• Journal of the korean Society of Automotive Engineers
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• v.5 no.1
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• pp.89-93
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• 1983

This paper describes on experimental investigation into the heat dissipation of Diesel engine, placing emphasis on the variations of compression ratio and cooling water temperature. The engine used for this test was a vertical single-cylinder four-cycle type, having a direct injection. Engine performance and heat transfer rates was tested under the compression ratio 14.3 and 17.4. In this study, the results showed that output and transfer rates of engine decrease in accordance with the decrease of compression ratio. The effect of cooling water temperature and injection delay of fuel on the heat dissipation brings about the decrease of heat transfer rates from cylinder to cooling water.

• The Transactions of the Korean Institute of Power Electronics
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• v.15 no.1
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• pp.27-34
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• 2010

To dissipate the heat generated from the switching devices in the inverter system of HEV, the water cooling structure is proposed. The bolt type cooling structure has a problem such as water leakage for high pressure of water, therefore the proposed cooling structure applied pipe structure in the heat sink. The heat dissipation characteristics for various structures of water channel and distance between heat source and water channel was analyzed through the simulation. heat dissipation effect for two types of water cooling structures was investigated. Based on the simulation results, two types of water cooling system for 30kW inverter system of HEV were manufactured and the heat dissipation effect was verified.

• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Journal of computational fluids engineering
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• v.11 no.2 s.33
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Korean Chemical Engineering Research
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• v.53 no.1
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• pp.91-102
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• 2015

Analytical solutions for the forced convection heat transfer of viscoelastic fluids obeying the Giesekus model are obtained in a concentric annulus under laminar flow for both thermal and hydrodynamic fully developed conditions. Boundary conditions are assumed to be (a) constant fluxes at the walls and (b) constant temperature at the walls. Temperature profiles and Nusselt numbers are derived from dimensionless energy equation. Subsequently, effects of elasticity, mobility parameter and viscous dissipation are discussed. Results show that by increasing elasticity, Nusselt number increases. However, this trend is reversed for constant wall temperature when viscous dissipation is weak. By increasing viscous dissipation, the Nusselt number decreases for the constant flux and increases for the constant wall temperature. For the wall cooling case, when the viscous dissipation exceeds a critical value, the generated heat overcomes the heat which is removed at the walls, and fluid heats up longitudinally.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2061-2066
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• 2007

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the hydraulic and heat transfer characteristics for the Wire-woven Bulk Kagome(WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen have been experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK are compared with other heat dissipation media. It was shown that heat transfer depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and other materials suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.5
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• pp.270-275
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• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.1
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• pp.15-22
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• 2008

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the fluid flow and heat transfer characteristics for the Wire-woven Bulk Kagome (WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen was experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK were compared with other heat dissipation media. It was shown that heat transfer characteristics depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and others suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.