• 한국전기전자재료학회논문지
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• 제30권12호
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• pp.800-805
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• 2017

Randomly patterned and wet chemical etching processes were used to treat anti-glare of display cover glasses. The surface and optical properties of grain size and surface morphology controlled by randomly patterned etching and wet chemical solution etching were investigated. The surface morphology and roughness of the etched samples were examined using a spectrophotometer and a portable surface roughness (Ra) measuring instrument, respectively. The gloss caused by reflection from the glass surface was measured at $60^{\circ}$ using a gloss meter. The surface of the sample etched by the doctor-blade process was more uniform than that obtained from a screen pattern etching process at gel state etching process of the first step. The surface roughness obtained from the randomly patterned etching process depended greatly on the mesh size, which in turn affected the grain size and pattern formation. The surface morphology and gloss obtained by the etching process in the second step depended primarily on the mesh size of the gel state etching process of the first step. In our experimental range, the gloss increased on decreasing the grain size at a lower mesh size for the first step process and for longer reaction times for the second step process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1576-1578
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• 2004

The alumina membrane with nano sized pore was prepared from aluminum by anodic oxidation to apply for storage equipment, gas sensor and stamper. The pore size and cell size of the pores are controlled by anodic oxidation voltage. The alumina thickness was controlled by etching process using 0.2M $H_3PO_4$. The thickness of alumina on Si wafer was very accurately controlled by anodic oxidation time. Nickel with nano-sized grain was electroplated on the Au layer on silicon wafer. The fabricated pores on alumina membrane was the thickness of $7{\sim}10{\mu}m$ with straight nano-sized pore of 307${\sim}$120nm. The alumina by the etching process shows smooth surface. The size of Ni grain was 130nm and 250nm for 10mA/$cm^2$and 20mA/$cm^2$of electroplating currents, respectively.

• 한국주조공학회지
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• 제11권5호
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• pp.398-405
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• 1991

Al-Li alloy has a high strength with low density. Practically this alloy should use by the material which made from the rapid solidification. Therefore we examine the solidification structures of alloy with cooling rate. According to cooling rate increased, grain size and secondary dendrite arm spacing were smaller. Also grain size was further smaller by Zr added. To obtain more fine solidification structure, rapid solidification by single roll melt spinning was performed. According to higher wheel speed, cooling rate increased and cell size was smaller. Because of locally different cooling rate, different cell size was obtained in same specimen. More than cooling rate $10^6^{\circ}C$ /sec, zone A(insensible zone to corrosion)was obtained.

• 소성∙가공
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• 제14권4호
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• pp.338-350
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• 2005

Recently, in the field of automobile industry, to solve the problem of reducing the weight of automobile for the improvement of fuel efficiency and the protection of environment, the aluminum alloy parts have been substituted for the steel parts. However, the aluminum alloy does not have as good mechanical property as the steel part. To improve the mechanical property, the semi-solid die casting process is performed to make automobile parts. In the fabrication of semisolid material the control of the liquid segregation is very important to improve the material properties of aluminum alloy. In the present paper we examine the influence of the liquid segregation by the injection conditions in the semi-solid die casting has been investigated.

• 항공우주기술
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• 제7권2호
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• pp.103-109
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• 2008

액체로켓 연소기의 제작에 필수적인 재생냉각 노즐의 벌징공정에 대한 연구를 수행하였다. 벌징공정을 개발하기 위하여 벌징시험용 재료에 대한 인장시험을 수행하여 기계적인 물성 값들을 획득하였다. 벌징공정을 완료하기 위해서는 벌징치구가 2개 또는 3개 필요하였다. 재료의 네킹이 벌징공정에서 발생되는 주된 실패 원인이었으며, 재료의 그레인 사이즈가 이 네킹 발생에 큰 영향을 미침을 본 연구에서 나타났다. 그레인 사이즈를 조절한 재료로 현재 개발된 벌징공정을 이용하여 축소형 및 30톤 실물형 재생냉각 노즐의 제작을 성공적으로 수행함으로서 본 연구에서 개발된 벌징공정의 적용성 및 유용성을 보여주었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.170-173
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• 2001

Thin films of phase-pure perovskite (P $b_{0.72}$L $a_{0.28}$) $Ti_{0.93}$ $O_3$(PLT) were deposited in-situ onto Pt/Ti/ $SiO_2$/Si substrates by pulsed laser deposition. We have systematically investigated the variation of grain sizes depending on the process condition. Both in-situ annealing and ex-situ annealing treatments have been compared depending on the annealing time. Two-step process to grow (P $b_{0.72}$L $a_{0.28}$) $Ti_{0.93}$ $O_3$(PLT) films was adopted and verified to be useful to enlarge the grain size of the film and to enhance the leakage current characteristics. The grain sizes of PLT thin films were successfully controlled 260 to 350 nm by changing process parameters. Electrical properties including dielectric constant, ferroelectric characteristics, crystallization and leakage current of PLT thin films were shown to be strongly inf1uenced by grain size. Also PLT thin films on p-type(100) Si substrate will be fabricated by pulsed laser deposition technique using a Nd:YAG laser with different wavelengths of 355, 532 and 1064 nm. Effect of the variation of laser wavelength on dielectric properties will be discussed. Microstructural and electrical properties of the film were investigated by C-V measurement leakage current measurement and SEM.ent and SEM.

• 소성∙가공
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• 제22권8호
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• pp.456-462
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• 2013

Compression tests were conducted at the various temperatures and strain rates to investigate void formation and microstructures behavior of a 1.9wt%C ultrahigh carbon steel used in forged workrolls. The microstructure, grain size and volume fraction of cementite were determined using specimens deformed in the temperature range from 800 to $1150^{\circ}C$ and strain rates from 0.01 to 10/s. It was found from the microstructural analysis that the grain size is larger at higher temperatures and lower strain rate deformation conditions. In addition, a higher volume fraction of cementite was measured at lower temperatures. The brittle blocky cementite was fractured at $800^{\circ}C$ and $900^{\circ}C$ regardless of strain rate. As a result, numerous new micro voids were formed in the fragmented blocky cementite. It was also found that local melting can occur at temperatures of more than $1130^{\circ}C$. Therefore, the forging temperature should be controlled between $900^{\circ}C$ and $1120^{\circ}C$. The temperature rise, which depends on the anvil stroke and velocity, was estimated through cogging simulation to find the appropriate forging temperature and to prevent local melting due to plastic work.

• 한국분말재료학회지
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• 제13권2호
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• pp.124-128
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• 2006

In recent years, equal channel angular pressing (ECAP) has been the subject of intensive study due to its capability of producing fully dense samples having a ultrafine grain size. In this paper, the ECAP process was applied to metallic powders in order to achieve both powder consolidation and grain refinement. In the ECAP process for solid and powder metals, knowledge of the internal stress, strain and strain rate distribution is fundamental to the determination of the optimum process conditions for a given material. The properties of the ECAP processed solid and powder materials are strongly dependent on the shear plastic deformation behavior during ECAP, which is controlled mainly by die geometry, material properties, and process conditions. In this study, we investigated the consolidation, plastic deformation and microstructure evolution behaviour of the powder compact during ECAP.

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.1001-1006
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• 2005

A new fabrication method is proposed to form the stacked polysilicon gate by nitridation in $N_2$ atmosphere using conventional LP-CVD system. Two step stacked layers with an amorphous layer on top of a polycrystalline layer as well as three step stacked layers with polycrystalline films were fabricated using the proposed method. SIMS profile showed that the proposed method would successfully create the nitrogen-rich layers between the stacked polysilicon layers, thus resulting in effective retardation of dopant diffusion. It was observed that the dopants in stacked films were piled-up at the interface. TEM image also showed clear distinction of stacked layers, their plane grain size and grain mismatch at interface layers. Therefore, the number of stacked polysilicon layers with different crystalline structures, interface position and crystal phase can be easily controlled to improve the device performance and reliability without any negative effects in nano-scale CMOSFETs.

• 한국세라믹학회지
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• 제25권5호
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• pp.465-472
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• 1988

Alpha alumina powder with fine particle size and narrow particle size distribution was prepared by precipitation method using Al2(SO4)3.18H2O as a starting material. The alpha alumina powder was prepared by calcining aluminum hydroxide which was formed under various pH values. The sinterabilityof alpha alumina powder and the effect of MgO on the sinterability of alpha alumina powder were investigated. The sinterability of alpha alumina powder was the order of pH=10≒pH11>pH=7≒pH9, and alpha alumina obtained from boehmite which was prepared by precipitation method reached to 97.5% of theoretcal density by the pressureless sintering. The effect of MgO on volume shrinkage of alumina was very slight in the initial sintering stage but remarkable in the final sintering stage. It was also found that MgO controlled effectively the grain growth of alumina.