• 설비공학논문집
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• 제18권10호
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• pp.826-834
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• 2006

A heat sink system using nanofluidic thermosyphon for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150 W at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. In the experimental study, the volume concentration of nano particles affect the system performance. Nanofluidic thermosyphon with 0.5% volume concentration showed the best performance. Nanofluid can increase CHF of the system compared with water as a working fluid. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• 한국산학기술학회논문지
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• 제14권3호
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• pp.1027-1032
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• 2013

LED는 저탄소 그린에너지 시대의 등기구로서 각광을 받고 있다. 다른 조명용 광원에 비해 친환경적이고 높은 에너지 효율을 가지고 있고 수명이 길다는 장점을 가지고 있지만, 공급전력 중 80%이상이 열에너지로 전환되며, 이에 따른 온도상승이 불가피 하여 높은 온도가 단점으로 꼽히고 있다. 온도상승은 LED소자의 수명에 영향을 미치기 때문에 방열시스템이 중요하게 자리 잡고 있다. 따라서 본 논문에서는 방열성능 향상을 위하여 LED 전구의 heat sink의 형상에 대한 열해석을 통하여 방열 시스템의 효용성을 분석하였다.

• International Journal of Aerospace System Engineering
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• 제1권1호
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• pp.44-47
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• 2014

This study proposes a development for the nano silver adhesive, which is applicable to high efficiency LED(light-emitting diode) light. The important issue of LED light is heat exhaust from LED. Generally, the middle area of LED light is increased up to 380K. Therefore, the bottleneck between LED chip and heat sink are caused by high temperature. In this work, the adhesive material between LED Chip and heat sink was newly developed for improvement of bottleneck. The nano silver was adopted to solve heat problem of chip on board package for LED light. In order to evaluate the performance of the nano silver adhesive, the thermal analysis was performed. Moreover both adhesive performance and heat exhaust were verified through the prototype test. From the experimental test results, it is found that the developed nano silver adhesive has the high performance.

• 한국마린엔지니어링학회:학술대회논문집
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• 한국마린엔지니어링학회 2012년도 전기공동학술대회 논문집
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• pp.130-132
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• 2012

In this paper, a temperature control for LED(Light Emitting Diode) lamp using a cooling fan is studied. An efficient temperature control scheme for the LED lamp using the fan wind at the lowest sound noise is studied. For the study, after measurement of the minimum sound noise of the fan and related temperature of the LED lamp through tests, experiments on temperature control of the LED lamp using the fan with various size of heat sinks was performed. To minimize the fan sound noise, optimal size of the heat sink was studied. Also, a teleoperting control of LED lamps using RF communication was studied.

• 대한기계학회논문집A
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• 제35권2호
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• pp.183-190
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• 2011

최근 이동통신 가입자의 증가로 인해 기지국의 수요도 증가하게 되었다. 하지만 기지국 설치 장소의 부족으로 인해 이동통신모듈의 크기가 소형화 되어야 할 필요성이 생겼다. 이동통신모듈의 소형화를 위해서는 모듈 겉면에 부착된 히트싱크의 크기가 소형화 되어야 한다. 또한 모듈의 열적 안정성을 보장하기 위해 설치된 전자부품의 온도가 허용온도보다 낮아야 한다. 이를 위해 상용 PIDO(Process Integration and Design Optimization) 툴인 PIAnO와 전산유체역학 프로그램인 FLOTHERM을 사용하여 전자부품의 온도를 허용온도보다 낮게 유지시키면서 히트싱크의 부피를 최소화하였다. 그 결과, 이동통신 모듈에 설치된 전자부품의 허용온도를 만족하면서 모듈의 부피를 41.9% 감소시킬 수 있었다.

• Nuclear Engineering and Technology
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• 제53권8호
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• pp.2477-2487
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• 2021

To improve safety analysis technology for a nuclear reactor containment considering an interaction between a reactor coolant system (RCS) and containment, this study aims at an experimental investigation on the integrated simulation of the RCS and containment, with an integral effect test facility, ATLAS-CUBE. For a realistic simulation of a pressure and temperature (P/T) transient, the containment simulation vessel was designed to preserve a volumetric scale equivalently to the RCS volume scale of ATLAS. Three test cases for a steam line break (SLB) transient were conducted with variation of the initial condition of the passive heat sink or the steam flow direction. The test results indicated a stratified behavior of the steam-gas mixture in the containment following a high-temperature steam injection in prior to the spray injection. The test case with a reduced heat transfer on the passive heat sink showed a faster increase of the P/T inside the containment. The effect of the steam flow direction was also investigated with respect to a multi-dimensional distribution of the local heat transfer on the passive heat sink. The integral effect test data obtained in this study will contribute to validating the evaluation methodology for mass and energy (M/E) and P/T transient of the containment.

• 한국항공우주학회지
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• 제42권9호
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• pp.789-794
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• 2014

정지궤도급 차세대 통신위성에 탑재될 디지털신호처리기에는 디지털 고속통신을 위한 FPGA가 사용된다. 적용된 FPGA는 높은 열소산량을 가지고 있으며, 이로 인한 접합온도의 상승은 부하경감 요구조건을 만족하기 어렵고 장비의 수명과 신뢰도 저하의 주요 원인이다. 지상과는 달리 우주환경에서의 전장품의 열제어는 대부분 열전도를 통하여 이루어지고 있다. CCGA 또는 BGA 형태의 FPGA는 인쇄회로기판에 장착되지만, 인쇄회로기판의 열전도율은 FPGA의 열제어에 효율적이지 못하다. FPGA의 열제어를 위하여 부품 리드와 하우징을 직접 연결하는 히트싱크를 제작하였으며, 우주인증레벨의 열진공시험을 통하여 그 성능을 확인하였다. 높은 전력소모량을 가진 FPGA는 우주환경에 적용하기 어려웠으나, 히트싱크를 적용함으로써 부하경감 온도 마진을 확보하였다.

• 한국전기전자재료학회논문지
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• 제26권12호
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• pp.920-923
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• 2013

In this paper, the characteristics of a carbon nanotube composite heat sink proposed to replace the advanced Al heat sinks for LED lighting devices were studied. Proposed CMP-PLA heat sink was made by mixing 20~70 wt% carbon nanotube, 20~70 wt% bio-degradable polymer of melt-blended PLA (poly lactic acid) and PBS (poly butylene succinate) and PLA nucleating agents composed of the mixture of soybean oil and biotites, at $150{\sim}220^{\circ}C$ with 1,000~1,500 rpm. Optical and electric characteristics of 7.5 W LED lighting devices using heat sinks with such prepared CMP-PLA were investigated. And, the properties of the heat, which was not released from the CMP-PLA type heat sinks, was also investigated. The color temperature of LED lighting devices using the CMP-PLA heat sinks was 5,956 K, which is x= 0.32 and y= 0.34 in the XY chromaticity, and the color rendering index was 75. The luminous flux and the luminous efficiency of LED lighting devices using the CMP-PLA heat sinks was 540.6 lm and 72.68 lm/W respectively. Measured initial temperature of the heat sinks was $27^{\circ}C$, and their temperature increased as time to be saturated at $52^{\circ}C$ after an hour.

• 한국전기전자재료학회논문지
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• 제29권6호
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• pp.380-385
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• 2016

Thermal characteristics of 20 W LED module on light thermal conductive plastic (TCP) heat sink were investigated in comparison with that on aluminum die casting alloy (ADC-12). Thermal simulations of the heat sinks were conducted by using flow simulation of SolidWorks with the following input parameters: density is 1.70 and $2.82kg/m^2$, thermal conductivity is 20 and $92W/(m{\cdot}K)$ for TCP and ADC-12, respectively. The simulated and measured temperatures of the LED modules on TCP heat sink were consistent with its measured temperature, which was $3^{\circ}C$ higher that on ADC-12. The fabricated LED module on TCP heat sink with a weight of 120.5 g was 30% lighter in weight than that of the ADC-12 reference with 171.0 g.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1022-1027
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• 2004

In this study, the shape of plate-fin type heat sink is numerically optimized to acquire the minimum pressure drop under the required temperature rise. To do this, a new sequential approximate optimization (SAO) is proposed and it is integrated with the computational fluid dynamics (CFD). In thermal/fluid systems for constrained nonlinear optimization problems, three fundamental difficulties such as high cost for function evaluations (i.e., pressure drop and thermal resistance), the absence of design sensitivity information, and the occurrence of numerical noise are confronted. To overcome these problems, the progressive quadratic response surface method (PQRSM), which is one of the sequential approximate optimization algorithms, is proposed and the heat sink is optimize by means of the PQRSM.