• Title/Summary/Keyword: Grain Boundary a

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Critical currents across grain boundaries in YBCO : The role of grain boundary structure

  • Miller Dean J.;Gray Kenneth E.;Field Michael B.;Kim, Dong-Ho
    • Progress in Superconductivity
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    • v.1 no.1
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    • pp.14-19
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    • 1999
  • Measurements across single grain boundaries in YBCO thin films and bulk bicrystals have been used to demonstrate the influence of grain boundary structure on the critical current carried across the grain boundary. In particular, we show that one role of grain boundary structure is to change the degree of pinning along the boundary, thereby influencing the critical current. This effect can be used to explain the large difference in critical current density across grain boundaries in thin films compared to that for bulk bicrystal. These differences illustrate the distinction between the intrinsic mechanism of coupling across the grain boundary that determines the maximum possible critical current across a boundary and the measured critical current which is limited by dissipation due to the motion of vortices.

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Development of FE Analysis Scheme for Milli-Part Forming Using Grain Element (유한요소법의 입자요소를 이용한 박판 성형해석)

  • 구태완;강범수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.05a
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    • pp.439-442
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    • 2003
  • This study presents a new computational model to analyze the grain deformation in a polycrystalline aggregate in a discrete manner and based directly in the underlying physical micro-mechanisms. As a result, specific characteristics have to be considered for the numerical analysis. The grains and grain boundary elements are introduced to model individual grains and grain boundary facets, respectively, to consider the size effects in the micro forming. The constitutive description of the grain elements accounts for the rigid-plastic and the grain boundary elements for elastic relationships. The capability of the proposed approach is demonstrated through application of grain element and grain boundary element in the micro forming.

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Effect of serrated grain boundary on stress corrosion cracking of Alloy 600

  • Kim, H.P.;Choi, M.J.;Kim, S.W.;Kim, D.J.;Lim, Y.S.;Hwang, S.S.
    • Nuclear Engineering and Technology
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    • v.50 no.7
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    • pp.1131-1137
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    • 2018
  • The effect of a serrated grain boundary on stress corrosion cracking (SCC) of Alloy 600 was investigated in terms of improvement of SCC resistance. Serrated grain boundaries and straight grain boundaries were obtained by controlled heat treatment. SCC cracks preferentially initiated and grew at grain boundaries normal to the tensile loading axis. Resolved tensile stress normal to the grain boundary was lower in serrated grain boundaries compared to straight grain boundaries. The specimen with serrated grain boundaries showed higher SCC resistance than that with straight grain boundaries due to a lower resolved tensile stress normal to the grain boundary.

INTERGRANULAR CORROSION-RESISTANT STAINLESS STEEL BY GRAIN BOUNDARY ENGINEERING

  • Hiroyuki Kokawa;Masayuki Shimada;Wang, Zhan-Jie;Yutaka S. Sato
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.250-254
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    • 2002
  • Intergranular corrosion of austenitic stainless steels is a conventional and momentous problem during welding and high temperature use. One of the major reasons for such intergranular corrosion is so-called sensitization, i.e., chromium depletion due to chromium carbide precipitation at grain boundaries. Conventional methods for preventing sensitization of austenitic stainless steels include reduction of carbon content in the material, stabilization of carbon atoms as non-chromium carbides by the addition of titanium, niobium or zirconium, local solution-heat-treatment by laser beam, etc. These methods, however, are not without drawbacks. Recent grain boundary structure studies have demonstrated that grain boundary phenomena strongly depend on the crystallographic nature and atomic structure of the grain boundary, and that grain boundaries with coincidence site lattices are immune to intergranular corrosion. The concept of "grain boundary design and control", which involves a desirable grain boundary character distribution, has been developed as grain boundary engineering. The feasibility of grain boundary engineering has been demonstrated mainly by thermomechanical treatments. In the present study, a thermomechanical treatment was tried to improve the resistance to the sensitization by grain boundary engineering. A type 304 austenitic stainless steel was pre-strained and heat-treated, and then sensitized, varying the parameters (pre-strain, temperature, time, etc.) during the thermomechanical treatment. The grain boundary character distribution was examined by orientation imaging microscopy. The intergranular corrosion resistance was evaluated by electrochemical potentiokinetic reactivation and ferric sulfate-sulfuric acid tests. The sensitivity to intergranular corrosion was reduced by the thermomechanical treatment and indicated a minimum at a small roll-reduction. The frequency of coincidence-site-lattice boundaries indicated a maximum at a small strain. The ferric sulfate-sulfuric acid test showed much smaller corrosion rate in the thermomechanically-treated specimen than in the base material. An excellent intergranular corrosion resistance was obtained by a small strain annealing at a relatively low temperature for long time. The optimum parameters created a uniform distribution of a high frequency of coincidence site lattice boundaries in the specimen where corrosive random boundaries were isolated. The results suggest that the thermomechanical treatment can introduce low energy segments in the grain boundary network by annealing twins and can arrest the percolation of intergranular corrosion from the surface.

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The study of Grain boundary diffusion effect in Tin/Cu by Xps (XPS를 이용한 TiN/Cu의 Grain boundary diffusion 연구)

  • 임관용;이연승;정용덕;이경민;황정남;최범식;원정연;강희재
    • Journal of the Korean Vacuum Society
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    • v.7 no.2
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    • pp.112-117
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    • 1998
  • TiN has been investigated as a good candidate for a diffusion barrier of Cu. Therefore, in this study, the grain boundary diffusion of Cu in TiN film was investigated by X-ray photoelectron spectroscopy(XPS). In general, TiN has a columnar grain structure. In the relatively lower temperature, less than 1/3 of the melting point, it was observed that Cu diffused into TiN mainly along the grain boundaries of TiN. The grain size of TiN was measured by atomic force microscope (AFM). In order to estimate the grain boundary diffusion constants, we used the modified surface accumulation method. The activation energy, $Q_b$ was 0.23 eV, and the diffusivity, $D_{bo}$ was $5.5\times10^{-12{\textrm{cm}^2$/sec.

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Chemically Induced Zigzag Migration in Alumina Bicrystals (알루미나 쌍결정에서 조성변화에 의한 Zigzag Migration)

  • 백용균;강석중
    • Journal of the Korean Ceramic Society
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    • v.32 no.10
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    • pp.1117-1122
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    • 1995
  • The effect of grain boundary structure on zigzag migrtion has been studied. Five kinds of a(2110)-m(1010) diffusion couples with different twist angles by 30$^{\circ}$from a [0001] common direction of each plane were prepared. When chromia (Cr2O3) was added to the diffusion couples by a vapor phase, zigzag migration of the grain boundary occurred. The fraction of zigzag migration did not essentially vary with the twist angle, but the magnitude and migration distance of individual migrating segment varied. The variation of CIGM morphology thus appears to result from the change in grain boundary mobility due to microscopic deviation of grain boundary structure out of a macroscopic grain boundary orientation.

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A multiple level set method for modeling grain boundary evolution of polycrystalline materials

  • Zhang, Xinwei;Chen, Jiun-Shyan;Osher, Stanley
    • Interaction and multiscale mechanics
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    • v.1 no.2
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    • pp.191-209
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    • 2008
  • In this paper, we model grain boundary evolution based on a multiple level set method. Grain boundary migration under a curvature-induced driving force is considered and the level set method is employed to deal with the resulting topological changes of grain structures. The complexity of using a level set method for modeling grain structure evolution is due to its N-phase nature and the associated geometry compatibility constraint. We employ a multiple level set method with a predictor-multicorrectors approach to reduce the gaps in the triple junctions down to the grid resolution level. A ghost cell approach for imposing periodic boundary conditions is introduced without solving a constrained problem with a Lagrange multiplier method or a penalty method. Numerical results for both uniform and random grain structures evolution are presented and the results are compared with the solutions based on a front tracking approach (Chen and Kotta et al. 2004b).

FE Analysis and Experiments of Milli-fart forming Using Grain and Grain Boundary Element (입자요소를 이용한 미세 성형 부품의 유한요소 해석 및 실험)

  • Ku, Tae-Wan;Kang, Beom-Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.27 no.1
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    • pp.109-118
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    • 2003
  • The recent trend towards miniaturization causes an increased demand for parts with very small dimensions. Milli-structure components are classified as a component group whose size is between macro- and micro-scale. The manufacturing process of these components of thin sheet metal forming has a microscopic properties in addition to a typical phenomenon of bulk deformation because of the forming size. Also, the material properties and the deformation behavior change with miniaturization, which means that, a coarse grained materials show a higher resistance against deformation, when the grain size is in the range of the sheet thickness. In this study, a new numerical approach is proposed to simulate intergranular milli-structure in forming by the finite element method. The grain element and grain boundary element are introduced to simulate the milli-structure in the bending. The grain element is used to analyze the deformation of individual grain while the grain boundary element is for the investigation on the movement of the grain boundary. Also, the result of the finite element analysis is confirmed by a series of milli-sized forming experiments.

Effects of Serrated Grain Boundary Structures on Boron Enrichment and Liquation Cracking Behavior in the Simulated Weld Heat-Affected Zone of a Ni-Based Superalloy (니켈기 초내열합금의 파형 결정립계 구조가 보론 편석과 재현 열영향부 액화균열거동에 미치는 영향)

  • Hong, Hyun-Uk;Choi, June-Woo;Bae, Sang-Hyun;Yoon, Joong-Geun;Kim, In-Soo;Choi, Baig-Gyu;Kim, Dong-Jin;Jo, Chang-Yong
    • Journal of Welding and Joining
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    • v.31 no.3
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    • pp.31-38
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    • 2013
  • The transition of serrated grain boundary and its effect on liquation behavior in the simulated weld heat-affected zone (HAZ) have been investigated in a wrought Ni-based superalloy Alloy 263. Recently, the present authors have found that grain boundary serration occurs in the absence of adjacent coarse ${\gamma}^{\prime}$ particles or $M_{23}C_6$ carbides when a specimen is direct-aged with a combination of slow cooling from solution treatment temperature to aging temperature. The present study was initiated to determine the interdependence of the serration and HAZ property with a consideration of this serration as a potential for the use of a hot-cracking resistant microstructure. A crystallographic study indicated that the serration led to a change in grain boundary character as special boundary with a lower interfacial energy as those terminated by low-index {111} boundary planes. It was found that the serrated grain boundaries are highly resistant to boron enrichment, and suppress effectively grain coarsening in HAZ. Furthermore, the serrated grain boundaries showed a higher resistance to susceptibility of liquation cracking. These results was discussed in terms of a significant decrease in interfacial energy of grain boundary by the serration.

Effect of Impurities in Grain Boundary Phases on Wear Behavior of $Si_3N_4$ (질화규소의 입계상에 존재하는 불순물이 마모에 미치는 영향)

  • 오윤석;임대순;이경호
    • Journal of the Korean Ceramic Society
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    • v.33 no.3
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    • pp.277-284
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    • 1996
  • The water test results indicated that the impurities had detrimetal effect on the wear resistance of silicon nitride and the effects were getting severe as the temperature increased. Especially when Ca existed as an impurity the detrimental effects was the most severe. These results were resulted from the fact that impurities lowered the mechanical properties of the grain boundary phase of silicon nitride. The wear test results of glass/glass-ceramic specimens having a similar composition to the grain boundary phase of silicon nitride revea-led that the specimen containing CaO showed the lowest wear resistance. The existence of Fe and Ca at the grain boundary phase assisted forming a grain boundary phase with relatively low refractoriness. Therefore at a given wear condition the removal of deformed layer would be easier. The results showed that the glass phases could be modified by heat-treatment and this modification improved tribological characteristics of the silicon nitride.

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