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http://dx.doi.org/10.6112/kscfe.2013.18.1.063

THE EFFECTS OF RADIAL HEAT SINK GEOMETRY AND SURFACE COATINGS ON THE LED COOLING PERFORMANCE FOR HIGH POWER LED LAMP  

Kim, H.S. (Graduate School, Dept. of Mechanical Engineering, Kumoh Nat'l Institute of Technology)
Park, S.H. (Dept. of Mechanical Engineering, Kumoh Nat'l Institute of Technology)
Kim, D. (Dept. of Mechanical Engineering, Kumoh Nat'l Institute of Technology)
Kim, K. (Dept. of Mechanical System Engineering, Kumoh Nat'l Institute of Technology)
Publication Information
Journal of computational fluids engineering / v.18, no.1, 2013 , pp. 63-68 More about this Journal
Abstract
The purpose of this study is to investigate the cooling performance of radial heat sink used for high power LED lightings by natural convection cooling with surrounding air. Experimental and numerical analyses are carried out together. Parametric studies are performed to compare the effects of geometric parameters in radial heat sink such as the number of fins, fin height, fin length, and thickness of fin base as well as the surface coatings of radial heat sink. In this study, the cooling of 60 W LED lamp is examined with radiative heat transfer considered as well as natural convection. Numerical results show the optimum condition when the number of fin is 40, heat sink height is 120 mm, fin length is 15 mm, and fin base thickness is 3 mm. The difference in temperature of the LED metal PCB is within $1^{\circ}C$ between numerical analyses and experimental results. Also, the CNT coating on the heat sink surface is found to increase the cooling performance significantly.
Keywords
LED(Light Emitting Diode); Heat Sink; Natural Convection; Radiation; Cooling Performance;
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1 2002, Steigerwald, D.A., Bhat, J.C., Collins, D., Fletcher, R. M., Holcomb, M.O. and Ludowise, M.J., "Illumination with solid state lighting technology," IEEE J. Sel. Top. Quantum Electron., Vol.8, pp.310-320.   DOI   ScienceOn
2 2004, Arik, M., Becker, C., Weaver, S. and Petroski, J., "Thermal management of LEDs: package to system," Proc. SPIE, Vol.5187, pp.64-75.
3 2008, Chi, W.-H., Chou, T.-L., Han, C.N. and Chiang, K.-N., "Analysis of thermal performance of high power light emitting diodes package," Proc. 10th Electronics Packaging Technology Conference, Singapore.
4 2008, Dialameh, L., Yaghoubi, M. and Abouali, O., "Natural convection from an array of horizontal rectangular thick fins with short length," Appl. Therm. Eng., Vol.28, pp.2371-2379.   DOI   ScienceOn
5 2009, Yu, S.H. and Lee, K.S., "Analysis of natural convection around radial heat sink," Proc. SAREK 2009 Summer Conference, pp.1172-1176.
6 2001, Guvenc, A. and Yüncü, H., "An experimental investigation on performance of rectangular fins on a horizontal base in free convection heat transfer," Heat Mass Transfer, Vol.37, pp. 409-416.   DOI