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The Study of Solderability according to Chemical Analysis in Plating Process  

이준호 (삼성전기 MLCC사업부)
Publication Information
Journal of the Korean institute of surface engineering / v.36, no.2, 2003 , pp. 168-175 More about this Journal
Abstract
The purpose of solder plating on chip external electrode is to provide a proper solderability to chips on PCB's. The quantitative or qualitative analysis of solderability has been performed by destructive methods, reflow or flow. Evidently, the solderability tends to depend on the grain structure which is varied with additives. Research on the feasibility of employing electrochemical techniques to characterize the solderability of electroplated tin - lead, with respect to the additives, was non destructively performed. The deposit morphology and the polarization behavior of electrolytes containing proprietary additives were evaluated to investigate the soldering degradation. The plated panels from synthetic electrolyte were analyzed according to % Sn, plating thickness, deposit appearance, grain structure, solderability and cyclic voltammetry.
Keywords
MLCC; CVS; Solderability;
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