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http://dx.doi.org/10.5762/KAIS.2019.20.7.310

A Study on the Thermal Flow Analysis for Heat Performance Improvement of a Wireless Power Charger  

Kim, Pyeong-Jun (Electronics Reliability Test Team, Seoyon Electronics)
Park, Dong-Kyou (Department of Electromechanical Convergence Engineering, Korea University of Technology and Education)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.20, no.7, 2019 , pp. 310-316 More about this Journal
Abstract
In automotive application, customers are demanding high efficiency and various functions for convenience. The demand for these automotive applications is steadily increasing. In this study, it has been studied the analysis of heat flow to improve the PCB(printed circuit board) heating performance of WPC (wireless power charger) recently developed for convenience. The charging performance of the wireless charger has been reduced due to power dissipation and thermal resistance of PCB. Therefore, it has been proposed optimal PCB design, layout and position of electronic parts through the simulation of heat flow analysis and PCB design was analyzed and decided at each design stage. Then, the experimental test is performed to verify the consistency of the analysis results under actual environmental conditions. In this paper, The PCB modeling and heat flow simulation in transient response were performed using HyperLynx Thermal and FloTHERM. In addition, the measurement was performed using infrared thermal imaging camera and used to verify the analysis results. In the final comparison, the error between analysis and experiment was found to be less than 10 % and the heating performance of PCB was also improved.
Keywords
Thermal Flow Analysis; WPC(Wireless Power Charger); CFD(Computational Fluid Dynamics); PCB(Printed Circuit Board); Transient Response Analysis;
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