• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.16-19
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• 2000

DC and low frequency noise characteristics of InGaP/InGaAs pseudomorphic HEMTs (p-HEMTs) grown by compound source MBE are investigated for temperature range of 150K to 370K. Equivalent input noise spectra( $S_{iv}$ ) were measured as a function of frequency and temperature. $S_{iv}$ was measured to be 3.4 $\times$ 10$^{-12}$ $V^2$/ Hz at 1kHz for 1.3 X 50${\mu}{\textrm}{m}$$^2$InGaP/InGaAs p-HEMT at room temperature. Measurements of the low-frequency noise spectra of the p-HEMT as a function of temperature show that the trap with an activation energy level around 0.589 eV is a dominant trap that accounts for the low-frequency noise behavior of the device. The normalized extrinsic gm frequency dispersion of the p-HEMT. was as low as 2.5％ at room temperature, indicating that the device has well-behaved low-frequency noise characteristics. Sub-micron (0.25 $\times$ 50${\mu}{\textrm}{m}$$^2$) gate p-HEMT showed $f_{T}$ and $f_{max}$ of 40GHz and 108GHz, respectively.y.y.

• Electrical & Electronic Materials
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• v.8 no.4
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• pp.418-425
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• 1995

The surface of GaAs was treated by using the 0.1M solution of N $a_{2}$S.9 $H_{2}$O. The passivation of the surface in this sample was investigated by the photoreflectance(PR) experiment. The surface electric field( $E_{s}$) and built-in voltage( $V_{bi}$ ) discussed from Franz-Keldysh oscillation of PR signals. The density of surface states and Fermi level of GaAs treated with N $a_{2}$S.9 $H_{2}$O for 40min were determined 1.61*10$^{12}$ c $m^{-2}$ and 0.73eV. These values were about 15 and 10% smaller than those in untreated sample.e.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.1
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• pp.1-10
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• 1999

InGaP epilayers were grown on the flat, $2^{\circ}$off, $6^{\circ}$ off, and $10^{\circ}$off GaAs substrates by organo-metallic vapor phase epitaxy, and influences of crystallographic misorientation of the substrate on the structural and optical properties such as lattice mismatch, elastic strain, lattice curvature, misfit stress, and PL intensity /line-width were investigated in this study. Material characterizations were carried out by TXRD( tripple-axis x-ray diffractometer) and low temperature (11K) PL (photoluminescence). With increase of the substrate misorientation angle (S.M.A.), the relative incorporation of Ga atoms on the substrate surface was found to be enhanced. Also, with increase of the S. M. A., the x-ray line-width of the InGaP epilayer was reduced, indicating that the crystal quality of the epilayer could be improved tilth a misoriented substrate. It was also found that the elastic accommodation of the strain-free lattice misfit was more remarkable in a misoriented sample. PL intensity increased, and PL line-width and emission wavelength decreased with the increase of S. M. A. The results conclude that the elastic characteristics and the crystal quality of the InGaP epilayer could be remarkably enhanced when the misoriented substrates were employed.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.3
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• pp.118-123
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• 1995

We have successfully fabricated a super low noise pseudomorphic HEMT(PHEMT) device with AlGaAs/InGaAs/GaAs sturcture by using improved T-Gate which have increased a large gaet cross-sectional area about two times in comparision with those of conventional T-gate processes. The PHEMSTs with 0.15$\mu$m-long and 140$\mu$m-wide gates have eshibited a super low noise characteristics, the noise figure of 0.45dB with associated gain of 10.87dB at 12GHz. The cut-off rewuqncy of the device is 94gHz with a transconductance of 418mS/mm.

• Bulletin of the Korean Chemical Society
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• v.33 no.1
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• pp.153-158
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• 2012

The hydrogenation of $AlB_2$-type BaGaGe exhibits a metal to insulator (MI) transition, inducing a puckering distortion of the original hexagonal [GaGe] layers. We investigate the electronic structure changes associated with the hydrogen-induced MI transition, using extended H$\ddot{u}$ckel tight-binding band calculations. The results indicate that hydrogen incorporation in the precursor BaGaGe is characterized by an antibonding interaction of $\pi$ on GaGe with hydrogen 1s and the second-order mixing of the singly occupied antibonding $\pi^*$ orbital into it, through Ga-H bond formation. As a result, the fully occupied bonding $\pi$ band in BaGaGe changes to a weakly dispersive band with Ge pz (lone pair) character in the hydride, which becomes located just below the Fermi level. The Ga-Ge bonds within a layered polyanion are slightly weakened by hydrogen incorporation. A rationale for this is given.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.81-86
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• 2001

We have investigated surface photovoltage characteristics of InGaAs grown by metalorganic chemical vapor deposition (MOCVD) method on semi-insulating GaAs. The splitted SPV signals from the substrate and epilayer were observed. The band gap energy of InGaAs was about 1.376 eV, The In composition(x) was determined by Pan's composition formula. The photovoltage gradually decreases with increasing frequency. This is because the transfer of charge from the surface states reduces. From the temperature dependent SPV measurement, we obtained Varshni and temperature coefficients. In spectrum of etched sample at 300 K, the 'A' peak below $E_o(GaAs)$ is related with residual impurity during sample growth.

• JSTS:Journal of Semiconductor Technology and Science
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• v.3 no.2
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• pp.63-68
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• 2003

The DC and RF characteristics of $In_{0.5}Ga_{0.5}P/In_{0.22}Ga_{0.78}As/GaAs$ p-HEMTs with a gate oxide layer of various thicknesses ($50{\;}{\AA},{\;}300{\;}{\AA}$) were investigated and compared with those of a Schottky-gate p-HEMT without the gate oxide layer. A prominent improvement in the breakdown voltage characteristics were observed for a p-HEMT having a gate oxide layer, which was implemented by using a liquid phase oxidation technique. The on-state breakdown voltage of the p-HEMT having the oxide layer of $50{\;}{\AA}$was ~2.3 times greater than that of a Schottky-gate p-HEMT. However, the p-HEMT having the gate oxide layer of $300{\;}{\AA}$ suffered from a poor gate-control capability due to the drain induced barrier lowering (DIBL) resulting from the thick gate oxide inspite of the lower gate leakage current and the higher on-state breakdown voltage. The results for a primitive p-HEMT having the gate oxide layer without any optimization of the structure and the process indicate the potential of p-HEMT having the gate oxide layer for high-power applications.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.159-159
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• 2010

펄스 직류 전원 $BCl_3$/He 플라즈마를 사용하여 GaAs의 건식 식각을 연구하였다. 공정 변수는 가스 유량 (0~100% $BCl_3$ in $BCl_3$/He), 펄스 파워 ($450{\sim}600\;{\nu}$), 펄스 주파수 (100~250 KHz), 펄스 시간 ($0.4{\sim}1.2\;{\mu}s$)이었다. 식각 공정 후 식각률, 포토레지스트에 대한 식각 선택도, 표면 거칠기는 표면 단차 측정기를 이용하였다. 식각 공정 동안 플라즈마 광 특성 분석은 광학 발광분석기 (Optical emission spectroscopy)를 사용하였다. 실험 후 주사 전자 현미경을 이용, 식각 후 시료의 단면과 표면을 관찰하였다. 실험 결과에 의하면 1) 펄스 파워, 주파수, 시간을 고정 ($500\;{\nu}$, $0.7\;{\mu}s$, 200 KHz)하고 10% He 가스가 혼합되어 있는 조건에서 GaAs의 식각률이 순수한 $BCl_3$를 사용한 것보다 높았다. 이를 통해 식각 공정에서 일정량 이하의 He 혼합은 GaAs 식각률을 증가시키는 시너지효과가 있음을 알 수 있었다. 2) 그러나 약 20% 이상의 He 가스의 혼합은 GaAs의 식각 속도를 저하시켰다. 3) 10% He (9 sccm $BCl_3/1$ sccm He), 200 KHz 펄스 주파수, $0.7\;{\mu}s$ 펄스 시간의 조건에서 펄스 파워가 증가함에 따라 GaAs의 식각률 또한 선형적으로 증가하였다. 4) 특히, $600\;{\nu}$의 파워에서 식각률은 ${\sim}0.5\;{\mu}m/min$로 가장 높았다. 5) 표면 단차 측정기와 전자현미경을 이용하여 식각한 GaAs를 분석한 결과 10% He이 혼합되어 있는 조건에서는 우수한 수직 측벽과 매끈한 표면 (RMS roughness <1 nm)을 관찰할 수 있었다. 6) 10% He이 혼합된 $BCl_3$/He 펄스 직류 플라즈마 식각 후 XPS 분석결과에서도 기준 샘플과 비교하였을 때, 공정 후의 GaAs 표면이 화학적으로 깨끗하며 잔류물이 거의 검출되지 않았다. 위의 결과를 정리하였을 때, 펄스 직류 $BCl_3$/He 플라즈마는 GaAs의 식각에서 매우 우수한 공정 결과를 나타내었다.

• The Journal of the Korea Contents Association
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• v.19 no.6
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• pp.1-9
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• 2019

The purpose of this study is to examine the system of the Jeokbyeok-ga's version using the Computer analysis technique of bibliographies and to examine the achievements of the Jeokbyeok-ga's version studies. First, in order to provide basic data for analysis, a raw corpus was constructed for 46 species of Jeokbyeok-ga. Through this, the common narrative units of the Jeokbyeok-ga were identified as 5 layers, and thus 146 individual paragraphs could be extracted. Based on the encoded corpus, we tried to measure the similarity and the distance between the two. Next, we applied the Multidimensional scaling method, Hierarchical cluster analysis and Cladistic analysis method of the system to confirm the distribution of versions group and it was possible to visually grasp the distance between versions and the system of the work. As a result of analyzing Computer analysis technique of bibliographies, it was found that version's group of the Jeokbyeok-ga was divided into a Wanpan(完板) series and Changbon(唱本) series. Also, it was possible to examine the influence relationship between the Pansori's traditions and transmission.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.5
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• pp.235-240
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• 2003

The development of large area GaN substrates is one of important issues in expanding of GaN-based applications. In order to investigate the possibility, GaN thick films were grown by a sublimation technique, using MOCVD-GaN films grown on a sapphire as a seed-crystal substrate and a commercial GaN powder as a source material. The pressure in chamber under the fixed flow rate of $N_2$ gas and $NH_3$ gas was kept at 1 atmosphere and the effects of the various processing parameters such as the distance between source material and seed crystal, the temperature of top- and bottom heater and the growth time during the growth of GaN thick film were investigated. The growth feature and microstructure of the GaN thick films were observed by SEM and XRD. The optical bandgap properties and the defects were evaluated by the PL measurement. By these results, the growth conditions such as the distance between the GaN source and the seed substrate, the growth temperature and the growth time were determined for the satisfied growth of GaN thick films.