• 전력전자학회논문지
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• 제15권1호
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• pp.27-34
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• 2010

하이브리드 전기자동차(HEV)용 인버터의 스위칭 소자에서 발생하는 열을 효율적으로 냉각시키기 위한 수냉식구조를 제안한다. 기존의 볼트형 냉각구조는 강한 수압에서 누수현상이 발생할 수 있으므로 본 논문에서는 이를 방지하기 위해 방열판 내에 파이프 형태의 구조를 적용하였다. 발열원을 기준으로 수로의 이격거리 변화와 여러 형태의 수로에 대해 방열현상을 시뮬레이션으로 해석하고, 방열효과가 우수한 2가지 배관구조 모델을 기준으로 방열효과를 비교 분석하였다. 시뮬레이션 결과를 토대로 2가지 배관구조를 적용한 HEV용 30kW급 인버터를 제작하여 방열효과를 검증하였다.

• 한국생산제조학회지
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• 제20권1호
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.

• 한국통신학회논문지
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• 제38C권8호
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• pp.725-732
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• 2013

최근 LED의 저전력, 장수명, 동작 속도, 제어성, 고품질의 색 연출성, 지속 가능성 등의 이유로, LED 응용 분야가 확대되고 있다. 그러나 고출력 LED 조명 시스템을 구현하는데 있어, 방열은 큰 걸림돌이 되고 있다. 본 논문에서는 고출력 투광등 설계를 위한 방열 방안으로 메탈 PCB 설계, 열전 소자, 히트 파이프, 방열판, 팬(fan) 등의 적층 연동 구조를 제안하고 구현 방안을 제시하였다. 아울러 본 논문에서는 RS-485 통신을 통한 DMX512 프로토콜 기반 LED 조명 시스템 제어 방안을 제시하였다. DMX512 프로토콜은 조명장치와 조명제어 모듈의 연결에 대한 사실상 세계적 표준이며 이를 활용한 무대 조명이나 경관 조명 시스템 개발이 지속적으로 이루지고 있다. 본 논문에서는 이를 이용한 LED 조명 제어 및 응용 기술을 소개하고 주제어기를 무선으로 원격 제어하는 방안을 제안하였다.

• 한국에너지공학회:학술대회논문집
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• 한국에너지공학회 2000년도 춘계 학술발표회 논문집
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• pp.181-188
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• 2000

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 설비공학논문집
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• 제12권3호
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• pp.227-234
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• 2000

An experimental study was performed for understanding the limiting power and heat transfer characteristics of an MHP having the diameter of 3 or 4 mm which could be applied to cooling of miniature electronic equipment such as the notebook PC CPU etc. The experimental parameters which are inclination, structure of the wick, the length of the condenser and the total heat pipe were considered. The MHP with a woven-wired wick has the advantages of the improvement in capillary limit, the effective attachment tightly toward wall and the convenience in construction of wick. Cooling performance of the present MHP was compared with that of MHP with grooved, fine fiber and sintered type wick which were applied by existing enterprises. With respect to the inclination of$ -5^{\circ}$ , an MHP having the diameter of 3 or 4 mm shows the limiting power of 6~14 W. Therefore, it is expected that the MHP of the present study has sufficient applicability of cooling of notebook PC of which the amount of heat generated is about 12 W.

• 한국철도학회:학술대회논문집
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• 한국철도학회 2008년도 추계학술대회 논문집
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• pp.422-429
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• 2008

The objective of the present study is to develope a propultion unit cooling system for the next-generation High-speed EMU. The propulsion power control unit consists of some IGBT semiconductors. In general, those power semiconductors are very sensitive to temperatures and need a cooling system to keep them at a proper operational conditions in the range of $50{\sim}100^{\circ}C$. In this first year of study, we tried to focuss on the understanding of fundamental technologies for each of the two different cooling systems and collecting basic data for design and manufacturing for both cases. For the water cooling system, a heat sink with multi channels of liquid flow was considered and a model unit was designed and performance test was conducted. For the heat pipe cooling system, a Loop Heat Pipe(LHP) was considered as an element to transport heat from IGBT to environment air flow and a model unit was designed and performance test was conducted. The analysis using SINDA/FLUINT showed that those design parameters are good enough for the LHP to properly operate under a heat load up to around 360W.

• Transactions on Electrical and Electronic Materials
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• 제15권5호
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• pp.270-274
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• 2014

Currently, LED headlamps are only attached to newly manufactured vehicles, and it remains difficult to mount LED headlamps on used cars. Therefore LED headlamps need to be developed for used cars as a replacement of their halogen lamps. Due to a number of spatial limitations, it is critical to ensure a certain level of thermal performance. In order to obtain a design for efficient heat radiation, this paper aimed to optimize thermal management through a combination of heat sinks, heat pipes and fans. Based on such a design, this paper succeeded in developing LED headlamps of the desired performance to replace the halogen bulbs of used cars.

• KIEAE Journal
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• 제14권6호
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• pp.81-86
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• 2014

In recent years, many researchers have considered the building energy consumption reduction accordingly to deal with abnormal climate changes and greenhouse gas reduction. However, the lighting energy use ratio has increased in spite of the development of the high efficiency lighting device. Therefore, the study aims to produce the LED lighting applications for the effective lighting heat removal by using the heat characteristics of LED lighting and analyzing the heat removal effect. In order to increase radiant heat efficiency, the heat pipe and heat sink was attached on PCB as LED lighting applications. Experiment was conducted to verify the temperature and air velocity of inside duct: thermocouples, anemometer. The heat removal effect of LED lighting applications was measured by observing the temperature of the lighting applications and the change of air velocity in duct. The experiment shows that the temperature change in the duct according to air velocity was $0.9{\sim}5.8^{\circ}C$. It is also concluded that heat removal was calculated from 33 to 81W.

• 조명전기설비학회논문지
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• 제29권1호
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• pp.15-21
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• 2015

The purpose of this paper is to analyze thermal characteristics of the heat sinks to maximize the thermal diffusivity for LED floodlight. The 2 kind of samples were prepared by vapor chamber manufacturing technology using the heat pipe principle. It was analyzed the maximum temperature reduction effect and the thermal diffusion from the heat source depending on the types of chambers with 3 kind of working fluids. As a result, it was confirmed that thermal conductivity 23% increased, GVC-R type than IVC-R type.