• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.19-31
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• 2022

With the advent of technologies based on big data, the trend of electronics towards high performance and high integration density continues. However, this development of electronics suffers from overheating issues, which seriously threaten the reliability of the devices. To develop effective strategies for thermal management, it is crucial to accurately evaluate the temperature distribution and design the heat dissipation path within the device in the operating condition. This paper introduces thermoreflectance microscopy that can observe the temperature distribution of a device with high spatial and temporal resolutions in a non-contact way. Specifically, the working principle and various forms of thermoreflectance microscopy are presented along with the latest research trends to improve the temperature, space, and time resolutions. We further review several examples in which thermoreflectance microscopy is applied to investigate the temperature and thermal characteristics of electronic devices.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.41-47
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• 2022

Ag sintering technologies have received great attention as it was applied to the inverter of Tesla's electric vehicle Model III. Ag sinter bonding technology has advantages in heat dissipation design as well as high-temperature stability due to the intrinsic properties of the material, so it is useful for practical use of SiC and GaN devices. This study was carried out to understand the sinter joining temperature effect on the robust Ag sintered joints in air without pressure within 10 min. Electroplated Ag finished Cu dies (3 mm × 3 mm × 2 mm) and substrates (10 mm × 10 mm × 2 mm) were introduced, respectively, and nano Ag paste was applied as a bonding material. The sinter joining process was performed without pressure in air with the bonding temperature as a variable of 175 ℃, 200 ℃, 225 ℃, and 250 ℃. As results, the bonding temperature of 175 ℃ caused 13.21 MPa of die shear strength, and when the bonding temperature was raised to 200 ℃, the bonding strength increased by 157% to 33.99 MPa. When the bonding temperature was increased to 225 ℃, the bonding strength of 46.54 MPa increased by about 37% compared to that of 200 ℃, and even at a bonding temperature of 250 ℃, the bonding strength exceeded 50 MPa. The bonding strength of Ag sinter joints was directly influenced by changes in the necking thickness and interfacial connection ratio. In addition, developments in the morphologies of the joint interface and porous structure have a significant effect on displacement. This study is systematically discussed on the relationship between processing temperatures and bonding strength of Ag sinter joints.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.50-60
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• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Journal of Energy Engineering
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• v.20 no.3
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• pp.185-190
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• 2011

This paper describes design, fabrication, and evaluation of the conduction cooled high temperature superconducting (HTS) magnet for superconducting magnetic energy storage (SMES). The HTS magnet is composed of twenty-two of double pancake coils made of 4-ply conductors that stacked two Bi-2223 multi-filamentary tapes with the reinforced brass tape. Each double pancake coil consists of two solenoid coils with an inner diameter of 500 mm, an outer diameter of 691 mm, and a height of 10 mm. The aluminum plates of 3 mm thickness were arranged between double pancake coils for the cooling of the heat due to the power dissipation in the coil. The magnet was cooled down to 5.6 K with two stage Gifford McMahon (GM) cryocoolers. The maximum temperature at the HTS magnet in discharging mode rose as the charging current increased. 1 MJ of magnetic energy was successfully stored in the HTS magnet when the charging current reached 360A without quench. In this paper, thermal and electromagnetic behaviors on the conduction cooled HTS magnet for SMES are presented and these results will be utilized in the optimal design and the stability evaluation for conduction cooled HTS magnets.

• Journal of Aerospace System Engineering
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• v.12 no.1
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• pp.57-67
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• 2018

The APD (Antenna Pointing Driver) is an electronic equipment tool that is used to drive the two-axis gimbal-type antenna for the image data transmission of CAS (Compact Advanced Satellite). In this study, a heat dissipation of EEE (Electrical, Electronic and Electromechanical) is reviewed, to identify the parts that directly affected its efficiency, lifetime as well as the reliability of the structure. This event eventually incurs a failure of the EEE part itself, or even the entire satellite system as noted in experiments in this case. To guarantee reliability of electronic equipment during the mission, the junction temperature of EEE parts is considered a significant and important design factor, and subsequently must be secured within the allowable range. Therefore, the notation of the thermal analysis considering the derating is indispensable, and a proper thermal mathematical model should be constructed for this case. In this study, the thermal design and thermal analysis are performed to confirm the temperature requirement of the APD. In addition, we noted that the validity of the thermal model, according to each of the identified modeling methods, was therefore compared through the thermal analysis utilized in this case.

• Tunnel and Underground Space
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• v.32 no.1
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• pp.59-77
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• 2022

Currently, the design reference temperature of the buffer material for disposing of high-level radioactive waste is less than 100℃, so if the heat dissipation capacity of the buffer material is improved, the spacings of the disposal tunnel and the deposition hole in the repository can be reduced. First of all, this study tries to analyze the criteria for thermal-hydraulic-mechanical performance of the buffer materials and to investigate the researches regarding the enhanced buffer materials with improved thermal conductivity. First, the thermal conductivity should be as high as possible and is affected by dry density, water content, temperature, mineral composition, and bentonite type. the organic content of the buffer material can have a significant effect on the corrosion performance of a canister, so the organic content should be low. In addition, hydraulic conductivity of the buffer material should be less than that of near-field rock and swelling pressure should be appropriate for buffer materials to function properly. For the development of enhanced buffer materials, additives such as sand, graphite, and graphite oxide are typically used, and a thermal conductivity can be greatly improved with a very small amount of graphite addition compared to sand.

• Journal of Korean Tunnelling and Underground Space Association
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• v.19 no.2
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• pp.121-141
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• 2017

The thermal analysis of an underground power conduit for electrical cables is essential to determine their current capacity with an increasing number of demands for high-voltage underground cables. The temperature rises around a buried cable, caused by excessive heat dissipation, may increase considerably the thermal resistance of the cables, leading to the danger of "thermal runaway" or damaging to insulators. It is a key design factor to develop the mechanism on thermal behavior of backfilling materials for underground power conduits. With a full-scale field test, a numerical model was developed to estimate the temperature change as well as the thermal resistance existing between an underground power conduit and backfill materials. In comparison with the field test, the numerical model for analyzing thermal behavior depending on density, moisture content and soil constituents is verified by the one-year-long field measurement.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.75-82
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• 2019

Flexible solar cells have attracted enormous attention in recent years due to their wide applications such as portable batteries, wearable devices, robotics, drones, and airplanes. In particular, the demands of the flexible silicon and compound semiconductor solar cells with high efficiency and high reliability keep increasing. In this study, we fabricated a flexible InGaP/GaAs double-junction solar module. Then, the effects of the wind speed and ambient temperature on the operating temperature of the solar cell were analyzed with the numerical simulation. The temperature distributions of the solar modules were analyzed for three different wind speeds of 0 m/s, 2.5 m/s, and 5 m/s, and two different ambient temperature conditions of 25℃ and 33℃. The flexibility of the flexible solar module was also evaluated with the bending tests and numerical bending simulation. When the wind speed was 0 m/s at 25 ℃, the maximum temperature of the solar cell was reached to be 149.7℃. When the wind speed was increased to 2.5 m/s, the temperature of the solar cell was reduced to 66.2℃. In case of the wind speed of 5 m/s, the temperature of the solar cell dropped sharply to 48.3℃. Ambient temperature also influenced the operating temperature of the solar cell. When the ambient temperature increased to 33℃ at 2.5 m/s, the temperature of the solar cell slightly increased to 74.2℃ indicating that the most important parameter affecting the temperature of the solar cell was heat dissipation due to wind speed. Since the maximum temperatures of the solar cell are lower than the glass transition temperatures of the materials used, the chances of thermal deformation and degradation of the module will be very low. The flexible solar module can be bent to a bending radius of 7 mm showing relatively good bending capability. Neutral plane analysis was also indicated that the flexibility of the solar module can be further improved by locating the solar cell in the neutral plane.