• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.269-273
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• 2003

In this paper the HTS current lead for superconducting device is studied numerical method. The current lead is cooled by surrounded He gas by natural convection. To find wall heat flux, the linearization method is adopted Numerical results using natural convection cooling are compared with conventional cooling methods such as conduction cooling and vapor cooling. The results shows that the minimum heat dissipation is much smaller than conduction cooling. Also, the minimum heat dissipation is obtained for the non-zero gradient of temperature at warm end. HTS current lead operating current sharing mode is reduce heat flow to superconducting system.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.5-9
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• 2015

Thermal management becomes serious in 3D stacked IC because of higher heat flux, increased power generation, extreme hot spot, etc. In this paper, we reviewed the recent developments of thermal management for 3D stacked IC which is a promising candidate to keep Moore's law continue. According to experimental and numerical simulation results, Cu TSV affected heat dissipation in a thin chip due to its high thermal conductivity and could be used as an efficient heat dissipation path. Other parameters like bumps, gap filling material also had effects on heat transfer between stacked ICs. Thermal aware circuit design was briefly discussed as well.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.10
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• pp.673-677
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• 2014

In this paper, thermal analysis of HDU (Heat Dissipation Unit) for infrared CCTV is performed by using SolidWorks Simulation (Thermal analysis) package, in order to change the part materials and HDU shape is optimized. Furthermore, HDU disperses the aggregated heat around the LED inside the housing. The junction temperature of infrared LED checked by HDU check was $65.83^{\circ}C$, $42.02^{\circ}C$, respectively. In addition, the Thermoelement by changing the shape of the HDU was possibly designed and equipped with. Comparison with simulation and prototype measurement results, without HDU model was $65.83^{\circ}C$, $61.99^{\circ}C$, respectively. In addition to with HDU model was $42.02^{\circ}C$, $39.01^{\circ}C$, respectively. Only HDU mounted into infrared CCTV is usable in the ordinary house or outdoors. Also HDU with thermal element, fan mounted into infrared CCTV is usable in a blast furnace workplace or high temperature workplace.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.12.2-12.2
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• 2005

• Transactions of the Korean Society of Mechanical Engineers B
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• v.37 no.1
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• pp.75-79
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• 2013

Demands for semiconductor devices are dramatically increasing, and advancements in fabrication technology are allowing a step-up in the number of devices per unit area. As a result, semiconductor devices require higher heat dissipation, and thus, cooling solutions have become important for guaranteeing their operational reliability. In particular, in chip-in-board packages, in which chips and passives are embedded in the substrates for efficient device layout, heat dissipation is of greater importance. In this study, a thermal model for layers of different materials has been proposed, and then, the heat transfer has been simulated by imposing a set of appropriate boundary conditions. Heat generation can be predicted based on the results, which will be utilized as practical data for actual package design.

• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of Electrical Engineering and Technology
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• v.12 no.5
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• pp.1934-1944
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• 2017

As a key component of high-voltage power conversion system for electric vehicles (EVs), bidirectional DC/DC (Bi-DC/DC) is required to have high efficiency and light weight. Conventional design methods optimize the Bi-DC/DC at the maximum power dissipation point (MPDP). For EVs application, the work condition of the Bi-DC/DC is not strict as the MPDP, where the design method using MPDP may not be optimal during travel of EVs. This paper optimizes the Bi-DC/DC converter targeting efficiency and weight based on the driving cycle. By analyzing the two-phase interleaved Bi-DC/DC for hybrid energy storage systems (HESS) of EVs, its power dissipation is calculated, and an efficiency model is derived. On this basis, weight models of capacitor, inductor and heat sink are built, as well as a dynamic temperature model of heat sink. Based on these models, a method using New European Driving Cycle (NEDC) for optimal design of Bi-DC/DC which simultaneously considered efficiency and weight is proposed. The simulation result shows that compare with conventional optimization methods revealed that the optimization approach based on driving cycle allowed significant weight reduction while meeting the efficiency requirements.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.31 no.4
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• pp.165-171
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• 2018

In this study, the shape of the flow control structure within a DVR was designed for heat dissipation of the CPU. The proposed design consists of three thin metal plates, which directly controls the air flow inside the DVR box and forces the air to pass through the CPU, thereby efficiently dissipating heat from the CPU. The shape of the structure was determined using parametric studies. To verify the design result, we carried out a three-dimensional time dependent numerical analysis using a commercial fluid dynamics analysis package FlowVision. As a result of experiments with a real DVR equipment, it is confirmed that the temperature of the CPU is significantly reduced compared to the initial model.

• Journal of computational fluids engineering
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• v.11 no.3 s.34
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• pp.8-13
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• 2006

The north panel of a geostationary satellite is used as one of the main radiators, on which communication equipment or bus equipment are installed. The thermal control of panel is designed by using embedded heat pipes and surface heat pipes (or external heat pipes) to spread out heat dissipated from equipment all over the radiator evenly and finally to reject the heat to the space through the radiator efficiently. This panel is also divided by several areas based on the operating temperature and dissipation of equipment in order to increase heat rejection capability of radiator. The thermal analysis is carried out for the hot case, Winter Solsitce EOL (End Of Life), in order to validate thermal design of the panel utilized 6 surface heat pipes and 8 embedded heat pipes. The sensitivity studies for the heat pipe failure case and no heat pipe case are performed and compared to its normal state. The heat transport capability of heat pipe is also obtained from these calculations.