• Membrane Journal
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• v.17 no.3
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• pp.210-218
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• 2007

CEDI-BPM(Continuous Electrodeionization-Bipolar Membrane) has advantages due to high ion permselectivity through ion exchange membranes and the production of $H^+$ and $OH^-$ ions on the bipolar membrane surfaces for regeneration of ion exchange resin during electrodeionization operation. In this study, hardness materials were removed by the CEDI-BPM without scale formation and the ion exchange resins were electrically regenerated during the operation. The adsorption characteristic of ion exchange resin surface, the influence of flow rate on the hardness removal and electric regeneration were investigated in the study. The removal efficiency of Ca was higher than that of Mg in the CEDI-BPM, which was related to the high adsorption capacity of Ca on the cation exchange resin. With increasing flow rate, the flux of Ca and Mg was enhanced by the permselectivity of a cation exchange membrane. In the electric regeneration of CEDI-BPM, it was shown that the regeneration efficiency was higher with a lower regeneration potential applied between cathode and anode.

• Korean Journal of Food Science and Technology
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• v.35 no.1
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• pp.84-91
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• 2003

The effects of different dehydration conditions for the removal of ginkgo nut inner coat on peeled ginkgo nuts were examined using physical and sensory methods. Dehydration of ginkgo nuts at $90^{\circ}C$ for 120 min resulted in greater hardness, lightness (L), redness (a), yellowness (b), and firmness. Higher roasted flavor and larger holes were observed with dehydration at $150^{\circ}C$ for 30 min and greater cooked ginkgo flavor and green color with dehydration at $120^{\circ}C$ for 50 min. Based on these findings, dehydration at $120^{\circ}C$ for 50 min was determined as the adequate hot air dehydration condition for the removal of ginkgo nut inner coat. Ginkgo nuts stored at $25^{\circ}C$ maintained overall desirability up to 4 weeks. In ginkgo nuts stored at $4^{\circ}C$, all sensory desirabilities evaluated were reasonably high until 60 days of storage; desirability of appearance decreased moderately at 80 days of storage, and appearance became very undesirable at 180 days. Ginkgo nuts stored at $-18^{\circ}C$ showed little changes until 10 months of storage, but slight decreases in overall desirability, flavor, and texture were noted at 12 months.

• Journal of Dental Rehabilitation and Applied Science
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• v.25 no.2
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• pp.157-169
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• 2009

The aim of this study was to evaluate effect of implant abutment screw coating treatment on joint stability, investigating mechanical properties of these. For this study used $ExFeel^{(R)}$ external hexed implant system and $15mm{\times}1mm$ discs. Experimental group was $1{\mu}m$ TiN, TiCN, TiC coated abutment screws and discs. To know mechanical property, i evaluated adhesion strength, surface hardness, using disc, corrosion test using screw. The results were as follows : rotation angle of coated screws increased than that of non-coated screw because of lower friction coefficient, especially TiC coated screw group had the largest value, but removal torque decreased in all coated screws (p<0.05). Torque loss before and after fatigue test was the smallest in TiC-coated screws, and the largest in non-coated screws (p<0.05), and there was no statistically significant difference between dry condition and wet condition of screws because of higher surface hardness and lower friction coefficient. From the above results, TiN, TiCN, TiC coating group had high abrasion resistance, especially TiC coated group which had low torque-consuming, high rotation angle as low friction coefficient will be considered to influence on implant abutment screw joint stability positively.

• The Bulletin of The Korean Astronomical Society
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• v.39 no.2
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• pp.103-103
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• 2014

Manufacturing of lens and mirror using Diamond Turning Machine (DTM) offers distinct advantages including short fabrication time and low cost as compared to grinding or polishing process. However, the DTM process can leave mid-frequency error in the optical surface which generates an undesirable diffraction effect and stray light. The mid-frequency error is expected to be eliminated by mechanical polishing after the DTM process, but polishing of soft surface of ductile aluminum is extremely difficult because the polishing process inevitably degrades the surface form accuracy. In order to increase its surface hardness, we performed electroless nickel plating on the surface of diamond-turned aluminum (Al-6061T6) off-axis mirrors, which was followed by the 6-hour-long baking process at $200^{\circ}C$ for improving its hardness. Then we polished the nickel plated off-axis mirrors to remove the mid-frequency error and measured polished mirror surfaces using the optical surface profilometer (NT 2000, Wyko Inc.). Finally, we ascertained that the mid-frequency error on the mirror surface was successfully removed. During the whole processes of nickel plating and polishing, we monitored the form accuracy using the ultra-high accurate 3-D profilometer (UA3P, Panasonic Corp.) to maintain it within the allowable tolerance range (< tens of nm). The polished off-axis mirror was optically tested using a visible laser source and a pinhole, and the airy pattern obtained from the polished mirror was compared with the unpolished case to check the influence of mid-frequency error on optical images.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.58-58
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• 2009

Uniformity related issues in chemical mechanical polishing (CMP) are within wafer non-uniformity (WIWNU), wafer to wafer non-uniformity (WTWNU), planarity and dishing/erosion. Here, the WIWNU that originates from spatial distribution of independent variables such as temperature, sliding distance, down force and material removal rate (MRR) during CMP, relies to spatial dependency. Among various sources of spatial irregularity, hardness and modulus of pad and surface roughness in sources for pad uniformity are great, especially. So, we investigated the spatial variation of pad surface characteristics using pad measuring system (PMS) and roughness measuring system. Reduced peak height ($R_{pk}$) of roughness parameter shows a strong correlation with the removal rate, and the distribution of relative sliding distance onwafer during polishing has an effect on the variation of $R_{pk}$ and WIWNU. Also, the results of pad wear profile thorough developed pad profiler well coincides with the kinematical simulation of conditioning, and it can contribute for the enhancement of WIWNU in CMP process.

• Journal of Surface Science and Engineering
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• v.50 no.6
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• pp.473-479
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• 2017

CrN coatings have been used as protective coatings for cutting tools, forming tools, and various tribological machining applications because these coatings have high hardness. Cr-Al-N coatings have been investigated to improve the properties of CrN coatings. Cr-Al-N coatings were fabricated by a hybrid physical vapor deposition method consisting of unbalanced magnetron sputtering and arc ion plating with different working pressure and substrate bias voltage. The phase analysis of the composition was performed using XRD (x-ray diffraction). Cr-Al-N coatings were grown with textured CrN phase and (111), (200), and (220) planes. The adhesion strength of the coatings tested by scratch test increased. The friction coefficient and removal rate of the coatings were measured by a ball-on-disk test. The friction coefficient and removal rate of the coatings decreased from 0.46. to 0.22, and from $2.00{\times}10^{-12}m^2/N$ to $1.31{\times}10^{-13}m^2/N$, respectively, with increasing bias voltage. The tribological properties of the coatings increased with increasing substrate bias voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Journal of Korean Society of Environmental Engineers
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• v.27 no.4
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• pp.362-368
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• 2005

The pH, alkalinity and calcium hardness could be adjusted by $CO_2$, $Ca(OH)_2$, and $Na_2CO_3$ addition in the water treatment process for corrosion protection of the water pipes. This research was performed to investigate the effect on the variation of water quality on the unit process by addition $CO_2$, $Ca(OH)_2$, and $Na_2CO_3$ in water treatment process. Carbon dioxide and lime were added before the coagulation basin and soda ash was added after the BAC process. pH and aklainity were increased at coagulation basin then after the water qualities had sustained similiarly to BAC process. There was no effect on turbidity and DOC removal efficiency during experimental period by addition\ $CO_2$, $Ca(OH)_2$, and $Na_2CO_3$ solution was added into clear well, the last process for optimum control of CCPP and is used mainly to control pH and alkalinity. In this research, average pH, alkalinity, and calcium hardness in treated water were 8.39, 61.4 mg/L as $CaCO_3$, 59.4 mg/L as $CaCO_3$, respectively and CCPP of treated water was higher than 29.5 mg/L to BAC process water, so adjusted water was expected to prevent internal corrosion of water pipe.

• International Journal of Industrial Entomology and Biomaterials
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• v.26 no.1
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• pp.54-60
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• 2013

The partial degumming of silk has recently attracted researchers' attention because of its ability to produce silk textiles with new tactile properties, intermediate between the softness of fully degummed silk and the hardness of raw silk. However, it is difficult to obtain partially degummed silk in a homogenously degummed state due to the heterogeneous character of sericin removal. It is also difficult to examine the homogeneity of degumming. In the present study, Fourier transform infrared (FTIR) spectroscopy with attenuated total reflection (ATR) geometry was used to evaluate the effect of processing conditions on the degumming of silk yarns. The crystallinity index, calculated from FTIR spectra, showed an increase with the degumming ratio. Therefore, the homogeneity of degumming could be evaluated by the variation of crystallinity index for 30 different spots in silk yarns. The homogeneity of degumming was influenced by the total degumming time, the content of surfactant, and the liquor rate. No effect was observed upon changing the number of degumming cycles at the same total degumming time.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.