• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.1
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• pp.35-39
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• 2013

This paper reports numerical study results with respect to the thermal behavior of a natural convection cooled hybrid fin heat sink (HFH). The HFH consists of hybrid fins, hollow pin fins integrated with plate fins. The thermal performance of the HFH was numerically investigated by employing a commercial CFD software package and compared with that of the pin fin heat sink (PFH). Numerical study has found that array-based and mass-based heat transfer coefficients of the HFH are 12% and 37% greater than those of the PFH, respectively. Extended surface area and lighter weight may explain the better thermal performance of the HFH than the PFH.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.6
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• pp.117-123
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• 2018

Automotive headlamps have been continuously developed as one of the most important devices for securing the driver's view, and the LED lamps are getting popular in recent years. However, in case of the LED lamps, because the heat generated by the LED lamps are too high, it shorten the product life and lower the LED efficiency. Therefore, this study was investigated the cooling characteristics of the LED lamp heat sink for automobile by forced convection for LED heat generation control. In order to analyze the cooling characteristics of the heat sink, the temperature distribution results were investigated through the experiment and computational analysis under the increase of the air flow velocity, and the convective heat transfer coefficient was obtained. Also, convective heat transfer coefficient was calculated by the theoretical formula under the same condition and compared with experimental and computational results. From the result of this study, as the air flow velocity around the heat sink fins increased, the convective heat transfer coefficient significantly increased, confirming the improvement in the cooling effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.551-552
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• 2007

• Ceramist
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• v.21 no.2
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• pp.83-88
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• 2018

There is close relation between the heat generation and the performance of electronic device. The durability and efficiency of the device are degraded due to heat generation. It is necessary to release the generated heat from an electronic device. Based on demands of the printed circuit board (PCB) manufacturing, the robust and reliable plating technique of PCB is necessary. In this study, we review various methods for improving the heat sink property. These methods were considered to enhance the adhesion between ceramic substrate as heat sink and metal layer as electrode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.165-165
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• 2009

긴 수명, 높은 효율, 색 재현성 및 친화경등의 많은 장점을 가진 발광다이오드는 높은 접합온도로 인하여 광 효율이 저하되고 이는 신뢰성 저하 및 방열부 장착으로 인한 비용 상승 등의 문제로 발전에 악영향을 받고 있다. 본 논문에서는 방열부인 HeatSink의 구조적 변화가 방열성능에 어떠한 영향을 끼치는지 알아보기 위해 열화상 적외선 카메라와 적분구를 이용하여 서로 다른 HeatSink를 가지고 각각의 열적 광학적 특성을 파악하였다. HeatSink의 Fin 길이를 길게 하여 방열면적을 상승시키는 것보다 Fin 두께를 작게 함으로써 Fin 개수를 늘리는 것이 방열성능을 크게 개선시킬 수 있었고 이는 광 출력으로 이어졌다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.1
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• pp.138-143
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• 2018

In general, the operating temperature of electronic equipment is closely related to product life and reliability, and it is recognized that effectively cooling the parts is an important problem. In this paper, an experimental study on the cooling characteristic according to the pin array of the heat sink is conducted. The experiment on the heat sink was based on the natural convection and temperature distribution changes. The experimental results indicate that the pin array of the heat sink has an effect on the thermoelectric module's cooling characteristic.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.9
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• pp.849-854
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• 2005

In this paper, the cooling performance of a microchannel heat sink with nano-particle-fluid suspensions ('nanofluids') is numerically investigated. By using theoretical models of thermal conductivity and viscosity of nanofluids that account for the fundamental role of Brownian motion respectively, we investigate the temperature contours and thermal resistance of a microchannel heat sink with nanofluids such as 6nm copper-in-water and 2nm diamond-in-water. The results show that a microchannel heat sink with nanofluids has high cooling performance compared with the cooling performance of that with water, the classical coolant. Nanofluids reduce both the thermal resistance and the temperature difference between the heated microchannel wall and the coolant.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1265-1268
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• 2009

In this paper, the effect of a flow barrier and bypass on the cooling performance for a straight fin heat sink is presented. Both side directions and upward direction of bypass are controlled using various ducts which have different width and heights. In addition, a flow barrier is used to control flow toward heat sink. Through experiments, the distance from leading edge of a heat sink to a flow barrier is varied for various bypasses under fixed volume flow rate condition. This study shows possibility to improve cooling performance when bypass and a flow barrier exist.