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Heat Pipe Heat Sink Development for Electronics Cooling  

이기우 (한국에너지기술연구원 폐열이용연구센터)
박기호 (한국에너지기술연구원 폐열이용연구센터)
이석호 (한국에너지기술연구원 폐열이용연구센터)
유성연 (충남대학교 기계설계공학과)
Publication Information
Korean Journal of Air-Conditioning and Refrigeration Engineering / v.14, no.8, 2002 , pp. 664-670 More about this Journal
Abstract
A heat sink (HS) system using heat pipes for electronics systems was studied. The experimental results indicate that a cooling capacity of up to 150w at an overall temperature difference of $50^{\circ}C$ can be attainable. The heat sink design program also showed that a computer simulation can predict the most of the parameters involved. To do so, however, the interior temperature distribution had to be verified by experimental results. The current simulation results were close to the experimental results in acceptable range. The simulation study showed that the design program can be a good tool to predict the effects of various parameters involved in the optimum design of the heat sink.
Keywords
Heat pipe; Heat sink; Screen wick;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
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