• 제목/요약/키워드: Gripping Force Control

검색결과 33건 처리시간 0.026초

반복 학습기능을 이용한 로봇 매니퓰레이터의 파지력제어 (The Gripping Force Control of Robot Manipulator Using the Repeated Learning Function Techniques)

  • 김태관;백승학;김태수
    • 한국산업융합학회 논문집
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    • 제18권1호
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    • pp.45-52
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    • 2015
  • In this paper, the repeated learning technique of neural network was used for gripping force control algorithm. The hybrid control system was introduced and the manipulator's finger reorganized form 2 ea to 3 ea for comfortable gripping. The data was obtained using the gripping force of repeated learning techniques. In the fucture, the adjustable gripping force will be obtained and improved the accuracy using the artificial intelligence techniques.

BT50용 스핀들 공구 파지력 검사를 위한 힘센서 개발 (Development of Gripping Force Sensor for a Spindle Tool of BT50)

  • 이대건;김갑순
    • 센서학회지
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    • 제30권1호
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    • pp.42-46
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    • 2021
  • In this paper, we describe the development of a force sensor to measure the tool gripping force of the BT50 spindle. The force sensor for a BT50 must be installed inside the gripping force tester; hence, it must be of an appropriate size and have a rated capacity suitable for measuring the gripping force. So, the structure of the force sensor for BT50 was modeled, the size of the sensing part was determined by structural analysis, and the force sensor was manufactured by attaching a strain gauge. The characteristic test results of the manufactured force sensor, indicated that the nonlinearity error, hysteresis error, and reproducibility errors were each within 0.91%, Therefore it was determined that the manufactured force sensor can be used for checking the spindle tool gripping force.

Wafer 반송용 End-Effector의 FEM 해석 및 파지력 제어에 관한 연구 (A Study on the FEM Analysis and Gripping Force Control of End-Effector for the Wafer Handling Robot System)

  • 권오진;최성주;이우영;이강원;박원규
    • 반도체디스플레이기술학회지
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    • 제2권3호
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    • pp.31-36
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    • 2003
  • On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.

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Wafer 반송용 End-Effector의 설계 및 파지력 제어에 관한 연구

  • 권오진;최성주;이우영;이강원
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 춘계학술대회 발표 논문집
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    • pp.80-87
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    • 2003
  • On this study, an End-Effector for the 300mm wafer transfer robot System is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor. It is controlled by microchip for the DC motor control. To design, relationships on the gripping force and the wafer deformation is analyzed by FEM analysis. Criterion on gripping force of a suggested End-Effector is confirmed as $255 ~ 274g_f$ from experimental results. From experimented results on repeatable position accuracy, gripping force and gripping cycle times in a wafer cleaning system, we confirmed that the suggested End-Effector is well satisfied on the required performance for 300mm wafer transfer robot system.

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Force/Torque sensor를 이용한 PUMA Robot의 지능 제어 (PUMA robot intelligent control using force/torque sensor)

  • 최성락;정광조
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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    • pp.339-342
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    • 1996
  • In this paper, the method for controlling PUMA robot using F/T sensor is described. In the part of the setup automation, robot is used. The F/T sensor is located at robot end-effector and various experiments are executed such as peg in hole, gripping objects, tool changing, etc.

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미세 조작을 위한 압전 구동 집게의 설계 및 제작 (A Design and Manufacturing of Two Types of Micro-grippers using Piezoelectric Actuators for the Micromanipulation)

  • 박종규;문원규
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.246-250
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    • 2003
  • In this study, two new types of micro-grippers in which micro-fingers are actuated by piezoelectric multi-layer benders and stacks are introduced for the manipulation of micrometer-sized objects. First, we constructed a 3-chopstick-mechanism tungsten gripper, which is composed of three chopsticks: two are designed to grip micro-objects, and tile third is used to help grasp and release the objects through overcoming especially electrostatic force among some surface effects including electrostatic, van der Waals forces and surface tension. Second, a 2-chopstick-mechanism silicon micro-gripper that uses an integrated force sensor to control the gripping force was developed. The micro-gripper is composed of a piezoelectric multilayer bender for actuating the gripper fingers, silicon fingertips fabricated by use of silicon-based micromachining, and supplementary supports. The micro-gripper is referred to as a hybrid-type micro-gripper because it is composed of two main components; micro-fingertips fabricated using micromachining technology to integrate a very sensitive force sensor for measuring the gripping force, and piezoelectric gripper finger actuators that are capable of large gripping forces and moving strokes. The gripping force signal was found to have a sensitivity of 667 N/V. To the design of each of components of both of the grippers. a systematic design approach was applied, which made it possible to establish the functional requirements and design parameters of the micro-grippers. The micro-grippers were installed on a manual manipulator to assess its performance in tasks such as moving micro-objects from one position to a desired position. The experiment showed that the micro-grippers function effectively.

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유연 촉각 센서를 이용한 로봇 그리퍼의 미끄러짐 감지 (Slip Detection of Robot Gripper with Flexible Tactile Sensor)

  • 서지원;이주경;이석;이경창
    • 한국정밀공학회지
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    • 제31권2호
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    • pp.157-164
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    • 2014
  • In this paper, we design a gripping force control system using tactile sensor to prevent slip when gripper tries to grasp and lift an object. We use a flexible tactile sensor for measuring uniplanar pressure on gripper's finger and develop an algorithm to detect the onset of slip using the sensor output. We also use a flexible pressure sensor to measure the normal force. In addition, various signal processing techniques are used to reduce noise included in the sensor output. A 3-finger gripper is used to grasp and lift up a cylindrical object. The tactile sensor is attached on one of fingers, and sends output signals to detect slip. Whenever the sensor signal is similar to the slip pattern, gripper force is increased. In conclusion, this research shows that slip can be detected using the tactile sensor and we can control gripping force to eliminate slip between gripper and object.

DSP 를 이용한 로봇의 그리퍼 제어장치의 개발 (Development of the Robot's Gripper Control System using DSP)

  • 김갑순
    • 한국정밀공학회지
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    • 제23권5호
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    • pp.77-84
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    • 2006
  • This paper describes the design and implementation of a robot's gripper control system. In order to safely grasp an unknown object using the robot's gripper, the gripper should detect the force of gripping direction and the force of gravity direction, and should perform the force control using the detected forces and the robot's gripper control system. In this paper, the robot's gripper control system is designed and manufactured using DSP(Digital Signal Processor), and the gripper is composed of two 6-axis force/moment sensors which measures the Fx force(force of x-direction), Fy force, Fz force, and the Mx moment(moment of x-direction), My moment, Mz moment at the same time. The response characteristic test of the system is performed to determine the proportional gain Kp and the integral gain Ki of PI controller. As a result, it is shown that the developed robot's gripper control system grasps an unknown object safely.

진공척 흡착패드 형태에 따른 대면적 임프린팅 균일 접촉 향상 연구 (Study on the Enhancement of the Uniform Contact Technology for Large Scale Imprinting with the Design of Vacuum Gripping Pad)

  • 장시열
    • Tribology and Lubricants
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    • 제24권6호
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    • pp.326-331
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    • 2008
  • The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size $470{\times}370\;mm^2$ LCD panel.

부품조립 및 핸들링을 위한 말단효과장치의 정밀 그리핑 제어에 관한 연구 (A study on Precise Grasping Control of End-Effector for Parts Assembling and Handling)

  • 하언태;성기원;강언욱
    • 한국산업융합학회 논문집
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    • 제18권3호
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    • pp.173-180
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    • 2015
  • In this paper, we propose a new precise control technology of robotic gripper for assembling and handling of part. When a robot manipulator interacts mechanically with its environment to perform tasks such as assembly or edge-finishing, the end-effector is thereby constrained by the environment. Therefore grasping force control is very important, since it increases safety due to monitoring of contact force. A comparison of various force control architecture is reported. Different force control methods can often be configured to achieve similar results for a given task, and the choice of control algorithm depends strongly on the application or on the characteristics of a particular robot. In the research, the adjustable gripping force can be controlled and improved the accuracy using the artificial intelligence techniques.