• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.270-274
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• 2002

We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2012.04a
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• pp.333-336
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• 2012

ISO 13784-1 sandwich panel tests were conducted by FILK, KICT in Korea, SP in Sweden and CSIRO in Australia. Sandwich panels composed of steel sheets, EPS and glass wool supplied by FILK were tested. Mainly heat release rate was compared and equlity of distribution also analyzed on the point of statistical view based on ISO.

• Proceedings of the Korea Institute of Fire Science and Engineering Conference
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• 2011.11a
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• pp.201-204
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• 2011

ISO 13784-1 sandwich panel tests were conducted by FILK, KICT in Korea, SP in Sweden and CSIRO in Australia. Sandwich panels composed of steel sheets, EPS and glass wool supplied by FILK were tested. Mainly heat release rate was compared and equality of distribution also analyzed on the point of statistical view based on ISO.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.453-458
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• 2001

Analysis of radiation heating system for producing 60" size PDP panels was carried out using $RADCAD^{TM}$ software. Optimum arrangement of infrared heating elements was found to obtain uniform temperature distribution in PDP panel during heating. Heating capacity of each heater was determined to obtain an appropriate maximum panel temperature. Parametric study to find the effect of design parameters such as the thermophysical and optical properties of glass and cooling system was carried out. As a reference system, about 35 kW heating capacity was chosen to obtain about 800 K maximum panel temperature after 30 minute heating. The maximum temperature difference in panel was below 20 K. The maximum/minimum and its difference in the panel were very sensitive to the variation of the emissivity of glass and cooling block.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.63-66
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• 2004

Transparent MgO thin films were deposited on glass substrates by electron beam evaporation of MgO (99.99%) under $O_2$ atmosphere at 150-250 $^{\circ}C$. These films were characterized for their useful properties such as thickness, transmission, and refractive index using ultraviolet / visible (UV/VIS) spectrophotometer, scanning electron microscopy (SEM), and Spectroscopic Ellipsometry. The thickness of MgO films were measured by alpha step instrument and found to be 600 nm to 1000 nm and are meeting the stoichiometry. The transmission spectrum of these films shows transmittance values ${\sim}$92%..

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.45-48
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• 2006

Effectiveness and its possibility of ELA (Excimer Laser Annealing) for advanced Si TFT system on insulator are described. Currently, extensive study is carried out to realize an advanced SoG (System on Glass) based on LTPS (Low Temperature Poly-Si) technique. By reducing further the process temperature and by improving the fabrication process of LTPS, addressing TFT circuits for FPD (Flat Panel Display) can be mounted onto a flexible plastic as well as onto a glass substrate. Functional devices on the insulating panels are developed to be formed by using ELA. Although technical issues are remained for the fabrication process, Si transistors including 3D TFT structure formed by ELA is expected as a functional Si system on insulator in the ubiquitous IT era.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.665-667
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• 2005

VIATRON TECHNOLOGIES has developed FE-RTP system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The system employs sequential heat treatment methods using temperature control and rapid thermal processor modules. The temperature control modules provide exceptionally uniform heating and cooling of the glass substrates to within ${\pm}2^a\;C$. The rapid thermal process that combines heating with field induction accelerates the treatment rates. The new FE-RTP system can process $730{\times}920mm$ glass substrates as thin as 0.4 mm. The uniform nature of poly-Si films produced by FE-RTP resulted in AMOLED panels with no laser-Muras. Furthermore, FE-RTP system also showed superior performances in other heat treatment processes involved in poly-Si TFT fabrications, such as dopant activation, gate oxide densification, hydrogenation, and pre-compaction.

• Structural Engineering and Mechanics
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• v.73 no.6
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• pp.715-724
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• 2020

The influence on flexural strength of Glass/Epoxy laminated composite curved panels of different geometries (cylindrical, spherical, elliptical, hyperboloid and flat) due to inclusion of nano cenosphere filler examined in this research article. The deflection responses of the hybrid structure are evaluated numerically using the isoparametric finite element technique and modelled mathematically via higher-order displacement structural kinematics. To predict the deflection values, a customised in-house computer code in MATLAB environment is prepared using the higher-order isoparametric formulation. Subsequently, the numerical model validity has been established by comparing with those of available benchmark solution including the convergence characteristics of the finite element solution. Further, a few cenosphere filled hybrid composite are prepared for different volume fractions for the experimental purpose, to review the propose model accuracy. The experimental deflection values are compared with the finite element solutions, where the experimental elastic properties are adopted for the computation. Finally, the effect of different variable design dependent parameter and the percentages of nano cenosphere including the geometrical shapes obtained via a set of numerical experimentation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.231-236
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• 2004

The area of flat glass panel displays such as LCD (Liquid crystal display) and PDP (Plasma display panel) has been increased more than 2 $\times$ 2 m$^2$ for productivity improvement. However, such a large panel area incurs large panel deflection during panel transfer using robots or AGV (Automated guided vehicle) systems. Therefore, electronic industries are making an effort to find an alternative transfer system for the large glass panels with small deflection. The air conveyor with porous pads is one plausible solution, but it becomes expensive because the large porous pads cost much and air consumption increases as the panel area increases. In this work, a simple air slit levitating conveyor was devised to lower the equipment cost and to reduce the air consumption of system. The air flow model between the LCD glass panel and conveyor was constructed and its validity was verified by experiments. To minimize the air consumption, the conveyor dimensions were optimized, and the air consumptions between the air conveyors with the air slit and that with the porous pad were compared.

• Journal of the Korean Society for Railway
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• v.13 no.5
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• pp.476-480
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• 2010

In the corrugated steel panels used for railway vehicles, sound insulation performance is significantly deteriorated by local resonance effect. In this study, as a countermeasure, polyurethane foam is filled in the corrugated steel panel and glass wool layer is inserted in the layered floor panel, and then improvement effect of the sound insulation performance is experimentally estimated. Based on ASTM E2249-02, intensity transmission loss is measured and estimated on the corrugated panel and floor structure. The aim of the study is to identify how the foam filling and inserting glass wool layer improve the sound insulation performance of the train body structure in aspect of the weight increment.