• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 2003년도 추계학술대회 논문집
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• pp.269-273
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• 2003

In this paper the HTS current lead for superconducting device is studied numerical method. The current lead is cooled by surrounded He gas by natural convection. To find wall heat flux, the linearization method is adopted Numerical results using natural convection cooling are compared with conventional cooling methods such as conduction cooling and vapor cooling. The results shows that the minimum heat dissipation is much smaller than conduction cooling. Also, the minimum heat dissipation is obtained for the non-zero gradient of temperature at warm end. HTS current lead operating current sharing mode is reduce heat flow to superconducting system.

• Journal of Advanced Marine Engineering and Technology
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• 제40권2호
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• 마이크로전자및패키징학회지
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• 제22권2호
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• pp.5-9
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• 2015

3차원 적층 반도체에서의 열관리를 위한 연구 동향에 대해서 살펴보았다. 적층 구조는 평면구조와 달리 단위 패키지당 발열량 증가, 단위 바닥면적당 전력 소비량 증가, 이웃 칩의 영향으로 과열 가능성의 증가, 냉각구조 추가의 어려움, 국부 열원의 발달 등으로 발열 문제가 매우 심각해질 수 있으며, 특히 국부 열원은 적층을 위해 칩 두께가 얇아짐으로 더욱 심화되고 있어 이를 고려한 발열관리가 필요하다. 구리 TSV는 높은 열전도도를 이용하여 열원의 열을 효과적으로 주변으로 배출하는 역할을 하며 범프 및 gap 충진 재료, 적층 순서와 함께 적층 반도체의 열확산에 큰 영향을 미친다. 이는 실험으로나 수치해석으로 확인되고 있으며, 향후 적층 구조의 각 구성 요소들의 열 특성을 반영한 회로 설계가 이루어질 것으로 예상된다.

• 한국전기전자재료학회논문지
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• 제27권10호
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.12.2-12.2
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• 2005

• 대한기계학회논문집B
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• 제37권1호
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• pp.75-79
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• 2013

반도체 수요의 폭발적인 증가와 기술의 진보로 단위면적당 소자수가 늘어나고 있다. 그에 따라 단위면적당 발열량이 더욱 높아져서 반도체의 수명과 신뢰성 보장을 위한 냉각문제의 해결이 점점 중요해지고 있다. 특히, 집적도를 높이기 위해 소자를 기판에 매립하는 chip-in-board (CIB) 패키지에서는 방열이 더욱 심각한 문제가 된다. 본 논문에서는 각기 다른 재질의 층으로 구성된 열 전달모형을 설정하고, 3 차원 열 전달 해석으로 적절한 경계 조건에 맞추어 계산하였다. 이를 토대로 발열량을 정량적으로 예측하여 실제모델에 적용 될 수 있는 설계자료로 이용하고자 한다.

• Journal of Information Display
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• 제13권1호
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of Electrical Engineering and Technology
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• 제12권5호
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• pp.1934-1944
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• 2017

As a key component of high-voltage power conversion system for electric vehicles (EVs), bidirectional DC/DC (Bi-DC/DC) is required to have high efficiency and light weight. Conventional design methods optimize the Bi-DC/DC at the maximum power dissipation point (MPDP). For EVs application, the work condition of the Bi-DC/DC is not strict as the MPDP, where the design method using MPDP may not be optimal during travel of EVs. This paper optimizes the Bi-DC/DC converter targeting efficiency and weight based on the driving cycle. By analyzing the two-phase interleaved Bi-DC/DC for hybrid energy storage systems (HESS) of EVs, its power dissipation is calculated, and an efficiency model is derived. On this basis, weight models of capacitor, inductor and heat sink are built, as well as a dynamic temperature model of heat sink. Based on these models, a method using New European Driving Cycle (NEDC) for optimal design of Bi-DC/DC which simultaneously considered efficiency and weight is proposed. The simulation result shows that compare with conventional optimization methods revealed that the optimization approach based on driving cycle allowed significant weight reduction while meeting the efficiency requirements.

• 한국전산구조공학회논문집
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• 제31권4호
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• pp.165-171
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• 2018

본 연구에서는 DVR 내부 공기유동을 직접 제어하여 CPU의 온도를 낮추기 위한 유동제어 구조물을 제안하였다. 제안된 구조물은 세 개의 얇은 판의 형태로 구성되었으며, DVR 내부의 공기 유동을 포괄적으로 제어하여 CPU의 효율적인 방열을 유도하고자 하였다. DOE와 RSM을 이용한 매개변수 연구기법을 통해 유동제어 구조물의 형상을 최적화하였으며, 해석에는 유한체적방법을 이용한 유체역학 분석 패키지인 FlowVision을 사용하였다. 실제 DVR 기기에서의 실험을 통해 해석 결과를 검증한 결과 CPU의 온도가 $16.1^{\circ}C$ 낮아짐을 확인하였다.

• 한국전산유체공학회지
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• 제11권3호
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• pp.8-13
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• 2006

The north panel of a geostationary satellite is used as one of the main radiators, on which communication equipment or bus equipment are installed. The thermal control of panel is designed by using embedded heat pipes and surface heat pipes (or external heat pipes) to spread out heat dissipated from equipment all over the radiator evenly and finally to reject the heat to the space through the radiator efficiently. This panel is also divided by several areas based on the operating temperature and dissipation of equipment in order to increase heat rejection capability of radiator. The thermal analysis is carried out for the hot case, Winter Solsitce EOL (End Of Life), in order to validate thermal design of the panel utilized 6 surface heat pipes and 8 embedded heat pipes. The sensitivity studies for the heat pipe failure case and no heat pipe case are performed and compared to its normal state. The heat transport capability of heat pipe is also obtained from these calculations.