• Journal of Mechanical Science and Technology
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• 제17권12호
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• pp.2087-2098
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• 2003

The development of numerical mathematical model to calculate both the static and dynamic characteristics of a multi-shaft gas turbine consisting of a single combustion chamber, including advanced cycle components such as intercooler and regenerator is presented in this paper. The numerical mathematical model is based on the simplified assumptions that quasi-static characteristic of turbo-machine and injector is used, total pressure loss and heat transfer relation for static calculation neglecting fuel transport time delay can be employed. The supercharger power has a cubical relation to its rotating velocity. The accuracy of each calculation is confirmed by monitoring mass and energy balances with comparative calculations for different time steps of integration. The features of the studied gas turbine scheme are the starting device with compressed air volumes and injector's supercharging the air directly ahead of the combustion chamber.

• 마이크로전자및패키징학회지
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• 제24권1호
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• 한국전산유체공학회지
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• 제3권2호
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• pp.65-72
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• 1998

From the Boltzmann equation with BGK approximation, a gas-kinetic BGK scheme is developed and methods for its efficient calculation, using the convergence acceleration techniques, are presented in a framework of an implicit time integration. The characteristics of the original gas-kinetic BGK scheme are improved in order for the accurate calculation of viscous and heat convection problems by considering Osher's linear subpath solutions and Prandtl number correction. Present scheme applied to various numerical tests reveals a high level of accuracy and robustness and shows advantages over flux vector splittings and Riemann solver approaches from Euler equations.

• 한국연소학회:학술대회논문집
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• 한국연소학회 2006년도 제32회 KOSCO SYMPOSIUM 논문집
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• pp.205-212
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• 2006

Three-dimensional numerical study was carried out for the investigation of the detonation wave structures propagating in tubes. Fluid dynamics equations and conservation equation of reaction progress variable were analyzed by a MUSCL-type TVD scheme and four stage Runge-Kutta time integration. Chemical reaction was modeled by using a simplified one-step irreversible kinetics model. The variable gas properties between unburned and burned states were considered by using variable specific heat ratio formulation. The unsteady computational results in three-dimension show the detailed mechanisms of rectangular and diagonal mode of detonation wave instabilities resulting same cell length but different cell width in smoked-foil record. The results for the small reaction constant shows the spinning mode of three-dimensional detonation wave dynamics, which was rarely observed in the previous numerical simulation of the detonation waves.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.591-592
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• 2006

We studied about the manufacture of the drain-source contacts for OTFTs(organic thin-film transistors) by using screen printing method. The conductive fillers used Ag and carbon black. The conductive contacts with $100{\mu}m$ of channel length were screen printed on a silicon dioxide gate dielectric layer and, the pentacene semiconductor was deposited via vacuum deposition. As a result of studying various conductive pastes, we could obtain the OTFTs which exhibited field-effect behavior over arrange of drain-source and gate voltages, similar to devices employing deposited Au contacts. By using screen-printing with conductive paste, the contacts are processed at low temperature, thereby facilitating their integration with heat sensitive substrates.

• 플랜트 저널
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• 제9권1호
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• pp.43-49
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• 2013

본 연구에서는 국내 P복합발전소에서 실제 운전 중인 순환수계통 수직펌프를 대상으로 고유진동수를 측정하고, 유체와 구조가 연성된 경우의 진동이론으로부터 고진동의 원인을 파악하였다. 현장 상황에 가장 적합하며 경제적인 공진방지 대책을 선정하여 수치해석을 통해 실효성을 미리 확인한 후 실제 시스템에 적용하는 실증시험을 실시하였다.

• 전자통신동향분석
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• 제32권6호
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• pp.17-26
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• 2017

Electronic packaging technology is a technology that easily connects devices to the outside. The fourth industrial revolution is thought to be possible with the advancement of certain devices. The advancement of these devices must be accompanied by innovations in electronic packaging that connects the devices to the outside world, allowing their performances to be implemented at the system level. In this paper, the development trends of 2.5D/3D technology, heterogeneous integration technology, ultrafine interconnection technology, and heat dissipation technology will be examined, and the development direction of these technologies will be discussed.

• 한국CDE학회논문집
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• 제15권6호
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• pp.418-424
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• 2010

For an engineering analysis to predict a bending of PCB by heat, geometry information from CAM data should be transferred to CAE system. But because this work is done by people, not computer, in PCB manufacturing company, it takes too much time, makes many errors and a result is unreliable. To solve these problems, we analyze a working process of company, then develop a CAM to CAE interface to translate a CAM data into a data to be input into a CAE system automatically.

• 한국초전도ㆍ저온공학회논문지
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• 제19권3호
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• pp.8-12
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• 2017

If the part of the HTS magnet is exposed to the outside of the cryogenic coolant due to the fluctuation of the height of the cooling liquid or the vapor generation, the uncooled part becomes very unstable. In this paper, the unstable equilibrium temperature distribution of the uncooled part of a superconductor is obtained, and the maximum temperature and energy are calculated as a function of the uncooled length. Similar to the superconductor stability problem, the current sharing model was applied to derive the theoretical formula and calculated by numerical integration. We also applied a jump model, which assumes that joule heat is generated in all of the uncooled segment, and compares it with the current sharing model results. As a result of the analysis, the stable equilibrium state and the critical uncooled length in the jump model are not shown in the current sharing model. The stability of the conductors to external disturbances was discussed based on the obtained temperature distribution, maximum temperature, and energy.

• 국제초고층학회논문집
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• 제1권2호
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• pp.117-123
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• 2012

This paper discusses major strengths of tall buildings that distinguish them as sustainable solutions for the built environment. It sheds light on some of the key attributes of tall buildings as well as materials and technologies that could boost their performance environmentally, economically and technically as well as the natural habitats containing them. Tall buildings are portrait as major successful options for accommodating the ever increasing urban world population, with little negative impact on ecologies and environmental habitats worldwide. The role of tall buildings as 'vertical garden sub-cities' mitigating modern city problems of 'urban heat islands' and sprawling cities is explored. A few building examples as well as city developments are presented which represent the new generation of sustainable tall buildings that are setting trends for future projects incorporating innovations in materials and building systems and designs.