• Elastomers and Composites
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• v.34 no.1
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• pp.45-52
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• 1999

This paper describes how the gold particles self assemble on the specific phase on the microphase separated block copolymer thin film and form a well ordered patterns. For this study, polystyrene-polybutadiene-polystyrene (PS-PB-PS) triblock copolymer (30wt % PS) thin films (${\sim}100nm$) having a cylindrical morphology were cast from 0.1wt% toluene solution to be used as polymer thin film templates. The films having either vertical PS cylinders or in-plane PS cylinders in PB matrix from each different solvent evaporation condition were obtained. Cross-sectional transmission electron microscopy(TEM) was used to study the surface and bulk morphologies of block copolymer thin films. Small amount of gold particles was evaporated on a block copolymer thin film template to obtain a nano-scale pattern. When an as-cast thin film template was used, gold particles preferentially self assemble on the low surface tension PB phase and a relatively well ordered pattern in nano-scale was produced. However, after the formation of a low surface energy PB rich layer upon annealing, a gold self-assembled pattern was not observed.

• 한국초전도학회:학술대회논문집
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• v.9
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• pp.348-351
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• 1999

We investigated current limiting properties for an SFCL of YBCO thin film coated with an Au layer. The YBCO film of 1 mm wide and 400 nm thick could carry the current 9.6 A$_{peak}$ without quench. The SFCL limited the fault current below 7.6 A$_{peak}$, which otherwise increases above 65 A$_{peak}$ and melted down at the potential fault current of about 100 A$_{peak}$ which is 10 times greater than the quench current. This means that the Au layer successfully protected the superconducting film by dispersing the heat generated at hot spots and electrically shunting the YBCO film.

• Journal of the Korean Institute of Telematics and Electronics
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• v.8 no.2
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• pp.1-5
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• 1971

The resistances of gold thin film are measured as a function of thickness and temperature(300$^{\circ}$k~420$^{\circ}$k). In this paper, the experimental results are analysed using the theory which had been proposed by Sondheimer and Neugebauer and it is shown that the temperature coefficient of resistance of gold thin film become meatily zero at the value of thickness of about 45$\AA$ and its critical thickness is about 60$\AA$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.1-25.1
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• 2011

Over the past few decades, metallic nanoparticles (NPs) have been of great interest due to their unique mesoscopic properties which distinguish them from those of bulk metals; such as lowered melting points, greater versatility that allows for more ease of processability, and tunable optical and mechanical properties. Due to these unique properties, potential opportunities are seen for applications that incorporate nanomaterials into optical and electronic devices. Specifically, the development of metallic NPs has gained significant interest within the electronics field and technological community as a whole. In this study, gold (Au) pads for surface finish in electronic package were developed by inkjet printing of Au NPs. The microstructures of inkjet-printed Au film were investigated by various thermal treatment conditions. The film showed the grain growth as well as bonding between NPs. The film became denser with pore elimination when NPs were sintered under gas flows of $N_2$-bubbled through formic acid ($FA/N_2$) and $N_2$, which resulted in improvement of electrical conductance. The resistivity of film was 4.79 ${\mu}{\Omega}$-cm, about twice of bulk value. From organic anlayses of FTIR, Raman spectroscopy, and TGA, the amount of organic residue in the film was 0.43% which meant considerable removal of the solvent or organic capping molecules. The solder ball shear test was adopted for solderability and shear strength value was 820 gf (1 gf=9.81 mN) on average. This shear strength is good enough to substitute the inkjet-printed Au nanoparticulate film for electroplating in electronic package.

• Journal of the Korean Electrochemical Society
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• v.5 no.3
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• pp.143-152
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• 2002

The growth of Polypyrrole film has been investigated during electropolymerization in an aqueous solution on bare and SAM modified gold electrodes by in-situ EQCM and ex-situ AFM. According to the result of cyclic voltammetry measurements, in the case of a bare gold electrode, the electrochemical deposition of polypyrrole were dependent on the limiting oxidative potential, but not on scan numbers. When the limiting potential higher than 0.8 V was applied on the electrode, the amount of polypyrrole deposited on a gold electrode was rapidly increased and the abnormal mass change attributed to the rearrangement of polypyrrole films was observed as the scan number increased. The polypyrrole film Prepared on electrodes modified with 1-dodecanethiol SAM or thiophene SAM grew 3-dimensionally with the rearrangement of film. However, in the case of BPUS SAM, 2-dimensional layer-by-layer growth of film was observed without the rearrangement of film. AFM images showed films with chain-shaped and/ or donut-shaped polymers when grown rapidly and a wrinkled film at the steady state condition.

• The Journal of Korean Academy of Prosthodontics
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• v.38 no.1
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• pp.85-97
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• 2000

The purpose of this study was to compare the corrosion characteristics between implant fixture and two types of abutment screw ; gold screw, titanium screw. The anodic polarization behavior, the galvanic corrosion behavior, and the crevice corrosion behavior of prepared samples were investigated using potentiostat and scanning electron microscope. The results were as follows: 1. Anodic polarization behavior of samples; The primary passivation potential of implant fixture was -420mV, implant abutment was -560mV. titanium screw was -370mV and gold screw was -230mV. All samples were shown to have a high corrosion potential and good formation of passive film. The critical passive current density of gold screw was higher than that of other samples and the sample of gold screw showed a unstable passive film formation at passive region. 2. Galvanic corrosion behavior of samples; Contact current density between implant fixture and titanium screw showed $8.023{\times}10^{-5}C/cm^2$. Contact current density between implant fixture and gold screw showed $5.142{\times}10^{-5}C/cm^2$. 3. Crevice corrosion behavior of samples; The crevice corrosion resistance of sample using titanium screw was higher than that of sample using gold screw, and a severe corrosion morphologies were observed at the fixture-screw interface by the scanning electron microscope.

• Journal of Sensor Science and Technology
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• v.25 no.6
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• pp.435-439
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• 2016

We report a novel detection technology for glycated hemoglobin (HbA1c) that is measured primarily to identify the three-month average plasma glucose concentration. In enzymatic measuring of glycated hemoglobin, the generated hydrogen peroxide was then used as a reducing agent of gold (III) for the synthesis of gold (0). Gold nanoparticles obtained from this novel approach were measured by optical and piezoelectric methods. In optical method, we have developed polymer based film-type sensor cartridge filled with all the reagents for glycated hemoglobin analysis and the cartridge worked very well having the detection limit of 0.53% of glycated hemoglobin. On the other hand, quartz crystal microbalance (QCM) sensors also have been developed to determine the abilities of surface modified QCM sensors at various levels of the concentration of glycated hemoglobin to bind gold nanoparticles and limit of detection was 0.90%. Finally, despite of relatively lower sensitivities of QCM sensor and film-type optical sensor than well-plate based optical detection, these two sensors were available to measure the glycated hemoglobin level for diabetes patients and normal person.

• Journal of the Korean Vacuum Society
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• v.8 no.4B
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• pp.514-518
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• 1999

Gold (Au) is not supposed to react with sapphire(single crystalline ) under thermodynamic equillibrium, therefore, a strong adhesion between these two dissimilar materials is not expected. However, pull test showed that the gold film sputter-deposited onto annealed and pre-sputtered sapphire exhibited very strong adhesion even without post-deposition annealing. Strongly and weakly adhered samples as a result of the pull testing were selected to investigate the adhesion mechanisms with Auger electron spectroscopy. The Au/ interfaces were analyzed using a new technique that probes the interface on the film using Auger electron escape depth. It revealed that one or two monolayers of Au-Al-O compound formed at the Au/Sapphire interface when AES in the UHV chamber. It showed that metallic aluminum was detected on the surface of sapphire substrates after irradiating for 3 min. with 7keV Ar+ -ions. These results agree with TRIM calculations that yield preferential ion-beam etching. It is concluded that the formation of Au-Al-O compound, which is responsible for the strong metal-ceramic bonding, is due to ion-induced cleaning and reduction of the sapphire surface, and the kinetic energy of depositing gold atoms, molecules, and micro-particles as a driving force for the inter-facial reaction.

• Smart Structures and Systems
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• v.8 no.5
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• pp.471-486
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• 2011

Various types of strain sensors have been developed and widely used in the field for monitoring the mechanical deformation of structures. However, conventional strain sensors are not suited for measuring large strains associated with impact damage and local crack propagation. In addition, strain sensors are resistive-type transducers, which mean that the sensors require an external electrical or power source. In this study, a gold nanoparticle (GNP)-based polymer composite is proposed for large strain sensing. Fabrication of the composites relies on a novel and simple in situ GNP reduction technique that is performed directly within the elastomeric poly(dimethyl siloxane) (PDMS) matrix. First, the reducing and stabilizing capacities of PDMS constituents and mixtures are evaluated via visual observation, ultraviolet-visible (UV-Vis) spectroscopy, and transmission electron microscopy. The large strain sensing capacity of the GNP-PDMS thin film is then validated by correlating changes in thin film optical properties (e.g., maximum UV-Vis light absorption) with applied tensile strains. Also, the composite's strain sensing performance (e.g., sensitivity and sensing range) is also characterized with respect to gold chloride concentrations within the PDMS mixture.

• Journal of the Korean Chemical Society
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• v.50 no.1
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• pp.32-36
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• 2006

films of gold nanoparticles were formed on indium tin oxide (ITO) by an electrodeposition method from an aminosilicate stabilized gold colloid solution. The thin films were examined by cyclic voltammetry (CV), scanning electron microscopy (SEM), UV-visible, and energy dispersive X-ray spectroscopy (EDXS). The surface coverage of gold nanoparticles on the thin film was estimated to 1.2 nanomole/cm2. An anthraquinone-2, 6-disulfonic acid, disodium salt (AQDS) self-assembled layer was generated by immersing gold thin film into 1mM of AQDS in 0.1M HClO4 solution for over 20 hours. As a result, a new absorbance peak from the multi-layers (AQDS/thin film of gold /ITO) was obtained about at 690 nm. Also, the surface plasmon absorption of multi-layers was measured by UV-Visible spectrometer along with chronoamperometry by applying the various potentials from +0.5V to -0.5V. The maximum surface plasmon absorption band at 550 nm was decreased by applying negative potentials. The change of absorbance was correlated with the surface coverage of the AQDS indicating the pseudo-capacity surface state of the AQDS layer was coupled to the energy level of the plasmonband by applied negative potentials.