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http://dx.doi.org/10.6117/kmeps.2013.20.3.075

A Study on the Optimization of Heat Dissipation in Flip-chip Package  

Park, Chul Gyun (Department of Cogno-Mechatronics Engineering, Pusan National University)
Lee, Tae Ho (The Institute of Opto-Mechatronics, Pusan National University)
Lee, Tae Kyoung (Samsung Electro-mechanics Co., Ltd.)
Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.20, no.3, 2013 , pp. 75-80 More about this Journal
Abstract
According to advance of electronic packaging technology, electronic package becomes smaller. Miniaturization of package causes the temperature rise of package. This can degrade life of electronic device and generate the failure of electronic system. In this study, we proposed a new semi-embedded structure with micro pattern for maximizing heat dissipation. A proposed structure showed the characteristics which have maximum temperature lower than $20^{\circ}C$ compared with conventional structure. And also, in view of thermal stress and strain, our structure showed a remarkably low value compared with other ones. We expect that the new structure proposed in this work can be applied to an flip-chip package of the future.
Keywords
FCBGA; Heat Dissipation; Electronic Packaging; Semi-Embedded structure;
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