• Title/Summary/Keyword: GaP

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InGaN/GaN 양자우물층 위에 제작된 460nm 격자의 GaN 나노박막 광결정 특성

  • Choe Jae-Ho;Kim Geun-Ju
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2006.05a
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    • pp.127-130
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    • 2006
  • 사파이어 기판위에 MOCVD (metal organic chemical vapor deposition)를 이용하여 8주기의 InGaN/GaN 다중양자우물(multiple quantum well : MQW)구조가 성장되어졌고 이 구조 위에 p-GaN층이 형성됐다. 다시 p-GaN 위에 200nm의 두께를 갖는 PMMU 박막을 도포하고 electron beam lithography system을 이용하여 직경이 150nm가 되도록 나노단위의 삼각격자 구조를 가진 구멍을 패턴하고 inductively coupled plasma(ICP)를 이용하여 식각을 하여 광결정을 제작하였다. 광결정은 두께가 26nm이고 격자간격은 460nm로서 파장이 450nm인 파란빛을 나노회절 시켜서 photoluminescence(PL)의 세기를 강화시킨다.

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Stacking-Enabled NPN Heterostructures with GaN Collectors for Bipolar Power Devices

  • Kwangeun Kim
    • Journal of IKEEE
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    • v.28 no.3
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    • pp.360-364
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    • 2024
  • Npn heterostructures with GaN collectors were fabricated using nanomembrane (NM) stacking. N- and p-Si NMs were transfer-printed onto the n-GaN substrates, resulting in the formation of vertical n-Si/p-Si/n-GaN heterostructures. Electrical measurements of Si/Si and Si/GaN pn heterostructures exhibited rectifying properties, indicating that the formation of bipolar junctions was feasible through NM stacking. The energy band diagram of stacking-enabled npn heterostructure was analyzed to explain the rectifying behaviors of base-emitter and collector-base junctions, as well as to suggest potential applications for bipolar junction transistors with a GaN subcollector.

A New Extraction Method of GaAs/InGaP HBT Small-signal Equivalent Circuit Model Parameters (GaAs/InGaP HBT 소신호 등가회로 모델 파라미터의 새로운 추출방법)

  • 이명규;윤경식
    • Proceedings of the IEEK Conference
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    • 2000.11a
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    • pp.357-360
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    • 2000
  • This paper describes a parameter extraction method for HBT(Heterojunction Bipolar Transistor) equivalent circuit model without measurements of special test structures or numerical optimizations. Instead, all equivalent circuit parameters are calculated analytically from small-signal S-parameters measured under different bias conditions. These values being extracted from the cutoff mode can be used to extract intrinsic parameters at the active mode. This method yields a deviation of about 1.3 % between the measured and modeled S-parameters.

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2.4 GHz WLAN InGaP/GaAs Power Amplifier with Temperature Compensation Technique

  • Yoon, Sang-Woong;Kim, Chang-Woo
    • ETRI Journal
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    • v.31 no.5
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    • pp.601-603
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    • 2009
  • This letter presents a high performance 2.4 GHz two-stage power amplifier (PA) operating in the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$ for IEEE 802.11g, wireless local area network application. It is implemented in InGaP/GaAs hetero-junction bipolar transistor technology and has a bias circuit employing a temperature compensation technique for error vector magnitude (EVM) performance. The technique uses a resistor made with a base layer of HBT. The design improves EVM performance in cold temperatures by increasing current. The implemented PA has a dynamic EVM of less than 4%, a gain of over 26 dB, and a current less than 130 mA below the output power of 19 dBm across the temperature range from $-30^{\circ}C$ to $+85^{\circ}C$.

Formation of $P^+-Layer$ in GaAs Using the Open-Tube Diffusion of Zn (Open-Tube에서 Zn확산을 이용한 GaAs에의 $p^+$층 형성)

  • 심규환;강진영;민석기;한철원;최인훈
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.25 no.8
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    • pp.959-965
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    • 1988
  • Zinc diffusion characteristics and its applicabilities have been studied using an open-tube system. Thermal decomposition of arsenide(As) at gallium arsenide(GaAs) wafer surface was well inhibited by using Ga: poly-GaAs: Zn compositon as a diffusion source. Junction depth was obtained as 4.6x10**7\ulcorner exp)-1.25/kT) where activation energy of diffusion was 1.25eV. From Boltzmann-matano analysis, it could be identified that concentration dependencies of Zn diffusivity well consisted with those of kick-out model. The ideality factor of p+-n junction formed by Zn diffusion was about 1.6 and infrared light intensity was linearly varied in the range of sixty folds. It is concluded frodm these results that Zn diffuses according to kick-out model, and open-tube method is applicable to compound semiconductor devices.

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Catalytic Activity of Ga(Ⅲ)-, In(Ⅲ)- and Tl(Ⅲ)-porphyrin Complexes (Ga(Ⅲ), In(Ⅲ) 및 Tl(Ⅲ) 금속이온을 포함한 Metalloporphyrin 착물의 촉매적 특성)

  • Park, Yu Chul;Na, Hun Gil;Kim, Seong Su
    • Journal of the Korean Chemical Society
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    • v.39 no.5
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    • pp.364-370
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    • 1995
  • The catalytic oxidations of several olefins in $CH_2Cl_2$ have been investigated using non-redox metalloporphyrin (M=Ga(III), In(III), Tl(III)) complexes as catalyst and sodium hypochlorite as terminal oxidant. Porphyrins were $(p-CH_3O)TPP,\;(p-CH_3)TPP,\;TPP,\;(p-F)TPP,\;(p-Cl)TPP\;and\;(F_20)TPP$ (TPP=tetraphenylporphyrin), and olefins were $(p-CH_3O)-,\;(p-CH_3)-,\;(p-H)-,\;(p-F)-,\;(p-Cl)-\;and\;(p-Br)styrene$styrene and cyclopentene and cyclohexene. The substrate conversion yield was discussed according to the substituent effects of metalloporphyrin and substrate, and the radius effect of non-redox metal ion. The conversion yield of substrate by changing the substituent of TPP increased in the order of $p-CH_3O$ < $p-CH_3$ < H < p-F < p-Cl, which was consistent with the sequence of $4{\sigma}$ values of TPP. But the substituent effect of substrate on the conversion yield decreased with increasing the ${\sigma}^+$ values on substrates in the order of p-CH3O > p-CH3 > H > p-Cl > p-Br. For the oxidation of several olefins, the complexes of In(III)- and Tl(III)-porphyrins turned out to be more active catalysts than Ga(III)-porphyrin.

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Comparison of the Electrical and Optical Properties in between Transparent ITO and Au Electrodes using Hydrogen-storage Metals as Intermediate Layers (수소저장합금을 이용한 p-GaN ITO 투명전극과 Au 전극과의 특성비교)

  • Chae, Seung-Wan;Kim, Chul-Min;Kim, Eun-Hong;Lee, Byung-Kyu;Shin, Young-Chul;Kim, Tae-Geun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.7
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    • pp.610-614
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    • 2008
  • In this work, the electrical and optical properties of the two different p-type GaN electrode schemes, ZnNi/ITO and ZnNi/Au, were compared each other, and applied to the top-emitting GaN/InGaN light-emitting diodes (LEDs). The ZnNi/ITO electrode showed much higher transmittance (90%) and slightly lower contact resistance $(1.27{\times}10^{-4}{\Omega}cm^2)$ than those (77%, $(2.26{\times}10^{-4}{\Omega}cm^2)$) of the ZnNi/Au at a wavelength of 460 nm. In addition, GaN LEDs having ZnNi/ITO showed accordingly higher light output power and luminous intensity than those having ZnNI/Au did at the current levels up to 1 A.

MATERIALS AND DETECTORS BASED ON GaInAs GROWN BY HYDRIDE VPE TECHNIQUE UTILIQUE UTILIZING A Ga/IN ALLOY SOURCE

  • Park, Chin-Ho;Tiothy J.Anderson
    • Journal of the Korean Vacuum Society
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    • v.4 no.S1
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    • pp.168-173
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    • 1995
  • $GaxIn{1_x}As$ epitaxial layers were grown by a simplified hydrode vapor phase epitaxy(VPE) method bsed on the utilization of Ga/In alloy as the source metal. The effects of a wide range of experimental variables(i.e.,inlet mole fraction of HCI, deposition temperature, Ga/In alloy composition) on the ternary composition and growth rate were investigated. Layers of $Ga_{0.47}In_{0.53}As$ lattice matched to InP were successfully grown from alloys containing 5 to 8 at.% Ga. These layers were used to produce state-of-the art p-i-n photodetectors having the following characteristics: dark current, $I_d$(-5V) = 10-20 nA: responsivity, R=0.84-0.86 A/W; dark current, Id(-5V)=10-20 nA; responsivity, R=0.84-0.86 A/W; capacitance, C=0.88-0.92 pF; breakdown voltage, $V_b$ >40V. This study demonstrated for the first time that a simplified hydride VPE process with a Ga/In alloy source is capable of producing device quality epitaxial layers.

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Design of MMIC Diplexer using Eliptic Function Technique in InGaP/GaAs Process (InGaP/GaAs 화합물 반도체 공정을 이용한 MMIC Diplexer 설계)

  • Cho, Won-Yong;Kim, Nam-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.193-193
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    • 2008
  • In this paper, a MMIC diplexer with a low pass and high pass filter are designed and fabricated using an InGaP/GaAs process. The design of this diplexer is based on its stabilization of the low insertion loss since it is important in the in-building system (IBS). The IBS integrates wire and wireless signal between the cable television (CATV) and the personal communication system. In this design, a dual-mode operation of diplexer is fabricated with the frequency of 0 Hz to 900 MHz and 1.7 GHz to 2.2 GHz for CATV and personal communication. respectively. The topolygy of the designed diplexer is based on the L-C filter. This diplexer fabricated by nanoENS Inc. which is foundry service company, was measured by using the facilities of the Kwangwoon University RFIC center. The fabricated chip size is $1.6\times1.4mm^2$ and it has abroad frequency range from 0 Hz to 2.2 GHz.

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Highly Linear 1 W Power Amplifier MMIC for the 900 MHz Band Using InGaP/GaAs HBT (InGaP/GaAs HBT를 이용한 900 MHz 대역 1 W급 고선형 전력 증폭기 MMIC 설계)

  • Joo, So-Yeon;Han, Su-Yeon;Song, Min-Geun;Kim, Hyung-Chul;Kim, Min-Su;Noh, Sang-Youn;Yoo, Hyung-Mo;Yang, Youn-Goo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.22 no.9
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    • pp.897-903
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    • 2011
  • This paper presents a highly linear power amplifier MMIC, having an output power level of about 1 watt, based on InGaP/GaAs hetero-junction bipolar transistor(HBT) technology for the 900 MHz band. The active bias circuit is applied to minimize the effect of temperature variation. Ballast resistors are optimized to prevent a current collapse and a thermal runaway. The fabricated power amplifier exhibited a gain of 17.6 dB, an output P1dB of 30 dBm, and a PAE of 44.9 % at an output P1dB from the one-tone excitation. It also showed a very high OIP3 of 47.3 dBm at an average output power of 20 dBm from the two-tone excitation.