• Title/Summary/Keyword: Heat Dissipation Design

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Vibration Exciter Design for Flow Resonance (유동공진을 위한 가진기 설계)

  • Nam, Yoon-su;Choi, Jae-hyuck
    • Journal of Industrial Technology
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    • v.20 no.B
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    • pp.125-130
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    • 2000
  • Heat dissipation technology using flow resonant phenomenon is a kind of new concept in heat transfer area. A vibration exciter is needed to generate air turbulence which has the natural shedding frequency of heat system. A mechanical vibrating device for the air flow oscillation is introduced, which is driven by a moving coil actuator. An analytical dynamic model for this mechanical vibration exciter is presented and its validity is verified by the comparison with experimental data. Values of some unknown system parameters in the analytic model are estimated through the system identification approach. Based on this mathematical model, a high bandwidth vibration phase, it turns out the high modal resonant characteristics of vibrating plate are the major barrier against obtaining a high bandwidth vibration exciter.

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Evaluation of Control Board and Power Board Thermal Performance (제어보드와 파워보드에 관한 발열성능 평가)

  • Jang, Sung-Cheol;Kweon, Min-Soo
    • Journal of the Korean Society of Industry Convergence
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    • v.20 no.2
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    • pp.187-194
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    • 2017
  • This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.

A Design of On/Off Type Solenoid Actuator for Valve Operation (밸브 구동용 개폐식 솔레노이드 액추에이터의 설계)

  • Sung, B.J.
    • Transactions of The Korea Fluid Power Systems Society
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    • v.6 no.4
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    • pp.24-32
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    • 2009
  • For a design of on/off solenoid actuator for valve actuating, designer must have the experimental knowledge as well as general electromagnetic formulas to design object. It is possible for theoretical knowledge to do the out-line design, but it is impossible to optimal design without experimental knowledge which only can be achieved through many repeated experiments. In addition, in present on/off type solenoid actuator field, the smaller, lightening, lower consumption power, high response time are effected as the most important design factor. So, experimental knowledge is more needed for optimal design of solenoid actuator. In this study, we derived the governing equations for optimal design of on/off solenoid actuator for valve actuating and developed a design program composed electromagnetic theories and experimental parameter values for inexperienced designers. And we proved the propriety of this program by experiments.

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Low Temperature Co-firing of Camber-free Ceramic-metal Based LED Array Package (세라믹-금속 기반 LED 어레이 패키지의 저온동시소성시 휨발생 억제 연구)

  • Heo, Yu Jin;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.4
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    • pp.35-41
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    • 2016
  • Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

Thermal analysis model for electric water pumps with non-conductive cooling liquid (비전도성 충진액을 포함하는 전동워터펌프 열 해석 모델)

  • Jung, Sung-Taek;Yoon, Seon-Jhin;Ha, Seok-Jae
    • Design & Manufacturing
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    • v.16 no.2
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    • pp.46-52
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    • 2022
  • As the consumer market in the eco-friendly vehicle industry grows, the demand for water pump in a electric car parts market. This study intend to propose a mathematical model that can verify the effect of improving thermal properties when a non-conductive cooling filler liquid is introduced into an electric vehicle water pump. Also, the pros and cons of the immersion cooling method and future development way were suggested by analyzing the cooling characteristics using on the derived analysis solution. Thermal characteristics analysis of electric water pump applied with non-conductive filler liquid was carried out, and the diffusion boundary condition in the motor body and the boundary condition the inside pump were expressed as a geometric model. As a result of analyzing the temperature change for the heat source of the natural convection method and the heat conduction method, the natural convection method has difficulty in dissipating heat because no decrease in temperature due to heat release was found even after 300 sec. Also, it can be seen that the heat dissipation effect was obtained even though the non-conductive filling liquid was applied at the 120 sec and 180 sec in the heat conduction method. It has proposed to minimize thermal embrittlement and lower motor torque by injecting a non-conductive filler liquid into the motor body and designing a partition wall thickness of 2.5 mm or less.

A Design Process for Reduction of Pressure Drop of Air-cooled Condenser for Waste Heat Recovery System (폐열 회수 시스템용 공랭식 응축기의 압력 손실 저감 설계)

  • Bae, Sukjung;Heo, Hyungseok;Park, Jeongsang;Lee, Hongyeol;Kim, Charnjung
    • Transactions of the Korean Society of Automotive Engineers
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    • v.21 no.6
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    • pp.81-91
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    • 2013
  • A novel design process of a parallel multi-flow type air-cooled condenser of a dual-loop waste heat recovery system with Rankine steam cycles for improving the fuel efficiency of gasoline automobiles has been investigated focusing on reduction of the pressure drop inside the micro-tubes. The low temperature condenser plays a role to dissipate heat from the system by condensing the low temperature loop working fluid sufficiently. However, the refrigerant has low evaporation temperature enough to recover the waste from engine coolant of about $100^{\circ}C$ but has small saturation enthalpy so that excessive mass flow rate of the LT working fluid, e.g., over 150 g/s, causes enormously large pressure drop of the working fluid to maintain the heat dissipation performance of more than 20 kW. This paper has dealt with the scheme to design the low temperature condenser that has reduced pressure drop while ensuring the required thermal performance. The number of pass, the arrangement of the tubes of each pass, and the positions of the inlet and outlet ports on the header are most critical parameters affecting the flow uniformity through all the tubes of the condenser. For the purpose of the performance predictions and the parametric study for the LT condenser, we have developed a 1-dimensional user-friendly performance prediction program that calculates feasibly the phase change of the working fluid in the tubes. An example is presented through the proposed design process and compared with an experiment.

First Studies for the Development of Computational Tools for the Design of Liquid Metal Electromagnetic Pumps

  • Maidana, Carlos O.;Nieminen, Juha E.
    • Nuclear Engineering and Technology
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    • v.49 no.1
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    • pp.82-91
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    • 2017
  • Liquid alloy systems have a high degree of thermal conductivity, far superior to ordinary nonmetallic liquids and inherent high densities and electrical conductivities. This results in the use of these materials for specific heat conducting and dissipation applications for the nuclear and space sectors. Uniquely, they can be used to conduct heat and electricity between nonmetallic and metallic surfaces. The motion of liquid metals in strong magnetic fields generally induces electric currents, which, while interacting with the magnetic field, produce electromagnetic forces. Electromagnetic pumps exploit the fact that liquid metals are conducting fluids capable of carrying currents, which is a source of electromagnetic fields useful for pumping and diagnostics. The coupling between the electromagnetics and thermo-fluid mechanical phenomena and the determination of its geometry and electrical configuration, gives rise to complex engineering magnetohydrodynamics problems. The development of tools to model, characterize, design, and build liquid metal thermomagnetic systems for space, nuclear, and industrial applications are of primordial importance and represent a cross-cutting technology that can provide unique design and development capabilities as well as a better understanding of the physics behind the magneto-hydrodynamics of liquid metals. First studies for the development of computational tools for the design of liquid metal electromagnetic pumps are discussed.

Loss Analysis and Air-Cooled Design for a Cascaded Electrical Source Transmitter

  • Xue, Kai-Chang;Wang, Shuang;Lin, Jun;Li, Gang;Zhou, Feng-Dao
    • Journal of Power Electronics
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    • v.15 no.2
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    • pp.530-543
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    • 2015
  • Air-cooling method is adopted on the basis of the requirements for the thermal stability and convenient field use of an electrical source transmitter. The power losses of the transmitter are determined after calculating the losses of the alternating current (AC)-direct current (DC) power supply, the constant-current circuit, and the output circuit. According to the analysis of the characteristics of a heat sink with striped fins and a fan, the engineering calculation expression of the Nusselt number and the design process for air-cooled dissipation are proposed. Experimental results verify that the error between calculated and measured values of the transmitter losses is 12.2%, which meets the error design requirements of less than 25%. Steady-state average temperature rise of the heat sink of the AC-DC power supply is $22^{\circ}C$, which meets the design requirements of a temperature rise between $20^{\circ}C$ and $40^{\circ}C$. The transmitter has favorable thermal stability with 40 kW output power.

Heat Sink of LED Lights Using Engineering Plastics (엔지니어링 플라스틱의 LED조명 방열판 적용)

  • Cho, Young-Tae
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.4
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    • pp.61-68
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    • 2013
  • As an advance study for the development of a heat sink for special purpose high power illumination, an investigation was made to find feasibility for the application of copper plated EP to a heat sink of small LED light of less than 10W installed in commercial product. In this study, the plated heat sink with EP copper was fabricated for the conventional LED light. It was used actually for finding heat radiation property and effectiveness of the heat sink accompanied with measurement of luminous intensity. The heat is radiated by transfer and dissipation only through the copper plated surface due to extremely low heat conductivity of EP in case of EP heat sink; however the total area of the plate plays the function of heat transfer as well as heat radiation in case of the aluminum heat sink. It seems that the volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W volume difference of heat radiating material is so big that the temperature $P_1$ is 9.0~12.3% higher in 3W and 42.7~54.0% higher in case of 6W even though heat transfer rate of copper is approximately 1.9 times higher than that of aluminum. It was thought that this is useful to utilize for heat sink for low power LED light with the low heating rate. Also, the illumination could be greatly influenced by the surrounding temperature of the place where it is installed. Therefore, it seems that the illumination installation environment must be taken into consideration when selecting illumination. Further study was expected on order to aims at development of an exterior surface itself made into heat radiation plate by application of this technology in future.

A Numerical Study on the Anisotropic Thermal Conduction by Phonon Mean Free Path Spectrum of Silicon in Silicon-on-Insulator Transistor (실리콘 박막 트랜지스터 내 포논 평균자유행로 스펙트럼 비등방성 열전도 특성에 대한 수치적 연구)

  • Kang, Hyung-sun;Koh, Young Ha;Jin, Jae Sik
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.2
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    • pp.111-117
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    • 2016
  • The primary concern of this research is to examine the phonon mean free path (MFP) spectrum contribution to heat conduction. The size effect of materials is determined by phonon MFP, and the size effect appears when the phonon MFP is similar to or less than the characteristic length of materials. Therefore, knowledge of the phonon MFP is essential to increase or decrease the heat conduction of a material for engineering applications, such as micro/nanosystems. In this study, frequency dependence of the phonon transport is considered using the Boltzmann transport equation based on a full phonon dispersion model. Additionally, the phonon MFP spectrums of in-plane and out-of-plane heat transport are investigated by varying the film thickness of the silicon layer from 41 nm to 177 nm. This will increase the understanding of anisotropic heat conduction in a SOI (Silicon-on-Insulator) transistor.