• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.13 no.8
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• pp.701-709
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• 2001

In this days, heat pipe heat sink has been widely applied to power controllers for railway substations to remove heat from power semiconductors(diodes or thyristors). The heat pipe heat sink consists of a aluminum heating block for mounting the thyristor, 2~3 heat pipes and large number of aluminum fins. The present study was to get fundamental informations of the structure, design parameters and heat transfer performances of heat pipe heat sink. Series of operational test for a unit with 3 heat pipes were performed and its heat flow circuit was analysed from the experimentally obtained data on wall temperature distribution. Total resistance was ranged 0.02~$0.03^{\circ}C$/W for a power range from 40W to400W. The time to get the steady state was approximately longer than 20 minutes, and overshooting was not occurred during start up operation.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2438-2443
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• 2007

In order to guarantee the performance of electronic products. It is needed to improve the cooling performance of heat sink. So this paper has been made to investigate the cooling performance for the aluminum heat sink using pulsating heat pipe(PHP). The pulsating heat pipe was used as a heat spreader. Working fluid was R-22. Heater (50 mm ${\times}$ 50 mm ${\times}$ 3mm) was attached to heat sink and it generated 30W, 60W, 80W, 100W. Heat sink was tested for forced convection with 1${\sim}$4m/s of inlet air velocity. And both type heat sinks were carried out by using CFD simulation. This study showed that pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.1016-1021
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• 2011

The enhancement for cooling performance of heat sink is surely necessary to guarantee the performance of electronic products. So in this paper, the cooling performances of the aluminum heat sink with pulsating heat pipe(PHP) were investigated experimentally and numerically. The pulsating heat pipe was used as a heat spreader. Working fluid of PHP was R-22. Heat inputs were 30W, 60W, 80W and 100W, respectively. Heat sink was tested for forced convection conditions with air velocity of 1 ~ 4m/s. And CFD simulations were conducted for two different heat sinks. The results showed that the cooling performance of heat sink with pulsating heat pipe was higher than that of conventional heat sink. Therefore, the pulsating heat pipe can be a good tool to improve cooling performance of heat sink.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.11-16
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously. The present experiment reveals that the cooling combination of the heat pipe and cooling fan is far superior to the conventional cooling device for the driving motor such as the fin-typed heat sink. When the driving voltage of 20V and 14V were supplied to the driving motor, the cooling performance of the rotary motor with heat pipe was 170% and 500%, respectively better than that without heat pipe on steady state condition.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.25-29
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• 2009

In this study, a thin plate-type heat pipe, instead of a solid aluminium heat sink, is used to eliminate heat released from LED components for lighting. Effects of the heat pipe size and installation angle are studied both in numerically and experimentally. According to the results, temperature on LED chip, when a heat pipe is used, is $1.2^{\circ}C$ lower than using the conventional metal PCB. The overall temperature drop is $32^{\circ}C$ if the heat pipe is properly used. The highest cooling performance is obtained in the case when the angle of a heat pipe installation is $90^{\circ}$.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.8
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• pp.664-670
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• 2002

A heat sink (HS) system using heat pipes for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150w at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. To do so, however, the interior temperature distribution had to be verified by experimental results. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.1168-1173
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• 2006

This research is to verify the cooling effect of the acting surface on the rotary motor using heat pipe and conventional cooling fan. In order to show the cooling performance of the rotary motor and heat pipe with the fin-typed heat sink, the surface temperature of the motor and condenser was measured in real time. The experiments were also conducted as for not only cooling device installed with heat pipe only, but with heat pipe and conventional cooling fan simultaneously.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.899-900
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• 2010

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.12
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• pp.1711-1720
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• 2001

In this study, the heat transfer characteristics of a U-shape heat pipes were investigated. Heat is supplied to the U heat pipe through its middle zone(evaporator), and is released to the environment through its both arms(condensers). Both heat transfer coefficients and heat transport limitations were measured and compared with correlations previously developed for straight type heat pipes. Special concerns were focused to the cases, when each of condensers were submitted to a different cooling conditions, relatively. As a result. the heat transfer limitation of a U-shape heat pipe was found out to be 10∼15% less than the value for a straight heat pipe with an equivalent size.

• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.3
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• pp.203-212
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• 2004

The heat pipe for cooling power semiconductor is required no performance changing during the life cycle up to 20 years. For the long reliable performance of the heat pipe, my reasons that has possibility to generate non condensable gases we not allowed. In this research, the maximum heat transport rate and operation characteristics that are related to various geometric and thermal conditions are carried out. Also the test items, specifications and methods to guarantee the long life cycle of the heat pipe for power semiconductor cooling device are provided and the tests are performed.