1 |
S,H, Park, M,C, Choi, "Experimental Study on Thermal Performance of Piezoelectric Fan in an Encolsure", Journal of mechanical science and technology, B, vol 30, No12, pp.1173-1180, 2006
|
2 |
Y,S, Son, J,Y, Shin, "Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer", Journal of mechanical science and technology , D, pp.390-395, 2001
|
3 |
H,Y, Pak, K,W, Park, "A Numerical Study on the Effect of PCB Structure Variation on the Electronic Equipment Cooling", Journal of mechanical science and technology, vol19, No12, pp.3329-3343, 1995
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