• 오토저널
• /
• 제5권1호
• /
• pp.89-93
• /
• 1983

This paper describes on experimental investigation into the heat dissipation of Diesel engine, placing emphasis on the variations of compression ratio and cooling water temperature. The engine used for this test was a vertical single-cylinder four-cycle type, having a direct injection. Engine performance and heat transfer rates was tested under the compression ratio 14.3 and 17.4. In this study, the results showed that output and transfer rates of engine decrease in accordance with the decrease of compression ratio. The effect of cooling water temperature and injection delay of fuel on the heat dissipation brings about the decrease of heat transfer rates from cylinder to cooling water.

• 전력전자학회논문지
• /
• 제15권1호
• /
• pp.27-34
• /
• 2010

하이브리드 전기자동차(HEV)용 인버터의 스위칭 소자에서 발생하는 열을 효율적으로 냉각시키기 위한 수냉식구조를 제안한다. 기존의 볼트형 냉각구조는 강한 수압에서 누수현상이 발생할 수 있으므로 본 논문에서는 이를 방지하기 위해 방열판 내에 파이프 형태의 구조를 적용하였다. 발열원을 기준으로 수로의 이격거리 변화와 여러 형태의 수로에 대해 방열현상을 시뮬레이션으로 해석하고, 방열효과가 우수한 2가지 배관구조 모델을 기준으로 방열효과를 비교 분석하였다. 시뮬레이션 결과를 토대로 2가지 배관구조를 적용한 HEV용 30kW급 인버터를 제작하여 방열효과를 검증하였다.

• 전기전자학회논문지
• /
• 제25권3호
• /
• pp.528-533
• /
• 2021

본 논문은 전기자동차용 고밀도 DC-DC 컨버터의 PCB 방열특성에 대해 나타낸다. 본 논문은 또한 고밀도 DC-DC 컨버터의 방열구조를 분석하고 열해석 시뮬레이션을 통해 고밀도 전원장치의 PCB 방열 설계를 최적화한다. 따라서 본 논문에서는 열전달 이론을 바탕으로 일반적인 전자기기의 방열 경로를 분석하고 열저항 등가 회로를 모델링한다. 또한 본 논문의 연구 대상인 500[W]급 동기식 벅 컨버터의 열저항 등가 회로를 모델링 하여 방열 성능 향상을 위한 구조적인 방열 경로를 제시한다. 입력전압 72[V], 출력전압 12[V]의 500[W]급 동기식 벅 컨버터에 다면 방열 구조를 적용하여 열해석 시뮬레이션결과와 시작품의 실험을 통해 제안 구조의 타당성을 검증한다.

• 한국전산유체공학회지
• /
• 제11권2호
• /
• pp.32-39
• /
• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 대한기계학회논문집B
• /
• 제29권4호
• /
• pp.526-536
• /
• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• 한국전기전자재료학회논문지
• /
• 제28권2호
• /
• pp.137-141
• /
• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Korean Chemical Engineering Research
• /
• 제53권1호
• /
• pp.91-102
• /
• 2015

Analytical solutions for the forced convection heat transfer of viscoelastic fluids obeying the Giesekus model are obtained in a concentric annulus under laminar flow for both thermal and hydrodynamic fully developed conditions. Boundary conditions are assumed to be (a) constant fluxes at the walls and (b) constant temperature at the walls. Temperature profiles and Nusselt numbers are derived from dimensionless energy equation. Subsequently, effects of elasticity, mobility parameter and viscous dissipation are discussed. Results show that by increasing elasticity, Nusselt number increases. However, this trend is reversed for constant wall temperature when viscous dissipation is weak. By increasing viscous dissipation, the Nusselt number decreases for the constant flux and increases for the constant wall temperature. For the wall cooling case, when the viscous dissipation exceeds a critical value, the generated heat overcomes the heat which is removed at the walls, and fluid heats up longitudinally.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2007년도 춘계학술대회B
• /
• pp.2061-2066
• /
• 2007

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the hydraulic and heat transfer characteristics for the Wire-woven Bulk Kagome(WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen have been experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK are compared with other heat dissipation media. It was shown that heat transfer depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and other materials suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.

• 한국전기전자재료학회논문지
• /
• 제30권5호
• /
• pp.270-275
• /
• 2017

Current progress in the development of semiconductor technology in applications involving high electron mobility transistors (HEMT) and power devices is hindered by the lack of adequate ways todissipate heat generated during device operation. Concurrently, electronic devices that use gallium nitride (GaN) substrates do not perform well, because of the poor heat dissipation of the substrate. Suggested alternatives for overcoming these limitations include integration of high thermal conductivity material like diamond near the active device areas. This study will address a critical development in the art of GaN on diamond (GOD) structure by designing for ideal heat dissipation, in order to create apathway with the least thermal resistance and to improve the overall ease of integrating diamond heat spreaders into future electronic devices. This research has been carried out by means of heat transfer simulation, which has been successfully demonstrated by a finite-element method.

• 대한기계학회논문집B
• /
• 제32권1호
• /
• pp.15-22
• /
• 2008

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the fluid flow and heat transfer characteristics for the Wire-woven Bulk Kagome (WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen was experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK were compared with other heat dissipation media. It was shown that heat transfer characteristics depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and others suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.