• Title/Summary/Keyword: Heat sink temperature

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The maximum power condition of the Brayton cycle with heat exchange processes (熱交換 過程 을 考慮한 브레이튼 사이클 의 最大出力條件)

  • 정평석;차진걸;노승탁
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.9 no.6
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    • pp.795-800
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    • 1985
  • The ideal Brayton cycle has been analyzed with the heat exchange processes between the working fluid and the heat source and the sink while their heat capacity rates are constant. The power fo the cycle can be expressed in terms of a temperature of the cycle and the heat capacity rate of the working fluid. There exists an optimum power condition where the heat capacity rate of the working fluid has a value between those of the heat source and the heat sink, and the cycle efficiency is determined by the inlet temperatures of the heat source and the sink.

Optimal Design of a Heat Sink using the Sequential Approximate Optimization Algorithm (순차적 근사최적화 기법을 이용한 방열판 최적설계)

  • Park Kyoungwoo;Choi Dong-Hoon
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.16 no.12
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    • pp.1156-1166
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    • 2004
  • The shape of plate-fin type heat sink is numerically optimized to acquire the minimum pressure drop under the required temperature rise. In constrained nonlinear optimization problems of thermal/fluid systems, three fundamental difficulties such as high computational cost for function evaluations (i.e., pressure drop and thermal resistance), the absence of design sensitivity information, and the occurrence of numerical noise are commonly confronted. Thus, a sequential approximate optimization (SAO) algorithm has been introduced because it is very hard to obtain the optimal solutions of fluid/thermal systems by means of gradient-based optimization techniques. In this study, the progressive quadratic response surface method (PQRSM) based on the trust region algorithm, which is one of sequential approximate optimization algorithms, is used for optimization and the heat sink is optimized by combining it with the computational fluid dynamics (CFD).

A Study on the Cooling of High Power LED Component using Flat Heat Pipe (히트파이프를 사용한 조명용 LED의 냉각에 대한 연구)

  • Jang, Young-Woon;Kim, Byung-Ho;Im, Ik-Tae
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.4
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    • pp.25-29
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    • 2009
  • In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

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A Study on Heat Simulation for Heat Radiation in 150W LED (150W LED등기구 방열을 위한 열 해석에 관한 연구)

  • So, Byung Moon
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.4
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    • pp.79-85
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    • 2016
  • For long life time and high efficiency, not necessary in improvement of LED chip structure, but also improve heat radiation for decrease heat in LED chip. In this study, efficiency decline factor has been investigated in LED lamp as study heat characteristic, luminance flux and heat resistance. When LED lamp temperature was increased, about 7% loss of luminance flux. In consequence of temperature analysis, width of fin was the most important factor of heat radiation. As a result, secure the enough heat path is very important factor of LED lamp design.

Thermal Characteristics of the Optimal Design on 15W COB LED Down Light Heat Sink (주거용 15W COB LED 다운라이트 방열판 최적설계에 따른 열적 특성 분석 및 평가)

  • Kwon, Jae-Hyun;Park, Keon-Jun;Kim, Tae-Hyung;Kim, Yong-Kab
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.2
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    • pp.401-407
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    • 2014
  • There are increasing interests in COB (Chip On Board) that densely arranged many LED chips on one board in order to solve the heat issue. There are many problems being on the rise: the lifespan decreases as the temperature of LED devices increases; Red Shift phenomenon, in which wave length of spectral line moves from original wave length to long wave length, occurs; and optical power decreases as $T_j$ increases. In order to resolve such problems, this study selected the optimum thickness and length of Fin, planned the second Heat sink that is optimum for COB LED with 15W, and analyzed thermal mode by Solid Works Flow Simulation through 15W COB packaging with the planned Heat sink. 15W COB down-light Heat sink that is produced based on this analysis was utilized to analyze thermal mode through contact thermometer and electrical properties through Kelthley 2430.

THE EFFECTS OF RADIAL HEAT SINK GEOMETRY AND SURFACE COATINGS ON THE LED COOLING PERFORMANCE FOR HIGH POWER LED LAMP (고출력 LED 램프 용 방사형 히트싱크의 형상 및 표면코팅이 LED 냉각성능에 미치는 영향에 대한 연구)

  • Kim, H.S.;Park, S.H.;Kim, D.;Kim, K.
    • Journal of computational fluids engineering
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    • v.18 no.1
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    • pp.63-68
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    • 2013
  • The purpose of this study is to investigate the cooling performance of radial heat sink used for high power LED lightings by natural convection cooling with surrounding air. Experimental and numerical analyses are carried out together. Parametric studies are performed to compare the effects of geometric parameters in radial heat sink such as the number of fins, fin height, fin length, and thickness of fin base as well as the surface coatings of radial heat sink. In this study, the cooling of 60 W LED lamp is examined with radiative heat transfer considered as well as natural convection. Numerical results show the optimum condition when the number of fin is 40, heat sink height is 120 mm, fin length is 15 mm, and fin base thickness is 3 mm. The difference in temperature of the LED metal PCB is within $1^{\circ}C$ between numerical analyses and experimental results. Also, the CNT coating on the heat sink surface is found to increase the cooling performance significantly.

Heat Transfer from Rectangular Fins with a Circular Base (원형 베이스와 사각 휜 주위의 열전달 해석)

  • Yu, Seung-Hwan;Lee, Kwan-Soo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.5
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    • pp.467-472
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    • 2011
  • The heat transfer over a radial heat sink, adapted for LED (light emitting diode) downlights, was experimentally and analytically investigated. We added radiation heat transfer into a previous calculation that neglected this factor. The numerical results agreed well with experimental results. Parametric studies were performed to compare the effects of the geometric parameters (fin length, fin height, ideal number of fins) and the operating parameter (heat flux) on the average heat-sink temperature from the heat-sink array. We found the fin length that maximizes the heattransfer performance. As the emissivity increased, the effect of geometric parameters on the radiation heat transfer decreased.

Optimal Design of a Heat Sink Using the Kriging Method (크리깅 방법에 의한 방열판 최적설계)

  • Ryu Je-Seon;Rew Keun-Ho;Park Kyoungwoo
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.29 no.10 s.241
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    • pp.1139-1147
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    • 2005
  • The shape optimal design of the plate-fin type heat sink with vortex generator is performed to minimize the pressure loss subjected to the desired maximum temperature numerically. Evaluation of the performance function, in general, is required much computational cost in fluid/thermal systems. Thus, global approximate optimization techniques have been introduced into the optimization of fluid/thermal systems. In this study, Kriging method Is used to obtain the optimal solutions associated with the computational fluid dynamics (CFD). The results show that when the temperature .rise is less than 40 K, the optimal design variables are $B_1=2.44\;mm,\;B_2=2.09\;mm$, and t=7.58 mm. Kriging method can dramatically reduce computational time by 1/6 times compared to SQP method so that the efficiency of Kriging method can be validated.

The Thermal and Circuits Design of an LED Bulb Considering Temperature Property (온도 특성을 고려한 LED 전구의 방열 및 회로 설계)

  • Song, Sang-Bin;Yeo, In-Seon
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.7
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    • pp.1261-1267
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    • 2007
  • Although LEDs have been used in various applications with improving the brightness and luminous efficacy, the electrical and optical characteristics of high power LED varies at different temperature and starting time. In this paper, optimal heat sink and apparatus design were conducted using IR camera and ICEPAK on the LED bulb consisting with fourteen LED array. The temperatures of heat sink and LED device of the designed LED bulb without cooling pan were $74^{\circ}C\;and\;96.8^{\circ}C$, respectively, showing in good themal characteristics. For high efficiency driving circuit of LED array adopted optimal heat sink design, driving circuits of constant voltage and current circuits were suggested and fabricated. As a result the efficacy of all driving circuits showed more than 20 lm/W. Also, the constant current circuits are suitable for signal lamp, hallway lamp, and flash lamp having short operating time(about 30 min). On the other hand, a reading light and indoor lamp having long operating time can be controlled by constant voltage circuit.