• Journal of the korean Society of Automotive Engineers
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• v.11 no.5
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• pp.65-75
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• 1989

A method for analyzing the heat dissipation rates of automotive radiators has been proposed and also a new model equation of heat transfer rate of louvered fins has been proposed and tested. With the method, the effect of various design parameters on the performance of a radiator has also been studied. The proposed model equation for air-side heat transfer has made fair predictions which agree well with the experiments. Also the design value of heat dissipation rate with various fin pitches and radiator size has a good agreement with the heat dissipation of the commercial automotive radiators. Thus, the method of analyzing the radiator performance proposed in this study might be used to design new automotive radiators.

• The Transactions of the Korean Institute of Power Electronics
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• v.9 no.4
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• pp.350-355
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• 2004

This paper deals with the design of a heat dissipation system, which consists of a heat source of power semiconductor devices, a heat sink ;md a fan for the forced air cooling. It suggests the method of appropriately dividing the whole heat transfer system into analytical subsystems and also presents the correspondent analytic or experimental design equations for the subsystems. The experimental results on the designed heat dissipation system for the 400kW IGBT inverter show less than 10［%］ error with respect to the design temperature and therefore verify the validity of the proposed analytical design method in the steady state.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.2
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• pp.125-130
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• 2016

In this paper, various heat dissipation designs for a rail anchoring failure detection module were investigated by a thermal flow analysis. For the detection module with the heat dissipation design on the overall housing surface, an average temperature inside the module was lowered by $25^{\circ}C$ when compared to no heat dissipation design. In addition, an internal heat-flow blocking layer and an heat conduction layer inserted between the LED module and housing case were effective in reducing the temperature in the rail anchoring failure detection, which has a limited space for installation and little air flow. Especially, the temperature near LED module decreased below $55^{\circ}C$ when the optimal heat dissipation design was applied.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• Transactions of the Korean hydrogen and new energy society
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• v.31 no.1
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• pp.112-121
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• 2020

In this work energy and entransy characteristics of heat exchangers are analyzed for 12 different flow arrangements of heat exchangers. The dimensionless parameters are number of entransy dissipation (Ng), number of entransy dissipation-based thermal resistance (Nr), and entransy dissipation-based effectiveness of heat-exchanger (εg). The dimensionless parameters are expressed analytically in terms of the effectiveness of heat exchanger (ε), heat capacity ratio (c), and number of transfer unit (N) for optimal performance of heat exchangers. Results showed that the dimensionless parameters based on the entransy dissipation can be useful concepts for optimal design of heat exchangers.

• Journal of computational fluids engineering
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• v.11 no.2 s.33
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• Electronics and Telecommunications Trends
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• v.38 no.6
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• pp.41-51
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• 2023

Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

• Journal of Advanced Navigation Technology
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• v.24 no.4
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• pp.261-266
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• 2020

When a KW-class power control unit is installed in an aircraft installation, a heat dissipation design for a large amount of heat generated during power conversion should be considered. Failure to provide adequate heat dissipation can lead to equipment malfunction and fire, which can be a fatal factor in aviation operations. This paper describes the heat dissipation design of a KW-class power control unit installed in aircraft installation. The design and manufacturing test were conducted through computerized analysis, and the analysis model was corrected by confirming the rapid heat generation phenomenon of the heating element due to high power control. After the model revision, the design was improved, and the high-temperature operation test of the US military standard MIL-STD-810G was performed to confirm the feasibility of the improved design.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.