrared wave due to radiation of the air diaphragm has moved easily. 3) From the above results, the heat dissipation of the TIM material indicates the possibility of heat transfer by thermal radiation.

• Composites Research
• /
• 제30권5호
• /
• pp.288-296
• /
• 2017

본 연구에서는 전자기기 사용에 이슈가 되고 있는 발열 문제를 해결하고자 상변화물질(PCM)의 잠열 특성을 이용하여 폴리메틸메타크릴레이트(PMMA) 복합필름을 제조하고 방열 성능을 평가하였다. 이를 위해 용융온도가 서로 다른 두 가지의 상변화물질을 사용하여 제작한 PCM/PMMA 복합필름의 열적 특성을 비교 분석하여 다양한 사용조건에 따른 유효성을 검증하였고, Compression Molding 방법과 PCM Paste Sealing 방법에 따른 PCM/PMMA 복합필름의 방열 특성을 비교 분석하여 최대의 방열 효과를 달성할 수 있는 최적의 방법을 도출하였다. 또한 PCM/PMMA 복합필름의 방열 성능을 최대화하기 위해 열전도율이 높은 흑연과 그래핀을 추가로 적층하여 제조한 Hybrid 복합필름의 열적 특성을 분석하였고, 이들을 통해 향상된 방열 성능을 실험적으로 검증하였다. 본 연구를 통해 개발된 방열 성능이 우수한 복합필름은 다양한 전자기기에 활용되어 발열 문제를 효과적으로 해결할 수 있을 것으로 기대된다.

• 한국안전학회지
• /
• 제20권1호
• /
• pp.87-93
• /
• 2005

In this paper, we analyzed ignition characteristics of combustible material and the waveform of power dissipation, voltage and current by poor contact. And the surface structure of plug by poor contact was analyzed. In the results of experiment, the heat generated by poor contact and ignited the combustible material on power cord sets. The insulation material was molten and carbonized by the heat conduction though plug pit and voids were formed inside of insulation material. The waveform of voltage and power dissipation distorted because of a growth of oxidation by poor contact. In particular, in case that load was big load, the waveform of voltage and power dissipation severely distorted as with the passage of time. The surface of plug pin was changed from erosion mark to welding mark according to big load. The results will be applied to the cause analysis of electrical disaster.

• 마이크로전자및패키징학회지
• /
• 제20권3호
• /
• pp.75-80
• /
• 2013

전자패키징 기술의 발전에 따라 패키지의 소형화는 집적화에 따른 열 소산 면적 감소로 인하여 패키지의 온도 상승을 초래한다. 온도 상승은 소자의 성능을 저해하여, 시스템 고장을 발생을 유발시키며 수명을 단축시킨다. 본 연구에서는 마이크로 패턴과 세미 임베디드 구조를 결합하여 열 소산을 극대화 시킬 수 있는 새로운 구조를 제안하여 열특성을 평가하였다. 제안 구조의 열특성 평가 결과, 기존 구조에 비하여 최대 온도는 $20^{\circ}C$낮았으며, 범프의 최대 응력은 20%이상 감소하여 제안 구조의 유효성을 확인하였다.

• 한국전기전자재료학회논문지
• /
• 제27권10호
• /
• pp.673-677
• /
• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• 한국표면공학회지
• /
• 제48권2호
• /
• pp.33-37
• /
• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• 한국기계가공학회지
• /
• 제18권8호
• /
• pp.24-30
• /
• 2019

This study investigated the heat dissipation characteristics of a heat-sensitive LED. The results of the empirical test showed that the best temperature intensification was found at 90 with 15-fins, and the heatsink installed perpendicular to the direction of the flow of air was directly connected to the air in the largest heat shield area, leading to the best cooling, and the number of fin also resulted increase in the heat discharge area, resulting in the largest cooling action with 15 fins. It was found that the rate of air flow changed in the range of 1.5m/s to 2.5m/s, but only by a deviation of about $2^{\circ}C$ to $3^{\circ}C$ from the current state of 15 fins at 2.5m/s, and the rate of air flow increased, but the performance of the heat release was not significantly increased. As a result wind speed with minimum air flow conditions of 1.5m/s can greatly contribute to the heat dissipation performance.

• 산업경영시스템학회지
• /
• 제33권4호
• /
• pp.79-84
• /
• 2010

In recent years, conventional streetlight is replaced by LED streetlight to reduce power consumption dramatically and to maximize lighting effects. However the characteristic of power LED itself driven by high current to increase the illumination, we need to develop effective heat release device. This study suggests new concept of heat dissipation device using PCM (Phase Change Material) and shows an experiment results to investigate thermal effects of PCM.

• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
• /
• pp.318-319
• /
• 2006

The thermal dissipation performance of sintered heat pipes is usually determined by the capillarity and permeability of the Cu powder wicks. Since the capillary provided by the Cu powder is usually large enough to draw water from the condenser end to the evaporator end, the permeability has become the controlling factor. In this study, Cu powders with different particle sizes and shapes were loosely sintered, and their permeabilities were compared. The results show that more complicated shapes, finer particle sizes, lower porosities, and rougher pore surfaces give lower permeability and thermal dissipation.