• 한국진공학회지
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• 제21권5호
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• pp.264-272
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• 2012

본 논문에서는 InGaAs 반도체에 기반한 테라헤르쯔(THz) 송/수신기(Tx/Rx) 제작을 위한 기초 연구로서, InGaAs 박막의 THz 발생 및 검출 특성에 관한 결과를 보고한다. THz 발생과 검출 특성 조사에는 각각 MBE 장비로 고온(HT) 및 저온(LT)에서 성장한 InGaAs 박막이 사용되었으며, THz 발생에는 photo-Dember 표면방출 방법이 시도되었다. HT-InGaAs 기판 위에 제작한 전송선(Ti/Au)의 가장자리에 Ti:Sapphire fs 펄스 레이저(60 ps/83 MHz)를 조사하여 THz파를 발생시켰으며, 이때 THz 검출에는 LT-GaAs가 사용되었다. 시간지연에 따른 전류신호를 Fourier 변환하여 얻은 THz 스펙트럼의 주파수 범위는 약 0.5~2 THz이었으며, 여기 레이저 출력에 대한 신호의 세기는 지수함수적 변화를 보였다. THz 검출 특성에 사용한 LT-InGaAs Rx에는 쌍극자(5/20 ${\mu}m$) 구조의 안테나가 탑재되어 있으며, 차단 주파수는 약 2 THz이었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.33-36
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• 2004

탄소 도핑$(5{\times}10^{19}\;cm^{-3})$된 p-type GaAsSb 에피층 위에, Ti/Pt/Au, Pd/Au, Pd/Ir/Au를 이용한 다층 오믹 접촉을 제작하였다. MOCVD(metal-organic chemical vapor deposition)를 이용하여 성장시킨 이 p-GaAsSb의 정공 이동도는 탄소의 도핑 농도가 매우 높음에도 불구하고, $50\;cm^2/Vs$로 측정되었다. 오믹 접촉의 전기적 특성을 측정하기 위하여 TLM(Transfer length method)를 이용하였다. Pd/Ir/Au을 이용한 오믹접촉의 specific contact resistivity는 $10^{-8}\;ohm-cm^2$ 보다 작은 수치를, transfer length는 100 nm보다 작은 수치를 보였으며, Ti/Pt/Au을 이용한 ohmic contact의 specific contact resistivity는 $10^{-7|\;ohm-cm^2$ 보다 작은 수치를, transfer length는 400 nm보다 작은 수치를 나타내었다.

• 한국전자파학회논문지
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• 제26권2호
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• pp.165-170
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• 2015

본 논문에서는 GaAs 기반 저잡음 증폭기가 사용되고 있는 레이더 수신기의 잡음지수를 낮추고, 저잡음 증폭기의 강인성(robustness)을 위하여 GaN HEMT 기반의 저잡음 증폭기를 설계하고 측정하였다. GaAs 기반의 저잡음 증폭기를 사용하는 레이더 수신기의 경우, 맨 앞단에 저잡음 증폭기를 보호하기 위한 리미터(limiter)가 필요하고, 이는 레이더 수신기 전체 잡음지수를 나빠지게 한다. 본 연구에서 측정한 GaN 기반 저잡음 증폭기의 잡음지수는 2 dB 이하로 측정되었다. 상용화된 GaAs 기반 저잡음 증폭기의 경우, 최대 입력 전력은 약 30 dBm인 반면 본 연구에서는 입력 전력이 43 dBm일 때 소자가 번아웃(burn-out)되었고, 전류 제한 모드로 동작시킬 경우 45.4 dBm에서도 강인성이 보장되었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1431-1433
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• 1996

Effective ionization coefficients for (100), (110) and (111) oriented gallium arsenide are extracted from the ionization coefficients far electrons and holes. Analytical formulas for the breakdown voltage of the GaAs Schottky rectifiers are derived by employing the ionization coefficients. The breakdown voltages obtained from our analytical model agree fairly well with the numerical results as well as the experimental ones reported in the range of $10^{14}\;cm^{-3}$ - $5{\times}10^{17}\;cm^{-3}$ doping concentrations.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1992년도 하계학술대회 논문집 B
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• pp.839-842
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• 1992

This paper describes an improved analytic model for a gallium-arsenide MESFET computer simmulation and deals with application to microwave performance. The current-voltage characteristics, the dependence of the capacitances, transconductances and drainconductances on bias conditions and the dependences of s-parameters on various frequencies are calculated. The model is base on a physical picture revealed through two-dimensional numerical analysis, and takes into account transition region and diffusion process under gate but it require a very small computer time. Simulation results agree well with the experimental data found earlier by other author The proposed model can be used for a computer-aided design of GaAs MESFET devices and for a study of application to microwave performance.

• 한국전기전자재료학회논문지
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• 제11권1호
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• pp.12-17
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• 1998

The heteroepitaxial growth of InP and GaInAs on GaAs substrates has been studied by using a new combination of source materials: ethyldimethylindium (EDMIn) and trimethylgallium (TMGa) as group III sources, and tertiarybutylarsine (TBAs) and tertiarybutylphosphine (TBP) as group V sources. Device quality InP heteroepitaxial layers were obtained by using a two-step growth process under atmospheric pressure, involving a growth of an initial nucleation layer at low temperature followed by high temperature annealing and the deposition of epitaxial layer at a growth temperature. The continuity and thickness of nucleation layer were important parameters. The InP layers deposited at 500$^{\circ}$- 55$0^{\circ}C$ are all n-type, and the electron concentration decreases with decreasing TBP/EDMIn molar ratio. The excellent optical quality was revealed by the 4.4 K photoluminescence (PL) measurement with the full width at half maximum (FWHM) of 4.94 meV. Epitaxial Ga\ulcorner\ulcorner\ulcornerIn\ulcorner\ulcorner\ulcornerAs layers have been deposited on GaAs substrates at 500$^{\circ}$ - 55$0^{\circ}C$ by using InP buffer layers. The composition of GaInAs was determined by optical absorption measurements.

• 한국임상수의학회지
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• 제19권3호
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• pp.316-321
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• 2002

The purpose of this study was to examine the effect of Ga-As(Gallium-Arsenide, wave length; 904 nm) infrared laser irradiation on healing of the experimentally crush injured rat sciatic nerves. The bilateral sciatic nerves of 43 adult male Sprague-Dawley rats were compressed surgically with a straight hemostat (1 mm width). The right legs of all the rats were irradiated using a 27 mW Ga-As infrared laser (laser irradiated group). The radiation procedure was administered for 3 minutes every day for 1, 3, 5, and 7 weeks in each group. Left legs were not irradiated and served as the control group. The numbers of total myelinated axon and degenerated myelin in the sciatic nerves of bilateral legs were measured and analyzed with mage analysis system in order to make a morphological analysis of the effect of the Ga-As infrared laser on injured nerves. Total number of myelinated axons was increased with time interval, especially in the 1, 3. and 5 week of irradiated group. Conversely, the number of degenerated myelin was decreased with time interval, especially in the irradiated group. The effects in the irradiated group were more pronounced than those of the control group. In conclusion, the Ga-As infrared laser irradiation is a useful adjuvant therapy to the regeneration of the peripheral nerve injury.

• 대한전자공학회논문지
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• 제24권4호
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• pp.640-645
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• 1987

Surface states and interfacial phenomena at the undoped polycrystalline semiconductor particale-electrolyte interfaces were qualitatively analyzed based on the zeta potentials which were measured with microelectrophoresis measurements. The suspensions were composed of the undoped polycrystaline silicon(Si) or gallium arsenide (GaAs) semiconductor particles stalline Si and GaAs particles in the KCl electrolytes was 3.73~6.2x10**-4 cm\ulcornerV.sec and -2.3~1.4x10**-4cm\ulcornerV.sec at the same conditions, respectively. The range of zeta potentials corresponding to the electrophoretic mobilities is 47.8~80.1mV and -30.1~17.9mV, respectively. The variation of the zeta potentials of the undoped polycrystalline Si was similar to the doped crystalline Si. On the other hand, two points of zeta potential reversal occurred at the undoped polycrystalline GaAs-KCl electrolyte interfaces. The surface states of the undoped polycrystalline Si and GaAs were dominated by positively charged donor surface states. These surface states are attributed to adsorbed ion surface states (slow states) at the semiconductor oxide layer-electrolyte interfaces.

• International Journal of Contents
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• 제7권2호
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• pp.59-63
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• 2011

The aim of our study was to evaluate the immediate effects of an 830-nm Aluminium gallium arsenide (GaAlAs) laser, by examining the changes, in pressure-pain threshold (PPT) and tenderness at 3 kg of the myofascial trigger point (MTrP) of the upper trapezius muscle in visual display terminal (VDT) workers in comparison with placebo treatment. Thirty VDT workers (13 males, 17 females) with complaints of upper trapezius muscle were recruited. All participants were given either active GaAlAs laser (830 nm wavelength, 450 mW, 9 J at point) or placebo GaAlAs laser, according to the double-blinded and placebo-controlled trial. Both active and placebo low-level laser therapy (LLLT) treatments showed no significant effect on PPT and tenderness at 3 kg. These results suggest that a higher dosage may be necessary to produce immediate effects when applying LLLT to the MTrP of relatively large muscles such as the upper trapezius muscle.

• 한국재료학회지
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• 제16권10호
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• pp.652-655
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• 2006

A direct wafer bonding process necessary for GaAs-on-insulator (GOI) fabrication with high thermal annealing temperatures was studied by using PECVD oxides between gallium arsenide and silicon wafers. In order to apply some uniform pressure on initially-bonded wafer pairs, a graphite sample holder was used for wafer bonding. Also, a tool for measuring the tensile forces was fabricated to measure the wafer bonding strengths of both initially-bonded and thermally-annealed samples. GaAs/$SiO_2$/Si wafers with 0.5-$\mu$m-thick PECVD oxides were annealed from $100^{\circ}C\;to\;600^{\circ}C$. Maximum bonding strengths of about 84 N were obtained in the annealing temperature range of $400{\sim}500^{\circ}C$. The bonded wafers were not separated up to $600^{\circ}C$. As a result, the GOI wafers with high annealing temperatures were demonstrated for the first time.