• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1995.03a
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• pp.252-263
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• 1995

It is visualized that dislocations move straightly in polycrystalline structure and the trans-grain dislocation moving occur from yield point to ultimate tensile stress. Some fracturemodes in uniaxial tensile test are ilustrated in order to explain that after the ultimate point the grains deforms by twins and the rotations of grains make cracks at the grain-boundaries by the incompatibility . The luders banks. which propagates along the axis of the specimen, are twin bands whcih are formed by rearrangement of the atoms within the structure of three-dimensional crystallizing $\pi$-bondings. The fatigue limit can be found through the atom's rolling back motion during elastic deformation inthe uniaxial tensile test by the change of the gradient.

• Journal of the Korean Ceramic Society
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• v.50 no.3
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• pp.212-217
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• 2013

Ultra hard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) magnetron sputtering techniques. The effects of ICP power, ranging from 0 to 300 W, on the coating microstructure, crystallographic, and mechanical properties were systematically investigated with FE-SEM, AFM, HR-XRD and nanoindentation. The results show that ICP power has a significant influence on the coating microstructure and mechanical properties of TiN coatings. With an increasing ICP power, the film microstructure evolves from an apparent columnar structure to a highly dense one. Grain sizes of TiN coatings decreased from 12.6 nm to 8.7 nm with an increase of the ICP power. A maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at an ICP power of 300 W. The crystal structure and preferred orientation in the TiN coatings also varied with the ICP power, exerting an effective influence on film nanohardness.

• Progress in Superconductivity and Cryogenics
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• v.15 no.2
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• pp.39-43
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• 2013

$MgB_2$ bulk samples are synthesized through solid state reaction route using Mg precursors with different particle size by keeping the boron precursor unchanged. Scanning electron microscopy study of the fractured surface for all the samples depicts quite distinct structure depending on the Mg precursor. Big size of Mg precursor resulted in to largely elongated and deep pores while smaller one gave roughly ellipsoidal and shallow pore structure. Influence of the Mg particle size on the grain to grain connectivity reflected in the critical current density value which was greater for samples with smaller Mg precursor. All the synthesized samples undergo a superconducting transition at around 36.5 K irrespective of different Mg precursor particle size.

• Journal of the Korean Wood Science and Technology
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• v.2 no.2
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• pp.4-4
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• 1974

In this paper, the microscopic structure of wood was investigated for following species in Malaysia.

• Journal of Korea Foundry Society
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• v.11 no.5
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• pp.398-405
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• 1991

Al-Li alloy has a high strength with low density. Practically this alloy should use by the material which made from the rapid solidification. Therefore we examine the solidification structures of alloy with cooling rate. According to cooling rate increased, grain size and secondary dendrite arm spacing were smaller. Also grain size was further smaller by Zr added. To obtain more fine solidification structure, rapid solidification by single roll melt spinning was performed. According to higher wheel speed, cooling rate increased and cell size was smaller. Because of locally different cooling rate, different cell size was obtained in same specimen. More than cooling rate $10^6^{\circ}C$ /sec, zone A(insensible zone to corrosion)was obtained.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.168-175
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• 2003

The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.

• Journal of the Korean Ceramic Society
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• v.31 no.1
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• pp.74-78
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• 1994

Degradation of thin oxide by doped poly-Si and its improvement were studied. The gate oxide can be degraded by phosphorous in poly-Si doped POCl3. The degradation is increased with the decrement of sheet resistance and poly-Si thickness. Oxide failures of amorphous-Si are higher than those of poly-Si. In-situ double deposition of amorphous-Si, 54$0^{\circ}C$/30 nm, and poly-Si, 6$25^{\circ}C$/220 nm, forms the mismatch structure of grain boundary between amorphous-Si and poly-Si, and suppresses the excess phosphorous on oxide surface by the mismatch structure. The control of phosphorous through grain boundary improves the oxide reliability.

• Journal of the Korean Vacuum Society
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• v.5 no.1
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• pp.67-72
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• 1996

$RU_{1-x}Ir_xO_2$ films were deposited on the quartz substrate by a spray pyrolysis method. The x-ray diffraction patterns showed that the structure of the $RU_{1-x}Ir_xO_2$ film was tetragonal and the lattice constant $a_o$ and $c_o$ were increased from 4.495 A to 4.058 A and from 3.092A to 3.156 A, respectively as the Ir composition varied from 0.0 to 1.0. The $RU_{1-x}Ir_xO_2$ film was metallic and the resistivity of the samples was increased from $7{\times}10^{-5}{\Omega}\textrm{cm}$ to $48{\times}10^{-5}{\Omega}\textrm{cm}$ with increasing the Ir x. The surface of the sample was slightly roughed, the grain size and the grain boundary width were increased as the Ir composition varied from 0.0 to 1.0.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.311-314
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• 1999

Ferroelectric PZT heterolayered thin films were fabricated by spin coating method on the Pt/Ti/SiO$_2$/Si substrate using PZT(10/90) and PZT(90/10) metal alkoxide solutions. All PZT heterolayered films showed a homogeneous grain structure without presence of the rosette structure. It can be assumed that the lower PZT layers a role of nucleation site or seeding layer for the formation of the upper PZT layer. Zr and Ti diffusion into the Pt electrode were mainly distributed at the surface of Pt electrode beneath the PZT/Pt interface. The PZT/Pt interfacial layer showed a microstructure characterized by a grain phase surrounded by a Pb-deficient pyrochlore matrix phase. The relative dielectric constant and the dielectric loss of the PZT-6 film were 567 and 3.6, respectively.

• Journal of Power System Engineering
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• v.18 no.4
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• pp.66-71
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• 2014

In this study, effect of heat treatment on the microstructure and damping capacity of hot rolled magnesium alloys was investigated. The microstructure of hot rolled magnesium consisted of dendrite structure and $Mg_{17}Al_{12}$ compounds precipitated along the grain boundry. The dendrite structure was dissipated and $Mg_{17}Al_{12}$ compounds was decomposed by annealing treatment, and then they dissolved in ${\alpha}-Mg$. With an increasing the annealing temperature and time, damping capacity was slowly increased by the growth of grain size and decreasing of defects induced by hot rolling. Two kinds of magnesium alloys AZ 31 and AZ 61 after annealing showed no difference in damping capacity.