A Study on the Optimization of Heat Dissipation in Flip-chip Package |
Park, Chul Gyun
(Department of Cogno-Mechatronics Engineering, Pusan National University)
Lee, Tae Ho (The Institute of Opto-Mechatronics, Pusan National University) Lee, Tae Kyoung (Samsung Electro-mechanics Co., Ltd.) Jeong, Myung Yung (Department of Cogno-Mechatronics Engineering, Pusan National University) |
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