Journal of the Semiconductor & Display Technology (반도체디스플레이기술학회지)

The Korean Society Of Semiconductor & Display Technology (한국반도체디스플레이기술학회)
권호 표지

A Study on the FEM Analysis and Gripping Force Control of End-Effector for the Wafer Handling Robot System

Wafer 반송용 End-Effector의 FEM 해석 및 파지력 제어에 관한 연구

  • 권오진 (한국생산기술연구원 마이크로메카트로닉스팀) ;
  • 최성주 (한국기술교육대학교 기계공학부) ;
  • 이우영 (한국기술교육대학교 기계공학부) ;
  • 이강원 (한국생산기술연구원 마이크로메카트로닉스팀) ;
  • 박원규 (충남대학교 대학원)
  • Published : 2003.09.01
Download PDF
⟨ Previous Next ⟩

Abstract

On this study, an E.E(End-Effector) for the 300 mm wafer transfer robot system is newly suggested. It is a mechanical type with $180^{\circ}$ rotating ranges and is composed of 3-point arms, two plate springs and single-axis DC motor controlled by microchip. To design, relationship between the gripping force and the wafer deformation is analyzed by FEM. By analytic results, the gripping force for 300 mm wafer is confirmed as 255~274 gf. From experimental results on gripping force, repeatable position accuracy and gripping cycle times in a wafer cleaning system, we confirmed that the suggested E.E was well designed to satisfiy on the required performance for 300 mm wafer transfer robot system.

Keywords