• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.271-272
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• 2019

본 논문은 친환경 전기차용에 적용되는 있는 고밀도 LDC(Low-Voltage DC-DC Converter) 전력변환장치의 PCB구조와 스위칭소자에 따른 PCB의 발열특성을 해석한다. 전력변환장치 PCB사이에 알루미늄 플레이트를 적용하여 다면 방열경로를 통한 PCB방열특성을 비교하고, 또한 기존 Si-FET와 낮은 온 상태 도통저항을 가지는 GaN-FET 반도체디바이스를 적용한 전력변환장치의 PCB 방열특성을 시뮬레이션을 통해 비교 및 검토하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.4
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• pp.41-47
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• 2019

The advent of highly integrated, high-power electronics requires low a coefficient of thermal expansion performance to prevent delamination between the heat dissipation material and substrate. This paper reports a preliminary study on the manufacturing technology of gas reaction control composite material, focusing on the prediction of the thermal expansion coefficients of Al-AlN composite materials. We obtained numerical equivalent property values by using finite element analysis and compared the values with theoretical formulas. Al-AlN should become the optimal composite material when the proportion of the reinforcing phase is approximately 0.45.

• Proceedings of the KIPE Conference
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• 2020.08a
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• pp.115-117
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• 2020

본 논문에서는 300kW급 모듈형 NPC 인버터의 방열 설계를 위해 전력반도체 스위치 소자의 손실을 분석하여 열적 특성을 고려한 인버터 모듈을 설계하고 제작을 하였다. 전력반도체 스위치의 손실은 스위칭 손실과 도통손실로 구분되며, 대부분 열손실로 나타나기 때문에 발열량을 토대로 방열판의 구조 및 크기를 결정하였다. 인버터 높은 출력비를 얻기 위해서는 열 손실을 고려한 방열판 설계는 반드시 필요한 과정으로 설계 과정의 타당성을 검증하기 위해 PLECS를 통한 시뮬레이션과 실험결과를 비교하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.7
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• pp.310-316
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• 2019

In automotive application, customers are demanding high efficiency and various functions for convenience. The demand for these automotive applications is steadily increasing. In this study, it has been studied the analysis of heat flow to improve the PCB(printed circuit board) heating performance of WPC (wireless power charger) recently developed for convenience. The charging performance of the wireless charger has been reduced due to power dissipation and thermal resistance of PCB. Therefore, it has been proposed optimal PCB design, layout and position of electronic parts through the simulation of heat flow analysis and PCB design was analyzed and decided at each design stage. Then, the experimental test is performed to verify the consistency of the analysis results under actual environmental conditions. In this paper, The PCB modeling and heat flow simulation in transient response were performed using HyperLynx Thermal and FloTHERM. In addition, the measurement was performed using infrared thermal imaging camera and used to verify the analysis results. In the final comparison, the error between analysis and experiment was found to be less than 10 % and the heating performance of PCB was also improved.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국전산유체공학회:학술대회논문집
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• 2006.10a
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• pp.181-184
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• 2006

High-speed flight vehicle have various cavities. The supersonic cavity flow is complicated due to vortices, flow separation and reattachment, shock and expansion waves. The general cavity flow phenomena include the formation and dissipation of vortices, which induce oscillation and noise. The oscillation and noise greatly affect flow control, chemical reaction, and heat transfer processes. The supersonic cavity' flow with high Reynolds number is characterized by the pressure oscillation due to turbulent shear layer, cavity geometry, and resonance phenomenon based on external flow conditions, The resonance phenomena can damage the structures around the cavity and negatively affect aerodynamic performance and stability. In the present study, we performed numerical analysis of cavities by applying the unsteady, compressible three dimensional Reynolds-Averaged Navier-Stokes(RANS) equations with the ${\kappa}-{\omega}$ turbulence model. The cavity model used for numerical calculation had a depth(D) of 15mm cavity aspect ratio(L/D) of 3, width to spanwise ratio(W/D) of 1.0 to 5.0. Based on the PSD(Power Spectral Density) and CSD(Cross Spectral Density) analysis of the pressure variation, the dominant frequency was analyized and compared with the results of Rossiter's Eq.

• Journal of computational fluids engineering
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• v.11 no.4 s.35
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• pp.62-66
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• 2006

High-speed flight vehicle have various cavities. The supersonic cavity flow is complicated due to vortices, flow separation, reattachment, shock waves and expansion waves. The general cavity flow phenomena includes the formation and dissipation of vortices, which induce oscillation and noise. The oscillation and noise greatly affect flow control, chemical reaction, and heat transfer processes. The supersonic cavity flow with high Reynolds number is characterized by the pressure oscillation due to turbulent shear layer, cavity geometry, and resonance phenomenon based on external flow conditions. The resonance phenomena can damage the structures around the cavity and negatively affect aerodynamic performance and stability. In the present study, we performed numerical analysis of cavities by applying the unsteady, compressible three dimensional Reynolds-Averaged Navier-Stokes(RANS) equations with the ${\kappa}-{\omega}$ turbulence model. The cavity model used for numerical calculation had a depth(D) of 15mm cavity aspect ratio (L/D) of 3, width to spanwise ratio(W/D) of 1.0 to 5.0. Based on the PSD(Power Spectral Density) and CSD(Cross Spectral Density) analysis of the pressure variation, the dominant frequency was analyzed and compared with the results of Rossiter's Eq.

• Transactions of The Korea Fluid Power Systems Society
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• v.5 no.4
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• pp.17-25
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• 2008

This study presents an analytical model of the pneumatic circuit of an air suspension system to analyze the characteristics of vehicle height control. The analytical model was developed through the co-simulation of Simulink(air spring) and HyPneu(pneumatic circuit). Variant effective area of air spring and flow coefficients of pneumatic valves were estimated experimentally prior to the system test, and utilized in simulation. One-comer test apparatus was established using the components of commercial air suspension products. The results of simulation and experiment were so close that the proposed analytical model in this study was validated. However the frictional loss of conduit and heat dissipation which were ignored in this study need to be considered in future study. As an application example of proposed analytical model, an alternative pneumatic circuit of air suspension to conventional WABCO circuit was evaluated. The comparison of simulation results of WABCO circuit and alternative circuit show that proposed analytical model of co-simulation in this study is useful for the study of pneumatic system of automotive air suspension.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.409-414
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• 2017

The aim of this study is to understand the phonon transfer characteristics of a silicon thin film transistor. For this purpose, the Joule heating mechanism was considered through the electron-phonon interaction model whose validation has been done. The phonon transport characteristics were investigated in terms of phonon mean free path for the variations in the device power and silicon layer thickness from 41 nm to 177 nm. The results may be used for developing the thermal design strategy for achieving reliability and efficiency of the silicon-on-insulator (SOI) transistor, further, they will increase the understanding of heat conduction in SOI systems, which are very important in the semiconductor industry and the nano-fabrication technology.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.12
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• pp.1844-1851
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• 2017

As the capacity of the wireless power transmission increases, a higher supply current which may induce current in nearby conductive parts requires. Induced current may affect electric shock to the human body and malfunction of the electrical equipment. In order to prevent such induced phenomena as a risk factor, shielding is required between the source of the wireless power transmission and the conductive parts. The resonance frequency for the large capacity wireless power transmission has the wavelength of several hundred meters, so most environments are included in the near-field area. By wave impedance, the electric field has higher density in the near-field area and needs to be analyze for protecting. For this purpose, it is necessary to select a substance having a larger electric conductivity and optimized shielding structure. In this paper, an aluminum base shielding structure was presented to conduct experiments on thickness, position, and heat dissipation. In the 35 kW, 60 kHz environments, the optimized 5T Al base shielding structure attenuates the induced current to 43 %.