• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.1
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• pp.18-27
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• 2004

In this paper, we presents an analytical simulation procedure for evaluation in baseband digital modulated signals distortions in the present of RF power amplifier(SSPA) nonlinear behavior and backoff operations of OFDM wireless transmission system. we obtained the optimum nonlinear transfer function of designed SSPA with the SiGe HBT bias currents of OFDM multi-channel wireless transmission system and compared this transfer function to SSPA nonlinear modeling functions mathematically, we finds optimum bias conditions of designed SSPA. With the derived nonlinear modeling function of SSPA, We analysed the PSD characteristics of in-band and out-band output powers of SSPA EVM measurement results of distorted constellation signals with the input power levels of SSPA. The results of paper can be applied to find the SSPA linearly with optimum bias currents and determine the SSPA input backoff bias for AGC control circuits of SSPA.

• Bulletin of the Korean Chemical Society
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• v.21 no.7
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• pp.720-726
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• 2000

The analytic gradient method for the equation-of-motion coupled-cluster singles and doubles (EOM-CCSD) energy has been extended to employ a reduced molecular orbital (MO) space. Not only the innermost core MOs but also some of the outermost virtua l MOs can be dropped in the reduced MO space, and a substantial amount of computation time can be reduced without deteriorating the results. In order to study the magnitudes and trends of the effects of the dropped MOs, the geometries and vibrational properties of the ground and excited states of BF, CO, CN, N2, AlCl, SiS, P2, BCl, AIF, CS, SiO, PN and GeSe are calculated with different sizes of molecular orbital space. The 6-31 G* and the aug-cc-pVTZ basis sets are employed for all molecules except GeSc for which the 6-311 G* and the TZV+f basis sets are used. It is shown that the magnitudes of the drop-MO effects are about $0.005\AA$ in bond lengths and about 1% on harmonic frequencies and IR intensities provided that the dropped MOs correspond to (1s), (1s,2s,2p), an (1s,2s,2p,3s,3p) atomic orbitals of the first, the second, and the third row atoms, respectively. The geometries and vibrational properties of the first and the second excited states of HCN and HNC are calculated by using a drastically reduced virtual MO space as well as with the well defined frozen core MO space. The results suggest the possibility of using a very smalI MO space for qualitative study of valence excited states.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.55-55
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• 2010

상변화 메모리용 셀은 전류 구동형으로써 셀에 전류를 인가하였을 때 저항이 높은 상태(비정질상)과 저항이 낮은 상태(결정질상)의 두가지 특성을 갖는다. 저항이 높은 상태에서 전류나 전압을 인가하면 높은 저항을 보이다가 일정 값(threshold voltage) 이상에서 낮은 저항을 갖는 현상을 보인다. 이때 상변화물질의 종류 혹은 셀의 사이즈에 따라 threshold voltage의 차이가 나타나는데 이 값을 줄임으로서 상변화 메모리의 구동 전류의 감소에 기여할 수 있다. 본 연구에서는 스퍼터링 방법을 이용해 박막형식의 셀을 제작하여 전기적 특성을 관찰하였다. 셀은 Si 기판 위에 radio frequency power supply 와 direct current power supply를 사용해 하부전극과 상변화층, 그리고 상부전극의 순으로 증착하여 제작하였다. 상변화층은 $Ge_2Sb_2Te_5$를 사용하였고 제작된 셀은 scanning electon microscope(SEM)를 이용하여 표면의 상태를 확인하였고 Keithley 4200scs를 이용하여 인가된 전류 혹은 전압에 따른 특성변화를 측정하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.37-42
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• 2004

Shallow $p^{＋}$-n junctions were formed by preamorphization, low-energy ion implantation and dual-step annealing processes. Germanium ions were implanted into silicon substrates for preamorphization. The dopant implantation was performed into the preamorphized and non-preamorphized substrates using B $F_2$2 ions. Rapid thermal anneal (RTA) and furnace anneal (FA) were employed for dopant activation and damage removal. Samples were annealed by one of the following four methods; RTA(75$0^{\circ}C$/10s)＋Ft FA＋RTA(75$0^{\circ}C$/10s), RTA(100$0^{\circ}C$/10s)＋FA, FA＋The Ge Preamorphized sample exhibited a shallower junction depth than the non-preamorphized sample. When the employed RTA temperature was 100$0^{\circ}C$, FA＋RTA annealing sequence exhibited better junction characteristics than RTA＋FA thermal cycle from the viewpoint of junction depth, sheet resistance, $R_{s}$$.$ $x_{j}$, and leakage current.t.

• Korean Journal of Optics and Photonics
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• v.18 no.5
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• pp.351-361
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• 2007

The samples composed of a GST thin film and the protective layers of $ZnS-SiO_2$ or $Al_2O_3$ coated on c-Si substrate were prepared by using the magnetron sputtering method. Samples of three different structures were prepared, that is, i) the GST single film on c-Si substrate, ii) the GST film sandwiched by the protective $ZnS-SiO_2$ layers on c-Si substrate, and iii) the GST film sandwiched by $Al_2O_3$ protective layers on c-Si substrate. The ellipsometric constants in the temperature range from room temperature to $700^{\circ}C$ were obtained by using the in-situ ellipsometer equipped with a conventional heating chamber. The measured ellipsometric constants show strong variations versus temperature. The variation of ellipsometric constants at the temperature region higher than $300^{\circ}C$ shows different behaviors as the ambient medium is changed from in air to in vacuum or the protective layers are changed from $ZnS-SiO_2$ to $Al_2O_3$. Since the long heating time of 1-2 hours is believed to be the origin of the high temperature variation of ellipsometric constants upon the heating environment and the protective layers, a PRAM (Phase-Change Random Access Memory) recorder is introduced to reduce the heating time drastically. By using the PRAM recorder, the GST samples are heated up to $700^{\circ}C$ decomposed preventing its partial evaporation or chemical reactions with adjacent protective layers. The surface image obtained by SEM and the surface micro-roughness verified by AFM also confirmed that samples prepared by the PRAM recorder have smoother surface than the samples prepared by using the conventional heater.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.1
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• pp.111-116
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• 2006

In this paper, the image sensor using the a-Si:H TFT is proposed. The optimum amorphous silicon thin film is deposited using plasma enhanced chemical vapor deposition (PECVD). TFT and photodiode both with the thin film are fabricated and form image sensor. The photodiode shows that Idark is $10^{-12}A$, Iphoto is $10^{-9}A$ and Iphoto/Idark is $10^3$, respectively. In the case of a-Si:H TFT, it indicates that Ion/Ioff is $10^6$, the drain current is a few ${\mu}A$ and Vth is $2\~4$ volts. For the analysis on the fabricated image sensor, the reverse bias of -5 voltage in ITO of photodiode and $70{\mu}sec$ pulse in the gate of TFT are applied. The image sensor with good property was conformed through the measured photo/dark current.

• Journal of the Korean Institute of Oriental Medical Informatics
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• v.17 no.2
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• pp.82-129
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• 2011

"Beijijiufa" is a medical book republished by Sun Ju Qing in 1245. He compiled this book having added "Qizhumajiufa" and "Zhugejingyanbeijiyaofang" to the contents of "Beijijiufa" authored by Wen Ren Qi Nian. In "Beijijiufa" the author described treatment methods making use of moxibustion methods in connection with 22 cases of acute diseases. The author had collected the moxibustion methods used to treat acute diseases, which had been practiced by the medical practitioners of many generations, and quoted total 13 medical men's practices. In the book, the greatest parts of details were quoted especially from the writings of Sun Si Miao and Ge Hong, and this shows that the medical philosophies of both Sun Si Miao and Ge Hong were reflected onto "Beijijiufa". He had differed on his moxibustion practice: the size of moxa wool, the number of moxibustion treatment, and method of moxibustion for male and female were differed from one another according to the disease. As to the area of moxibustion, he chose the body parts around under four limbs and joints, and mostly used extraordinary acupoints rather than twelve main meridians. In his descriptions of finding meridian points, he did not describe it by its specific name of the reaction point, but explained the location of moxibustion points in detail through pictures. "Qizhumajiufa" is related to moxibustion method and prescriptions to treat surgical diseases, like skin boils or furuncle on the back, etc. He easily explained the method to find the meridian points for moxibustion treatment by using particular way through diagrams and pictures. Eight prescriptions he used were the collections among the historical practices of medical practitioners of many generations for skin boils which showed excellent therapeutic actions. In "Zhugejingyanbeijiyaofang", there are prescribed for 36 disease, also is the records of treatment methods for medical emergency which would be encountered easily in everyday life. As to therapeutic remedies, varied treatment methods, including the treatment by means of pasting and attaching medicinal substance to the spot, the treatment by means of mixing medicinal substance with alcoholic beverage, cleansing method, smoke inhalation remedy etc. were introduced. In "Beijijiufa" moxibustion was regarded as a top priority for treatment of acute disease, and the author strived to present remedies to the readers as easily as possible through 19 pictures. Regarding prescriptions, the author introduced diverse treatment methods with respect to various disease symptoms, and described the method to treat disease symptoms making use of medicinal ingredients which can easily be found in daily life. Likewise, "Beijijiufa" compiled by Sun Ju Qing was intended for clinical practice, and was indeed a medical book having been utilized for treatment of acute diseases in those days.

• Transactions on Electrical and Electronic Materials
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• v.9 no.4
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• pp.137-142
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• 2008

The parasitic resistance is studied to silicon/metal contact junction for improving device performance and to lower contact/serial resistance silicide in natural sequence. In this paper constructs the stepwise Ni silicide process for parasitic resistance reduction for silicon/metal contact junction. We have investigated multi-step Ni silicide on SiGe substrate with stepwise annealing method as an alternative to compose more thermally reliable Ni silicide layer. Stepwise annealing for silicide formation is exposed to heating environment with $5^{\circ}C/sec$ for 10 seconds and a dwelling for both 10 and 30 seconds, and ramping-up and the dwelling was repeated until the final annealing temperature of $700\;^{\circ}C$ is achieved. Finally a direct comparison for single step and stepwise annealing process is obtained for 20 nm nickel silicide through stepwise annealing is $5.64\;{\Omega}/square$ at $600\;^{\circ}C$, and it is 42 % lower than that of as nickel sputtered. The proposed stepwise annealing for Ni silicidation can provide the least amount of NiSi at the interface of nickel silicide and silicon, and it provides lower resistance, higher thermal-stability, and superior morphology than other thermal treatment.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2005.09a
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• pp.160-164
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• 2005

In this paper, MEMS inductor was integrated on a 5GHz VCO using BCB as low-k dielectric layer for MEMS inductor. The VCO core circuit is realized by IBM SiGe process. We varied the spiral inductor's suspension height and posit ion on circuit, and studied their circuit interference effect on VCO performance. The VCO with inductor placed on BCB with More height and the VCO with inductor that was not positioned above active area showed better characteristics.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.3
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• pp.198-206
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• 2011

This paper presents a new programmable compensation circuit (PCC) for a System-on-Chip (SoC). The PCC is integrated with $0.18-{\mu}m$ BiCMOS SiGe technology. It consists of RF Design-for-Testability (DFT) circuit, Resistor Array Bank (RAB) and digital signal processor (DSP). To verify performance of the PCC we built a 5-GHz low noise amplifier (LNA) with an on-chip RAB using the same technology. Proposed circuit helps it to provide DC output voltages, hence, making the RF system chain automatic. It automatically adjusts performance of an LNA with the processor in the SoC when it goes out of the normal range of operation. The PCC also compensates abnormal operation due to the unusual PVT (Process, Voltage and Thermal) variations in RF circuits.