• Korean Journal of Remote Sensing
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• v.36 no.5_4
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• pp.1153-1166
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• 2020

The purpose of this study was to analyze the spatial correlation between the heat distribution map of the satellite imaging base and the factors that deepen the heat wave, and to explore the heat concentration area and the space where the risk of future heat wave may increase. The global Moran's I of population, land use, and buildings, which are the causes of heat concentration and heat wave deepening, is found to be high and concentrated in specific spaces. According to the analysis results of local Moran's I, heat concentration areas appeared mainly in large cities such as metropolitan and metropolitan areas, and forests were dominant in areas with relatively low temperatures. Areas with high population growth rates were distributed in the surrounding areas of Gyeonggi-do, Daejeon, and Busan, and the use of land and buildings were concentrated in the metropolitan area and large cities. Analysis by Bivarate Local Moran's I has shown that population growth is high in heat-intensive areas, and that artificial and urban building environments and land use take place. The results of this research can lead to the ranking of heat concentration areas and explore areas with environments where heat concentration is concentrated nationwide and deepens it, so ultimately it is considered to contribute to the establishment of preemptive measures to deal with extreme heat.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.6
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• pp.586-591
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• 2015

This study discusses numerically-explored thermal performances of hybrid fin heat sinks (HF HSs) for lightweight thermal management of LED modules under natural convection. A hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS) are proposed as HF HSs. A 3-D CFD analysis has been carefully conducted to obtain reliable numerical results. The 3-D CFD study investigates the effects of both fin spacing and an internal channel diameter on performances of the HHF HS and the SHF HS. The study results show that the mass-based thermal resistance of the HHF HS is 20~32% smaller compared with the pin fin heat sink (PF HS). The results also show that the mass-based thermal resistance of the HHF HS decreases with the increase of the channel diameter. These results are mainly due to coupled effects of the mass reduction and heat pumping through an internal channel. Considerably superior mass-based thermal performances of the HHF HS to the conventional PF HS suggest the feasible application for the lightweight thermal management of the LED modules under natural convection.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.04a
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• pp.465-465
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• 2011

Rolls-Royce is a global company producing advanced power systems for use on land, at sea and in the air. In order to develop competitive products and services, Rolls-Royce invests in technology, infrastructure and capability with much of the research carried out in a global network of University Technology Centres, such as the UTC in Thermal management at Pusan National University. Heat exchangers and thermal management play a critical role in today's gas turbine engines, maintaining the fuel and oil temperatures within the correct operational range. Future products are likely to place an increased duty on the thermal management system and thus require advances in heat exchanger design, installation and manufacturing. Heat exchangers further have the potential to play a vital role in Advanced Cycle Gas Turbine products. The Intercooled and recuperated WR21 marine gas turbine engine recently entered service with the Royal Navy and is delivering very attractive fuel burn in service. The development of an advanced cycle aero-engine is a significantly greater challenge, requiring better understanding of compact and light weight heat exchanger surfaces, novel installations and ducting systems and may required novel manufacturing techniques to achieve the volume, weight and cost necessary to realise a viable advanced cycle gas turbine aero-engine.

• Journal of Korean Society for Quality Management
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• v.47 no.3
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• pp.425-435
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• 2019

Purpose: The purpose of this study was to resolve the Naval ship's Local Operation Panel(LOP) malfunction problems which caused by overheating in summer season and dispatching to equatorial regions. Methods: Instead of using dual type heat insulation materials(consist with ceramic wool and glass wool), aerogel heat insulation materials were used for decreasing heat emissions from gas-turbine heat waste steam pipes passing water-jet- room. Experiment and Computational analysis of heat flow were conducted to analyze the internal room temperature changes. Results: The results of this study are as follows; The aerogel heat insulation materials suppress heat emission more efficiently than dual type insulation materials. The cold surface temperature of insulation was far more decreased and internal room, LOP surface temperature also showed significant results too. Conclusion: The substituted heat insulation materials appeared remarkable performance in decreasing room temperature that it could be used for suppressing the LOP overheatings and malfunctions.

• Transactions of the Korean hydrogen and new energy society
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• v.35 no.2
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• pp.205-215
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• 2024

This study introduced a direct contact heat exchanger to enhance the efficiency of polymer electrolyte membrane fuel cells (PEMFCs) systems. According to previous research, 28% of the operating costs of fuel cell systems are attributed to heat exchanger devices, prompting the design of a direct contact heat exchanger to address this issue. Optimal configurations were determined through computational fluid dynamics analysis and experimental device fabrication, and the enhanced heat exchange performance of the heat exchanger was experimentally confirmed. Through this, the contribution of the direct contact heat exchanger to the heat management and efficiency enhancement of PEMFC systems was established.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Korea Safety Management & Science
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• v.15 no.2
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• pp.129-134
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• 2013

In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structure inside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. In case of modifying the arrangement of electronic parts on the PCB inside the multi channel temperature measurement board devices, radiant heat effects did not show a rising tendency, whereas the overall temperature went down in case of installing the vents in the outer case of PCB circuit board devices. In terms of installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, in case of mounting the fan as a cooling device by considering various user environments for multi channel temperature measurement board devices, the radiant heat effects were shown higher than in case of installing the vents, and the middle sections were the most appropriate to its installation location. In case of changing the wind quantity of the fan from its selected installation location, the best radiant heat effects were shown at high speed as expected.

• Journal of the Korea Safety Management & Science
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• v.17 no.4
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• pp.113-121
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• 2015

This study aims to examine the risk of electrical fire in places where electric heat wires are used. In general, the use of electric heating wires is becoming more common and prevalent in a bid to prevent increasing damage caused by freezing and bursting in residential water pipes, factory pipes and irrigation pipes in vinyl greenhouse and a variety of heat wire products are available in market with legal safety requirements imposed on them. However, the widespread use of anti-freezing burst heat wire products has caused increasing incidents of fire, which often fail to be incorporated into statistics due to quick onsite extinguishing and insignificant damage although damage is gradually on the rise. Against this backdrop, this study aims to look into the possibility of ignition caused by electric heat wires and the mechanism of how it turns into catching fire through overheat and short circuit tests for anti-freezing burst electrical heat wires (hereinafter called the 'heat wire') and expects to serve as the basis for further observations and analyses on the cause of fire and the process of ignition in a scientific manner.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.5-9
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• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.398-403
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• 2009

The theoretical bases on characteristics of heat release rate in compartment of building for scenario of smoke management are introduced and the numerical applications to simple compartment model are carried out. The growth stage which is important for smoke management design is modelled as t-squared fire curve including fire growth coefficient with related to growth rate. The conditions for the happening of flashover is presented such as $600^{\circ}C$ of temperature or $20kW/m^2$ of radiation heat flux. After the flashover happen, the fire in compartment changes to fully developed fire having the characteristics of ventilation-controlled fire. As the result of numerical analysis to simple compartment model, the time to reach 900K under ceiling for condition of medium growth is twice for condition of fast growth.