• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.469-470
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• 2006

The purpose of this research was to investigate and to find out the optimal annealing condition to mold an aspheric glass to be used for mobile phone module having 2 megapixel and $2.5{\times}$ zoom. Taking annealing rate and re-press temperature after molding as molding variables under the identical molding temperature and pressure, a glass lens was molded. And, Form Accuracy, Lens Thickness, Refractive Index, and Modulation Transfer Function(MTF) were measured in order to observe characteristics of molded lens, and then optimal annealing conditions were determined based on the resulting data. Properties of lens molded under the optimal conditions revealed Form Accuracy[PV] $0.2047\;{\mu}m$ in aspheric surface, and $0.2229\;{\mu}m$ in plane, and MTF value was 30.3 % under 80 lp/mm.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2005년도 춘계학술발표대회 및 제8회 신소재 심포지엄 논문개요집
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• pp.269-269
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• 2005

• 한국주조공학회지
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• 제42권3호
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• pp.198-201
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• 2022

• 한국진공학회지
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• 제19권2호
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• pp.96-104
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• 2010

NIL, S-FIL과 같은 각인 기술(Imprinting lithography)를 적용하기 위한 투명하고 단단한 복제 틀(replica hard mold)을 제작하여 고가의 원판(master)와 패턴이 형성되는 기판과의 접촉을 근본적으로 방지해 경제적인 공정이 가능함을 제안한다. 실리콘 웨이퍼(Si wafer)와 같은 원판(master)과 패턴 형성 시 사용되는 기판과 직접적인 접촉을 방지하기 위해 우선 액상 공정을 이용하여 비접착성 표면처리된 고분자 복제(polymer copy)를 매개체(carrier)로 단단한 복제 틀을 제작한다. 이렇게 제작된 단단한 복제 틀(replica hard mold)는 유리와 거의 같은 강도와 투명도를 나타내며, 각인 공정(imprinting process)에서 석영 틀, 실리콘 웨이퍼(quartz mold, Si wafer)과 같이 값비싼 원판(master)의 직접 사용을 대체하여 성공적으로 패턴을 구현할 수 있다.

• Design & Manufacturing
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• 제16권1호
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• pp.27-35
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• 2022

Thermoforming is a plastic manufacturing process that applies a force to stretch a film of heated thermoplastic material over an engineered mold to create a 3-dimensional shape. After forming, the shaped part can then be trimmed and finished to specification to meet an end-user's requirements. The process and thermoplastic materials are extremely versatile and can be utilized to manufacture parts for a very wide range of applications. In this study, based on K-BKZ nonlinear viscoelastic model, thermoforming process analysis was performed for an interior room-lamp. The predicted thickness was minimum at the corner of a molded film, and maximum at the center of the bottom. By using the Taguchi method of design of experiments, the effects of process conditions on residual stresses were investigated. The dominant factors were the liner thickness and the film heating time. As the thickness of the liner increased, the residual stress decreased. And it was found that the residual stress decreased significantly when the film heating temperature was higher than the glass transition temperature. A thermoforming mold and a trimming mold were manufactured, and the spring back was investigated through experiments. The dominant factors were film heating time, liner thickness, and lower mold temperature. As the film heating time and liner thickness increased, the spring back decreased. In addition, it was found that the spring back decreased as the lower mold temperature increased.

• 한국재료학회지
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• 제32권12호
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• pp.538-544
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• 2022

In existing ceramic mold manufacturing processes, inorganic binder systems (Si-Na, two-component system) are applied to ensure the effective firing strength of the ceramic mold and core. These inorganic binder systems makes it possible to manufacture a ceramic mold and core with high dimensional stability and effective strength. However, as in general sand casting processes, when molten metal is injected at room temperature, there is a limit to the production of thin or complex castings due to reduced fluidity caused by the rapid cooling of the molten metal. In addition, because sodium silicate generated through the vitrification reaction of the inorganic binder is converted into a liquid phase at a temperature of 1,000 ℃. or higher, it is somewhat difficult to manufacture parts through high-temperature casting. Therefore, in this study, a high-strength ceramic mold and core test piece with effective strength at high temperature was produced by applying a Si-Na-Ti three-component inorganic binder. The starting particles were coated with binary and ternary inorganic binders and mixed with an organic binder to prepare a molded body, and then heat-treated at 1,000/1,350/1,500 ℃ to prepare a fired body. In the sample where the two-component inorganic binder was applied, the glass was liquefied at a temperature of 1,000 ℃ or higher, and the strength decreased. However, the firing strength of the ceramic mold sample containing the three-component inorganic binder was improved, and it was confirmed that it was possible to manufacture a ceramic mold and core via high temperature casting.

• 한국세라믹학회지
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• 제56권6호
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• pp.526-533
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• 2019

Indialite/cordierite glass-ceramics demonstrate excellent microwave dielectric properties such as a low dielectric constant of 4.7 and an extremely high quality factor Qf of more than 200 × 10³ GHz when crystallized at 1300℃/20 h, which are essential criteria for application to 5G/6G mobile communication systems. The glass-ceramics applied to dielectric resonators, low-temperature co-fired ceramic (LTCC) substrates, and direct casting glass substrates are reviewed in this paper. The glass-ceramics are fabricated by the crystallization of glass with cordierite composition melted at 1550℃. The dielectric resonators are composed of crystallized glass pellets made from glass rods cast in a graphite mold. The LTCC substrates are made from indialite glass-ceramic powder crystallized at a low temperature of 1000℃/1 h, and the direct casting glass-ceramic substrates are composed of crystallized glass plates cast on a graphite plate. All these materials exhibit excellent microwave dielectric properties.

• 한국CDE학회논문집
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• 제9권2호
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• pp.93-101
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• 2004

In mechanical design, optimization procedures have mostly been implemented solely by CAE codes combined by optimization routine, in which the model is built, analyzed and optimized. In the complex geometries, however, CAD is indispensable tool for the efficient and accurate modeling. This paper presents a method to carry out optimization, in which CAD and CAE are used for modeling and analysis respectively and integrated in an optimization routine. Application Programming Interface (API) function is exploited to automate CAD modeling, which enables direct access to CAD. The advantage of this method is that the user can create very complex object in Parametric and automated way, which is impossible in CAE codes. Unigraphics and ANSYS are adopted as CAD and CAE tools. In ANSYS, automated analysis is done using codes made by a script language, APDL(ANSYS Parametric Design Language). Optimization is conducted by VisualDOC and IDESIGN respectively. As an illustrative example, a mold design problem is studied, which is to minimize temperature deviation over a diagonal line of the surface of the mold in contact with hot glass.

• 한국정밀공학회지
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• 제27권1호
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• pp.105-112
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• 2010

Weldlines are generated during the injection molding process when two or more melt flows are brought into contact. The weldlines are unavoidable in the cases of presence of holes or inserts, multi-gated delivery systems, significant thickness change, etc. At the welded contact region, a 'V'-shaped notch is formed on the surface of the molded part. This 'V'-notch deteriorates not only surface appearance but also mechanical strength of the molded part. To eliminate or reduce weldlines so as to improve the weldline strength, the mold temperature at the corresponding weld locations should be maintained higher than the glass transition temperature of the resin material. The present study implements high-frequency induction heating in order to rapidly raise mold surface temperature without a significant increase in cycle time. This induction heating enables to local mold heating so as to eliminate or reduce weldlines in an injection-molded plastic part. The effect of induction heating conditions on the weldline strength and surface appearance of an injection-molded part is investigated.

• 한국가시화정보학회지
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• 제5권1호
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• pp.3-8
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• 2007

We present simple methods for fabricating high aspect-ratio polymer nanostructures on a solid substrate by rigiflex lithography with tailored capillarity and adhesive force. In the first method, a thin, thermoplastic polymer film was prepared by spin coating on a substrate and the temperature was raised above the polymer's glass transition temperature ($T_g$) while in conformal contact with a poly(urethane acrylate) (PUA) mold having nano-cavities. Consequently, capillarity forces the polymer film to rise into the void space of the mold, resulting in nanostructures with an aspect ratio of ${\sim}4$. In the second method, very high aspect-ratio (>20) nanohairs were fabricated by elongating the pre-formed nanostructures upon removal of the mold with the aid of tailored capillarity and adhesive force at the mold/polymer interface. Finally, these two methods were further used to fabricate micro/nano hierarchical structures by sequential application of the molding process for mimicking nature's functional surfaces such as a lotus leaf and gecko foot hairs.