• Proceedings of the Korea Crystallographic Association Conference
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• 2007.11a
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• pp.38-38
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• 2007

• Proceedings of the Korean Vacuum Society Conference
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• 2007.08a
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• pp.299-299
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.19.1-19.1
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• 2009

Phase change random access memory (PRAM)은 large sensing signal margin, fast programming speed, low operation voltage, high speed operation, good data retention, high scalability등을 가지는 가장 유망한 차세대 비휘발성 메모리이다. 현재 PRAM용 상변화 재료로는 주로 Ge2Sb2Te5가 사용되고 있지만 reset 전류가 높고 reliability 가 좋지 않아서 새로운 상변화 물질 연구가 필요하다. AgInSbTe (AIST)는 GST와 더불어 열에 의한 가역적 상변화를 하는 소재로 광기록 매체에서는 기록 속도가 빠르고 동작 특성이 우수하다는 특징이 있다. 본 연구에서는 XRD, 비저항측정등을 통해 온도에 따른 AIST의 물성 및 결정화 특성을 분석하고 나노 소자제작을 통해 그 전기적 특성을 평가하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.112-115
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• 2003

There is a growing need for a nonvolatile memory technology with faster speed than existing nonvolatile memories. $T_c$(crystallization temperature) is confirmed by measuring the conductivity with the varying temperature. The sample is heated on the hotplate and slow down to the room-temperature. We prepared Te based alloy bulk. The materials can be used for nonvolatile random access memory.

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.1
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• pp.50-57
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• 1986

The fabricatoin sequence of GaAs MIS type diode and its electrical characteristics are presented. Used wafers were undoped GaAS wafer adn Te-doped GaAs wafer. Au and AuGe/Ni was used as schottky contact metal and ohmic contact metal respectively. Oxide layer on GaAs surface was formed by water vapor saturated oxide growth technique and dry oxidation technique. In Te-doped GaAs wafer, cutin voltage of MIS type diode was enhanced about 3V comparing with non-oxide layer diode. From light I-V characteristics fill factor of MIS type Te-doped GaAs diode was about 64%, Voc(open circuit voltage) was 0.67V.

• 한국전자현미경학회:학술대회논문집
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• 2005.05a
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• pp.130-131
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• 2005

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.338-338
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.88-88
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• 2008

• Proceedings of the Korean Vacuum Society Conference
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• 2005.08a
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• pp.119-119
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• 2005

• Journal of the Korean Ceramic Society
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• v.45 no.5
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• pp.276-279
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• 2008

In this research, properties of $N_2$-doped $Sb_2Te_3$ thin film were evaluated using 4-point probe, XRD and AFM. $Sb_2Te_3$ material has faster crystallization rate than $Ge_2Sb_2Te_5$, but sheet resistance difference between amorphous and crystallization state is very low. This low sheet resistance difference decreases sensing margin in reading operation at PRAM device operation. Therefore, in order to overcome this weak point, $N_2$ gas was doped on $Sb_2Te_3$ thin film. Sheet resistance difference between amorphous and crystallized state of $N_2$-doped $Sb_2Te_3$ thin film showed about $10^4$ times higher than Un-doped $Sb_2Te_3$ thin film because of the grain boundary scattering.