• 제목/요약/키워드: Grain Boundary

검색결과 1,199건 처리시간 0.024초

Effect of serrated grain boundary on stress corrosion cracking of Alloy 600

  • Kim, H.P.;Choi, M.J.;Kim, S.W.;Kim, D.J.;Lim, Y.S.;Hwang, S.S.
    • Nuclear Engineering and Technology
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    • 제50권7호
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    • pp.1131-1137
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    • 2018
  • The effect of a serrated grain boundary on stress corrosion cracking (SCC) of Alloy 600 was investigated in terms of improvement of SCC resistance. Serrated grain boundaries and straight grain boundaries were obtained by controlled heat treatment. SCC cracks preferentially initiated and grew at grain boundaries normal to the tensile loading axis. Resolved tensile stress normal to the grain boundary was lower in serrated grain boundaries compared to straight grain boundaries. The specimen with serrated grain boundaries showed higher SCC resistance than that with straight grain boundaries due to a lower resolved tensile stress normal to the grain boundary.

$\Sigma=5(210)$ 결정립계를 포함한 구리 bicrystal 모재상 스크래칭에 관한 분자역학모사 (Molecular dynamics simulation of scratching a Cu bicrystal across a $\Sigma=5(210)$ grain boundary)

  • 김기정;조민형;장호
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2004년도 학술대회지
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    • pp.215-220
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    • 2004
  • Molecular Dynamics(MD) method was used to investigate the change of friction force due to interaction between dislocations and a grain boundary when a Ni tip was scratched on a Cu bicrystal. The substrate comprised a Cu bicrystal containing a vertical$\Sigma=5(210)$ grain boundary. The moving tip for scratching simulation was consisted of fixed Ni atoms emulating a rigid tip. The indentation depth was $3.6\AA$ and the scratching was performed along <110>direction in the first grain. As the scratching was continued, nucleation and propagation of dislocations were observed. In the early stage, the grain boundary played as a barrier to moving dislocations and interrupting further dislocation movement with no dislocation resulting in no propagation across the grain boundary. As the Ni tip approached the grain boundary, dislocations were nucleated at the grain boundary and propagated to the second grain. However, stick-slip phenomena that were observed on a single crystal scratching were not observed in the bicrystal. And, instead, irregular oscillation of friction force was observed during the scratching due to the presence of a grain boundary.

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유한요소법의 입자요소를 이용한 박판 성형해석 (Development of FE Analysis Scheme for Milli-Part Forming Using Grain Element)

  • 구태완;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 춘계학술대회논문집
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    • pp.439-442
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    • 2003
  • This study presents a new computational model to analyze the grain deformation in a polycrystalline aggregate in a discrete manner and based directly in the underlying physical micro-mechanisms. As a result, specific characteristics have to be considered for the numerical analysis. The grains and grain boundary elements are introduced to model individual grains and grain boundary facets, respectively, to consider the size effects in the micro forming. The constitutive description of the grain elements accounts for the rigid-plastic and the grain boundary elements for elastic relationships. The capability of the proposed approach is demonstrated through application of grain element and grain boundary element in the micro forming.

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XPS를 이용한 TiN/Cu의 Grain boundary diffusion 연구 (The study of Grain boundary diffusion effect in Tin/Cu by Xps)

  • 임관용;이연승;정용덕;이경민;황정남;최범식;원정연;강희재
    • 한국진공학회지
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    • 제7권2호
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    • pp.112-117
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    • 1998
  • TiN을 Cu의 확산방지막으로 사용하기 위해 많은 연구가 되어왔는데, 이 연구에서는 특히 X-ray photoelectron spectroscopy(XPS)를 이용하여 TiN박막에서의 Cu의 확산현상을 연구하였다. TiN박막은 일반적으로 columnar grain을 형성하면서 성장을 하는데, 녹는점의 1/3에 해당하는 비교적 낮은 온도에서는 grain들의 경계를 따라 Cu가 확산함을 확인하였다. Atomic force microscopy(AFM)를 이용하여 grain의 모양을 관찰하였고, 이 grain boundary 를 통한 확산 현상을 연구하기 위하여, modified surface accumulation method를 이용하였 다. 연구 결과, TiN박막에서의 Cu의 grain boundary diffusion의 활성화 에너지 $Q_b$는 0.23 eV, Diffusivity $D_{bo}$$5.5\times10^{-12{\textrm{cm}^2$/sec의 값을 얻었다.

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INTERGRANULAR CORROSION-RESISTANT STAINLESS STEEL BY GRAIN BOUNDARY ENGINEERING

  • Hiroyuki Kokawa;Masayuki Shimada;Wang, Zhan-Jie;Yutaka S. Sato
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.250-254
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    • 2002
  • Intergranular corrosion of austenitic stainless steels is a conventional and momentous problem during welding and high temperature use. One of the major reasons for such intergranular corrosion is so-called sensitization, i.e., chromium depletion due to chromium carbide precipitation at grain boundaries. Conventional methods for preventing sensitization of austenitic stainless steels include reduction of carbon content in the material, stabilization of carbon atoms as non-chromium carbides by the addition of titanium, niobium or zirconium, local solution-heat-treatment by laser beam, etc. These methods, however, are not without drawbacks. Recent grain boundary structure studies have demonstrated that grain boundary phenomena strongly depend on the crystallographic nature and atomic structure of the grain boundary, and that grain boundaries with coincidence site lattices are immune to intergranular corrosion. The concept of "grain boundary design and control", which involves a desirable grain boundary character distribution, has been developed as grain boundary engineering. The feasibility of grain boundary engineering has been demonstrated mainly by thermomechanical treatments. In the present study, a thermomechanical treatment was tried to improve the resistance to the sensitization by grain boundary engineering. A type 304 austenitic stainless steel was pre-strained and heat-treated, and then sensitized, varying the parameters (pre-strain, temperature, time, etc.) during the thermomechanical treatment. The grain boundary character distribution was examined by orientation imaging microscopy. The intergranular corrosion resistance was evaluated by electrochemical potentiokinetic reactivation and ferric sulfate-sulfuric acid tests. The sensitivity to intergranular corrosion was reduced by the thermomechanical treatment and indicated a minimum at a small roll-reduction. The frequency of coincidence-site-lattice boundaries indicated a maximum at a small strain. The ferric sulfate-sulfuric acid test showed much smaller corrosion rate in the thermomechanically-treated specimen than in the base material. An excellent intergranular corrosion resistance was obtained by a small strain annealing at a relatively low temperature for long time. The optimum parameters created a uniform distribution of a high frequency of coincidence site lattice boundaries in the specimen where corrosive random boundaries were isolated. The results suggest that the thermomechanical treatment can introduce low energy segments in the grain boundary network by annealing twins and can arrest the percolation of intergranular corrosion from the surface.

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알루미나 쌍결정에서 조성변화에 의한 Zigzag Migration (Chemically Induced Zigzag Migration in Alumina Bicrystals)

  • 백용균;강석중
    • 한국세라믹학회지
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    • 제32권10호
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    • pp.1117-1122
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    • 1995
  • The effect of grain boundary structure on zigzag migrtion has been studied. Five kinds of a(2110)-m(1010) diffusion couples with different twist angles by 30$^{\circ}$from a [0001] common direction of each plane were prepared. When chromia (Cr2O3) was added to the diffusion couples by a vapor phase, zigzag migration of the grain boundary occurred. The fraction of zigzag migration did not essentially vary with the twist angle, but the magnitude and migration distance of individual migrating segment varied. The variation of CIGM morphology thus appears to result from the change in grain boundary mobility due to microscopic deviation of grain boundary structure out of a macroscopic grain boundary orientation.

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질화규소의 입계상에 존재하는 불순물이 마모에 미치는 영향 (Effect of Impurities in Grain Boundary Phases on Wear Behavior of $Si_3N_4$)

  • 오윤석;임대순;이경호
    • 한국세라믹학회지
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    • 제33권3호
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    • pp.277-284
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    • 1996
  • The water test results indicated that the impurities had detrimetal effect on the wear resistance of silicon nitride and the effects were getting severe as the temperature increased. Especially when Ca existed as an impurity the detrimental effects was the most severe. These results were resulted from the fact that impurities lowered the mechanical properties of the grain boundary phase of silicon nitride. The wear test results of glass/glass-ceramic specimens having a similar composition to the grain boundary phase of silicon nitride revea-led that the specimen containing CaO showed the lowest wear resistance. The existence of Fe and Ca at the grain boundary phase assisted forming a grain boundary phase with relatively low refractoriness. Therefore at a given wear condition the removal of deformed layer would be easier. The results showed that the glass phases could be modified by heat-treatment and this modification improved tribological characteristics of the silicon nitride.

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A STUDY ON THE BEHAVIOR OF BORON DISTRIBUTION IN LOW CARBON STEEL BY PARTICLE TRACKING AUTORADIOGRAPHY

  • Mun, Dong-Jun;Shin, Eun-Joo;Koo, Yang-Mo
    • Nuclear Engineering and Technology
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    • 제43권1호
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    • pp.1-6
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    • 2011
  • The behavior of the non-equilibrium grain boundary segregation of boron in low carbon steel was studied through a particle tracking autoradiography. The behavior of the non-equilibrium grain boundary segregation of boron during continuous cooling was compared with the isothermal kinetics of the non-equilibrium grain boundary segregation of boron at the holding temperature using an effective time method. On the basis of the experiments, the cooling rate dependence of the non-equilibrium segregation of boron was explained using the time dependence of the non-equilibrium segregation of boron in low carbon steel. The experimental observations for the cooling rate dependence of the grain boundary segregation of boron are in good agreement with the time dependence of the grain boundary segregation of boron. The mechanisms of the non-equilibrium segregation of boron during cooling in low carbon steel are also discussed.

A multiple level set method for modeling grain boundary evolution of polycrystalline materials

  • Zhang, Xinwei;Chen, Jiun-Shyan;Osher, Stanley
    • Interaction and multiscale mechanics
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    • 제1권2호
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    • pp.191-209
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    • 2008
  • In this paper, we model grain boundary evolution based on a multiple level set method. Grain boundary migration under a curvature-induced driving force is considered and the level set method is employed to deal with the resulting topological changes of grain structures. The complexity of using a level set method for modeling grain structure evolution is due to its N-phase nature and the associated geometry compatibility constraint. We employ a multiple level set method with a predictor-multicorrectors approach to reduce the gaps in the triple junctions down to the grid resolution level. A ghost cell approach for imposing periodic boundary conditions is introduced without solving a constrained problem with a Lagrange multiplier method or a penalty method. Numerical results for both uniform and random grain structures evolution are presented and the results are compared with the solutions based on a front tracking approach (Chen and Kotta et al. 2004b).

입자요소를 이용한 미세 성형 부품의 유한요소 해석 및 실험 (FE Analysis and Experiments of Milli-fart forming Using Grain and Grain Boundary Element)

  • 구태완;강범수
    • 대한기계학회논문집A
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    • 제27권1호
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    • pp.109-118
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    • 2003
  • The recent trend towards miniaturization causes an increased demand for parts with very small dimensions. Milli-structure components are classified as a component group whose size is between macro- and micro-scale. The manufacturing process of these components of thin sheet metal forming has a microscopic properties in addition to a typical phenomenon of bulk deformation because of the forming size. Also, the material properties and the deformation behavior change with miniaturization, which means that, a coarse grained materials show a higher resistance against deformation, when the grain size is in the range of the sheet thickness. In this study, a new numerical approach is proposed to simulate intergranular milli-structure in forming by the finite element method. The grain element and grain boundary element are introduced to simulate the milli-structure in the bending. The grain element is used to analyze the deformation of individual grain while the grain boundary element is for the investigation on the movement of the grain boundary. Also, the result of the finite element analysis is confirmed by a series of milli-sized forming experiments.