• Transactions of the Korean Society of Mechanical Engineers B
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• v.33 no.12
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• pp.947-951
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• 2009

LED has the merits of high reliability, semi-permanent life, rapid-response and its small size for use as light source of head lamp. But the dependence of its performance and life on temperature affect on its practical use. Which dependence makes problem when the LED is heated up to a higher temperature level by self-generation of heat, due to "highly integration" to get enough quantity of light. To solve this problem, effective cooling system is needed that consider conduction, convection and radiation. This study points out the limits of natural convection cooling system and propose of forced convection with heat sink. Also, it describes a correlation between heat sink area and fluid velocity using numerical analysis to optimize the cooling system.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.5
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• pp.561-566
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• 2014

The high power COB(Chip on Board) LED, densely arranged chips on a board, are increasing to resolve heat problems in LED that has luminous semiconductor chips as main materials. In case of high-power COB LED, protection against heat is necessary due to the power consumption is high. Also if the temperature of device increases, the optical emission becomes less efficient and the life rapidly reduces due to thermal stress. This study packaged 13.5W COB LED and heat sink with difference form and produced 13.5W COB LED down-light heat sink by analyzing the thermal modes with Solidworks Flow Simulation. And finally it analyzed and evaluated the thermal modes using contacting and non-contacting thermometers.

• Transactions of the Korean Society of Mechanical Engineers
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• v.17 no.1
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• pp.172-181
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• 1993

Pseudo-Brayton cycle is defined as an ideal Brayton cycle admitting the difference between heat capacities of working fluid during heating and cooling processes. The endo-pseudo-Brayton cycle which is a pseudo-Brayton cycle with heat transfer processes is analyzed with the consideration of maximum power conditions and the results were compared with those of the endo-Carnot cycle and endo-Brayton cycle. As results, the maximum power is an extremum with respect to the cycle temperature and the flow heat capacities of heating and cooling processes. At the maximum power condition, the heat capacity of the cold side is smaller than that of heat sink flow. And the heat capacity of endo-Brayton cycle is always between those of heat source and sink flows and those of the working fluids of pseudo-Brayton cycle. There is another optimization problem to decide the distribution of heat transfer capacity to the hot and cold side heat exchangers. The ratios of the capacies of the endo-Brayton and the endo-pseudo-Braton cycles at the maximum power condition are just unity. With the same heat source and sink flows and with the same total heat transfer caqpacities, the maximum power output of the Carnot cycle is the least as expected, but the differences among them were small if the heat transfer capacity is not so large. The thermal efficiencies of the endo-Brayton and endo-Carnot cycle were proved to be 1-.root.(T$_{7}$/T$_{1}$) but it is not applicable to the pseudo-Brayton case, instead it depends on comparative sizes of heat capacities of the heat source and sink flow.w.

• Journal of Advanced Marine Engineering and Technology
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• v.29 no.8
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• pp.862-869
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• 2005

A study on convective cooling characteristics has been done in the channels with heat pipes and associated Plane fins Analysis with FLUENT V5.0 lies its Purpose on the possible enhancement of heat transfer capability between an existing three in-line arrayed heatpipes and an extending four in-line arrayed heatpipes with increasing channel width. Numerical analysis is limited to the laminar flow in an isolated flow channel by employing cyclic boundary conditions for calculation purposes. Friction factors for three and four in-line arrayed heatpipes are compared with experimental results. In addition, temperature behavior at the plate fin for the three in-line arrayed heatpipes is compared with experiment. Friction factors and overall channel heat transfer coefficients (and/or Nusselt numbers) are presented as a function of Reynolds number. An increase of number of heatpipes and channel width reults in a decrease of the friction factor and doesn't not result in an increase of heat transfer performance. However. considering the 25$\%$ increase of heat load accompanies with maximum 8$^{\circ}C$ rise of average temperature of heat pipes, the four in-line array with the increase of channel width of heat pipe heat sink can be considered appropriate.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.18 no.3
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• pp.257-268
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• 2014

The objective of the present study is to investigate thermal diffusion and radiation effects on unsteady MHD flow past a linearly accelerated vertical porous plate with variable temperature and also with variable mass diffusion in presence of heat source or sink under the influence of applied transverse magnetic field. The fluid considered here is a gray, absorbing/emitting radiation but a non-scattering medium. At time t > 0, the plate is linearly accelerated with a velocity $u=u_0t$ in its own plane. And at the same time, plate temperature and concentration levels near the plate raised linearly with time t. The dimensionless governing equations involved in the present analysis are solved using the closed analytical method. The velocity, temperature, concentration, skin-friction, the rate or heat transfer and the rate of mass transfer are studied through graphs in terms of different physical parameters like magnetic field parameter (M), radiation parameter (R), Schmidt parameter (Sc), Soret number (So), Heat source parameter (S), Prandtl number (Pr), thermal Grashof number (Gr), mass Grashof number (Gm) and time (t).

• Journal of Power System Engineering
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• v.10 no.4
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• pp.11-16
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously. The present experiment reveals that the cooling combination of the heat pipe and cooling fan is far superior to the conventional cooling device for the driving motor such as the fin-typed heat sink. When the driving voltage of 20V and 14V were supplied to the driving motor, the cooling performance of the rotary motor with heat pipe was 170% and 500%, respectively better than that without heat pipe on steady state condition.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.12
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• pp.1183-1189
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• 2004

An experimental investigation is conducted to measure phase change temperature and supercooling when acetone is added to TMA 30 wt% clathrate during cooling process in heat source. Also rate of volume change is investigated when acetone is added to TMA 30 wt% clathrate during the cooling process in heat source -8$^{\circ}C$. The results show that phase change temperature is about 4.5～5.5$^{\circ}C$ when acetone is added to TMA 30 wt% clathrate during the cooling process for heat sink temperature of -6, -7$^{\circ}C$ and -8$^{\circ}C$. Supercooling is repressed about 2～1$0^{\circ}C$ when 0.08 wt% acetone is added to it and rate of volume change is decreased about 2.9% when 0.1 wt% acetone is added for the heat sink temperature of -8$^{\circ}C$.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.12
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• pp.924-927
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• 2013

In this study, we proposed CMP-PLAs to replace the Al heat sinks as heat sink materials, and investigated heat dissipation characteristics of the LED lighting devices using them. The crystallinity of the proposed CMP-PLA heat sinks decreased with increasing carbon nanotube contents in CMP-PLA. However, the thermal conductivity was improved with the increase of the carbon nanotube contents. The heat dissipation characteristics of the LED lighting devices using CMP-PLA heat sinks was improved with increasing carbon nanotube contents in CMP-PLA. For the LED lighting devices using CMP-PLA heat sinks with 40% carbon nanotube contents, the initial temperature measured at the heat sink plate was $27^{\circ}C$, which increased as time, and it was saturated around $56^{\circ}C$ after an hour. The LED lighting devices using CMP-PLA heat sinks are expected to be functional materials that can reduce their weight and improve their electric properties, compared to those using existing Al heat sinks.

• Journal of the Korean Society for Precision Engineering
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• v.29 no.7
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• pp.778-784
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• 2012

In comparison with some other light sources, LED has merits such as increased life expectancy, fast response, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED has widely used in many industrial fields such as automotive, aviation, display, transportation and special lighting applications. Since the high heat generation of LED chips can cause a reduction in lifetime, degradation of luminous efficiency, and variation of color temperature, studies have been carried out on the optimization of LED packaging and heat sinks. In this study, experiments on measuring the heat generation rate of LED and the cooling performance of a heat sink were carried for analyzing the thermal characteristics of LED lighting system in free convection. From the results, dimensionless correlation on the cooling performance of heat sink in natural convection was proposed with Nusselt number and Rayleigh number as a guideline for designing cooling device of LED lightings.

• Korean Journal of Optics and Photonics
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• v.25 no.6
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• pp.311-314
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• 2014

In this paper, we design a helical fin structure for the heat sink for a high-power LED lighting module, and analyze its thermal properties. By means of the helical fin structure, we can obtain about 14% larger surface area for the limited volume and it can decrease the LED chip temperature by about 12%. Because this helical fin heat sink has 15% less total volume than a conventional one, we can also expect to reduce the production cost due to these structural properties.