• Transactions of the Korean Society of Machine Tool Engineers
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• v.11 no.5
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.53-56
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• 1995

Electrolytic In-Process Dressing grinding technique which enables application of metal bond wheels with fine superabrasives in mirror surface grinding operations has developed. This paper provides charateristic evaluation of power supply supply that we developed and general charateristics of ELID grinding. The electric behaviors are compared each about two different electrode which has 1/4, 1/6 the area of entire wheel surface, and two different fluids which has 1:50, 1:30 the quantity of water was used to dillute grinding fluids. The results show that ELID grinding method is useful for mirror surface machining.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.414-418
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• 1996

This paper aims at reviewing the possibility application over normal or abnormal, detection used by AE and the characteristics of grinding process. In this study, when diamond bur in dentistry with chosen grinding conditions were tuned at grinding. The variation of grinding resistance and AE signal is detected by the use of AE measuring system. The tests are carried out in accordance with diamond burs and workpiece: arcyl and cowteeth. According to the experiment results, the following can be expected; AE has the possibility to detect the state normality and abnormality. However, the grinding resistance measuring can find it difficult to detect it. It can be accurately excepted from AE occurrence pattern in contact start point of diamond but and cowteeth, grinding condition and derailment point. It is known that AErms is well compatible with grinding resistance.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.2
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• pp.61-66
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• 2000

In this paper, we discuss the machining characteristics of HDD glass. Glass is now being used globally as a data storage device, Such glasses are usually machined by lapping by this technique requires a long machining time, resulting in low productivity, For this reason, we examine the possibility of EILD grinding in HDD glass workpieces, A move to ELID grinding may result in substantial cost reduction. Our purpose is to investigate the grinding characteristics of HDD glass in ELID grinding. The bonding materials for fixing the abrasives of cast iron, cobalt and bronze are applied, and grinding conditions such as rotation speed and feeding are varied. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.11a
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• pp.648-652
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• 1996

Grinding Center(GC)는 머시닝센터가 갖는 드릴링, 태핑 등의 절삭가공의 수행은 물론 주축의 고속화, 이송계의 고정밀화를 토대로 연삭숫돌의 절삭성 회복과 다듬질면의 거칠기를 확보하기 위한 기계로서 Dressing/Truing장치, 기상계측 장치, CNC기능을 구비하여 테이블과 공구간에 3차원의 상대운동을 시킴으로써 평면연삭, 내면연삭, 홈연삭, 캠연삭 등의 복잡한 형상의 연삭가공에 대해서도 공정을 집약화 할 수 있는 기계이다.(중략)

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.04a
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• pp.660-665
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1911-1915
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• 2003

Today optical communication industry is developed; demand of optical communication part is increased. ZrO$_2$ ceramic ferrule is very significant part which determines transmission efficiency and quality of information in the optical communication part by connector of optical fibers. Being different from metal grinding, material removal through brittle fracture plays an important role in ZrO$_2$ ceramic grinding. Most of ZrO$_2$ ceramic ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter are very important. The co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ZrO$_2$ ceramic ferrule is affected by grinding conditions, and equipment. In this study, surface integrity of workpiece according to such as a change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ZrO$_2$ ceramic ferrule from many experiments. Thus, if possible be finding highly efficient and quality grinding conditions.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.2
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• pp.89-96
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• 2000

This paper describes the characteristic of die finishing to obtain smooth surface using electro-chemical grinding after cutting process. Electro-chemical grinding is possible under lower load and tool wear comparing with those in the mechanical grinding. Conventionally, if the metal bonding material of the grinding wheel is directly t contacted with workpiece, the current is circulated without electrolytic phenomena. Sometimes, electrical discharge is occurred between tool and workpiece. To cope with this problem, the metal-resin bonded pellet was used in this study. This pellet is composed of optimal volume of metal and resin powders and its characteristics are changable with the each volume of powders. Finally, high efficient die finishing is realized using metal resin bonded pellet in electro-chemical grinding.

• Journal of Mechanical Science and Technology
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• v.17 no.7
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• pp.1044-1053
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• 2003

There are two major differences between the centerless infeed grinding process and the centerless through-feed grinding process. One is an axial movement of workpieces, and the other is that several workpieces are ground simultaneously and continuously by through-feeding. Because of these differences, through-feed ground parts inherently possess not only the roundness error but also the tapering error. The aims of the research reported in this paper are to examine this inherent tapering characteristic and to find the effects of grinding variables (center height angle, regulating wheel tilt angle, and shape of grinding wheel surface). To accomplish the objectives, experiments were carried out using two types of cylindrical workpiece shapes. Also, computer simulations were performed using the 3-D through-feed grinding model.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.980-986
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive, the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, Ist, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the effect of the wheel path density and relative velocity on the characteristic of ground wafer in in-feed grinding with cup-wheel. It seems that the variation of the parameters in radial direction of wafer results in the non-uniform surface quality over the wafer. So, in this paper, the geometric analysis on grinding process is carried out, and then, the effect of the parameters on wafer surface quality is evaluated